EXTRUSION HEATSINKS Search Results

Contextual Info: HEATSINKS AH Series HEATSINKS Extrusion Heatsinks F E AT U R E S • Many other extrusion profiles available. Contact Ohmite with your requirements • Multiple finishes available • Modifications available: screw holes, bolt patterns, milling per customer specifications

TO-268

Contextual Info: • Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish • Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum stamped heat sinks on markets • Unique aluminum extrusion

BS138

Abstract: L00524B EN755 L00516D 0S527 extrusion Heatsinks 0SA36 0S509 BS005 heatsink catalogue aavid
Contextual Info: T H E M A X C L I P S YS T E M Clip and Rail Thermal Solutions for Power Semiconductors WWW.AAVIDTHERMALLOY.COM CONTENTS The Max Clip System™ Profiles . 2

1-800-546-APEX

Abstract: Alpha Industries pin diodes TFT250-18 tw03 apex 0/72555
Contextual Info: HEATSINKS, MATING SOCKETS, WASHERS, VENDORS ACCESSORIES INFORMATION M I C R O T E C H N O L O G Y HTTP://WWW.APEXMICROTECH.COM 800 546-APEX (800) 546-2739 RECOMMENDATIONS FOR THERMALLY CONDUCTIVE WASHERS Apex TW03, TW05, and TW10 (which are available from

Wakefield Engineering

Abstract: 647-15ABP AR285
Contextual Info: Wakefield Engineering m Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEATSINKS Labor-Saving SpeedClip Heat Sinks for Vertical Board Mounting 667 S E R IE S Standard P/N Standoff Pin Plain Pin Height Above PC Board “A” in. mm 667-1OABSP A

Redpoint

Abstract: PF527 AV17 PF515 PF523 Scans-00808 3mc-17 j452 AV16 PF516
Contextual Info: redpoint Telephone: 0793 537861 Telex: 449543 Fax: 0793 615396 S PF515 PF516 Heatsink -T 03 Space saving design together with good thermal efficiency. Available in two fin heights. Finish: Black anodised. HEATSINK PERFORM ANCE TYPE 515-516 LOCAL AIR SPEED M/si

LOCTITE 384

Abstract: ECCOBOND 281 melcor 705TC Emerson Cuming tellurex abletherm E629 E710 mastersil
Contextual Info: ATE-A2 Cooling High Density, High Power Pin Electronics TEST AND MEASUREMENT PRODUCTS Overview With IC’s ever-increasing speeds and pin counts, the power density inside Automated Test Equipment is also increasing. Keeping the high-speed pin drivers and other

concord ca 2100

Abstract: fagor 2201 HS01U 104 csk 3554M TFT250-18 FAGOR f 948 Concord Electronics MS04/CAGE
Contextual Info: HEATSINKS, MATING SOCKETS, WASHERS, VENDORS ACCESSORIES INFORMATION M I C R O T E C H N O L O G Y HTTP://WWW.APEXMICROTECH.COM RECOMMENDATIONS FOR THERMALLY CONDUCTIVE WASHERS Apex thermal washers are also available from Power Devices. “Thermstrate” is the material trade name for these

intel Socket 775

Abstract: socket 775 fan intel socket 775
Contextual Info: S YSTIUM M ODEL 10312-00 L OW P ROFILE ACTIVE HEATSINK 38mm The Systium® Model 10312-00 heatsink was created for multiple environments, easy of use, superior cooling and long life. This heatsink is only 38mm high but with a solid copper core allows it to cool processors up to 65W. Most heatsinks have the

Contextual Info: Available Heatsinks Heatsink SEM IPA C K Length* Weight* Cooling mode Them lai resist,ance hea tsink air "Ithha °C /W SK K D 40 F S K M D 4 0 F SK K D 42 F SKM D 42 F SKNO 42 F SK K D 50 E SKND5Û E S K K D 105 F SKM D 105 F S K N D 1 0 5 F S K K D 115 F

to-268

Contextual Info: D Series Heatsinks For SMT devices TO-263 D2 TO-268 (D3) 1.02" 1.22" 25.91mm 31.0mm 0.50" 12.7mm Note: order TO-263 for TO-252 devices 0.27" 6.86mm 0.44" (11.2mm) 0.56" (14.2mm) TO-263 (D2) 0.63" (16.1mm) 0.75" (19.1mm) TO-268 (D3) L a n d P a tt e r n H e a t D i ss i p a t i o n

to-268

Contextual Info: D Series Heatsinks For SMT devices TO-263 D2 TO-268 (D3) 1.02" 1.22" 25.91mm 31.0mm 0.50" 12.7mm Note: order TO-263 for TO-252 devices 0.27" 6.86mm 0.44" (11.2mm) 0.56" (14.2mm) TO-263 (D2) 0.63" (16.1mm) 0.75" (19.1mm) TO-268 (D3) L a n d P a tt e r n TO-263 (D2)

heat exchanger process

Abstract: Ferraz Shawmut R-THETA
Contextual Info: Thermal Management Products Air and liquid cooled heatsinks and cooling solutions for power electronics Solutions to Meet Every Application Ferraz Shawmut is able to exploit a number of cooling technologies air, phase change, and liquid enabling us to meet every need

extrusion Heatsinks

Abstract: R-THETA Ferraz Shawmut SPD Ferraz Shawmut Heatsinks press-pack igbt industrial air cooler fin tube evaporator
Contextual Info: Thermal Management Products Air and liquid cooled heatsinks and cooling solutions for power electronics Solutions to Meet Every Application Ferraz Shawmut is able to exploit a number of cooling technologies air, phase change, and liquid enabling us to meet every need

