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F110E227MDLAH1 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
J476 Abstract: 0E128 capacitor j476 8J1234 Decoupling Device for High Frequency Contextual Info: DECOUPLING DEVICE FOR HIGH FREQUENCY F11 Higher Capacitance. Low ESR, High ripple current. Resin-molded Chip. Designed for surface mounting on high density PC board. Load life of 5000 hours at +105°C. Adapted to the RoHS directive 2002/95/EC . Type numbering system (Example : 2.5V 220µF)	Original	2002/95/EC) 120Hz) 180mm 330mm 50MIN. 8100X-1 J476 0E128 capacitor j476 8J1234 Decoupling Device for High Frequency	PDF
0e128 Contextual Info: DECOUPLING DEVICE FOR HIGH FREQUENCY F11 Higher Capacitance. Low ESR, High ripple current. Resin-molded Chip. Designed for surface mounting on high density PC board. Load life of 5000 hours at +105°C. Adapted to the RoHS directive 2002/95/EC . Type numbering system (Example : 2.5V 220µF)	Original	2002/95/EC) 120Hz) F110E227MDLAH1 F110E128MFKAH3 F110G107MDLAH1 F110J476MDLAH1 V-220 V-1200 8100X-1 0e128	PDF
0E128 Abstract: F110E128MFK Contextual Info: DECOUPLING DEVICE FOR HIGH FREQUENCY F11 Higher Capacitance. Low ESR, High ripple current. Resin-molded Chip. Designed for surface mounting on high density PC board. Load life of 1000 hours at +105°C. Adapted to the RoHS directive 2002/95/EC . Specifications	Original	2002/95/EC) 120Hz) 500hours F110E227MDLAH1 F110E128MFKAH3 F110G107MDLAH1 F110J476MDLAH1 V-220 V-100 V-1200 0E128 F110E128MFK	PDF
0E128 Abstract: 8J1234 0220 F110E128MFK F110E227MDL F110E607MFK F110G107MDL F110G807MFK Contextual Info: DECOUPLING DEVICE FOR HIGH FREQUENCY F11 Higher Capacitance. Low ESR, Low ESL,High ripple current. Resin-molded Chip. Designed for surface mounting on high density PC board. Load life of 5000 hours at +105°C. Compliant to the RoHS directive 2002/95/EC .	Original	2002/95/EC) 120Hz) 500hours 300kHz) V-220 V-1200 8100Y 0E128 8J1234 0220 F110E128MFK F110E227MDL F110E607MFK F110G107MDL F110G807MFK	PDF