W4DC105

Abstract: LP 8029 TR C458 w4dc162 W4DC132 NCT200 Thyristor w4dc162 w4dc162 pm W4DA250 w4da105
Contextual Info: Note: The data supplied in the enclosed tables is for general reference only. As data was collected from a number of sources, Richardson Electronics, Ltd. and its affiliates are not liable for its accuracy. Richardson Electronics, Ltd. and its affiliates reserve the right to make changes to the product s or information contained herein without notice. Richardson Electronics makes no warranty, representation or guarantee regarding

PE136627-4371-01F

Abstract: Intel socket 1366 PIN LAYOUT E29477-002 PT44L12-4101 foxconn LGA1366 FOXCONN fan PE136627 Z1ML005001 AVC fans pcie Design guide
Contextual Info: Intel Xeon® Processor 3500 Series Thermal / Mechanical Design Guide March 2009 Document Number: 321461-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

Contextual Info: ADVANCED COOLING METHODS FOR HIGH POWER DENSITY IN ELECTRONIC By Dr. Ing. Cesare CAPRIZ AAVID THERMALLOY Director of European Business Development Via XXV Aprile 32 40057 Cadriano BO – ITALY Phone: +39 051 764011 Fax: +39 051 764090 e-mail: capriz.c@aavid.com

FAGOR f 948

Abstract: SIP12 package pacifitek 56597
Contextual Info: H E A T S IN K S , M A T IN G S O C K E T S , W A S H E R S , V E N D O R S ACCESSORIES INFORMATION A P É X H T T P ://W W W .A P E X M IC R O T E C H .C O M M I C R O T E C H N O L O G Y 800 5 46-A PE X RECOMMENDATIONS FOR THERMALLY Apex therm al washers are also available from Power De­

austerlitz

Abstract: Super-247 Package igbt clip extrusion Heatsinks igbt clip rail 20N-40N
Contextual Info: AN-997 v.Int Mounting Guidelines for the SUPER-247 by Andrew Sawle and Arthur Woodworth Introduction Born from the need to accommodate ever increasing amounts of silicon in smaller, space saving packages, the SUPER-247 now allows the same die sizes that can be put in a much larger TO-264. The SUPER-247

Super-247 Package

Abstract: extrusion mounted clip 20N-40N igbt clip Kool pad igbt clip rail
Contextual Info: Application Note AN-997 Mounting Guidelines for the Super-247 By Andrew Sawle and Arthur Woodworth Table of Contents Page Introduction .1 A Breakdown of System Thermal Resistance .1

Power supply in The air suction fan

Contextual Info: 10/08 PADA ENGINEERING S.r.l. Via G.B. Pirelli 11 I – 61030 Saltara PU - Italy Tel. +39 0721 899555 Fax +39 0721 897064 Email: pada@pada.it Web: www.pada.it SuperPower Developed in 1996 by our R & D, SuperPower is the solution for medium - high power electronic systems

ic marking hs01

Abstract: 1702M apex pa26 fagor f 948
Contextual Info: HEATSINKS, MATING SO C K E T S, W A SH ERS, VENDORS ACCESSORIES INFORMATION HTTP://W WW .APEXMICROTECH.COM 800 RECOMMENDATIONS FOR THERMALLY Apex thermal w ashers are also available from Power De­ vices. “Therm strate" is the material trade name for these

redpoint 50

Abstract: extrusion Heatsinks AN-1000 AN997 AN1000
Contextual Info: Application Note AN-1000 Mounting Guidelines for the SUPER-220 By Andrew Sawle and Arthur Woodworth Table of Contents Page Thermal Resistance and Its Effects on System Performance. 2 Clip Mounting of the Super-220 Package. 3

865GV

Abstract: 865PE 865g Motherboard 865g Motherboard 82865GV GMCH 865P foxconn 865g Intel reflow soldering profile BGA 865PE Intel 865G/865GV/865PE/865P Chipset intel 865gv chipset
Contextual Info: R Intel 865G/865GV/865PE/865P Chipset Thermal Design Guide For the Intel 82865G/82865GV Graphics and Memory Controller Hub GMCH and Intel 82865PE/82865P Memory Controller Hub (MCH) September 2003 Document Number: 252519-002 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR