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    ENTEK HT PLUS Search Results

    ENTEK HT PLUS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    FA2536- Coilcraft Inc PoE Plus magnetics module, SMT, RoHS Visit Coilcraft Inc
    HPF2187L Coilcraft Inc CM choke module for PoE Plus, SMT, RoHS Visit Coilcraft Inc
    HPX212 Coilcraft Inc Isolation transformer module for PoE Plus, SMT, RoHS Visit Coilcraft Inc
    FA2536-AL Coilcraft Inc PoE Plus magnetics module, SMT, RoHS Visit Coilcraft Inc
    HPX2126L Coilcraft Inc Isolation transformer module for PoE Plus, SMT, RoHS Visit Coilcraft Inc

    ENTEK HT PLUS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ipc 610D

    Abstract: IPC-SM-7525A IPC-7525 IPC610D JSTD001D Intel reflow soldering profile BGA IPC-4101B Lead Free reflow soldering profile BGA J-STD-001C IPC-A-610D
    Text: Application Note AN9047 Assembly Guidelines for MicroFET-6 Packaging By Dennis Lang INTRODUCTION The Fairchild MicroFET-6 is a 2mm x 2mm package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related


    Original     		PDF AN9047 IPC-SM-7525A, JESD22-B102D, FPF1007, FPF1008, FPF1009, FPF2140, FPF2142, FPF2143, FPF2144, ipc 610D IPC-SM-7525A IPC-7525 IPC610D JSTD001D Intel reflow soldering profile BGA IPC-4101B Lead Free reflow soldering profile BGA J-STD-001C IPC-A-610D

    ipc 610D

    Abstract: IPC-7525 IPC-SM-7525A J-STD-001C 7525a AN9046 Intel reflow soldering profile BGA voids J-STD-001 IPC-4101B
    Text: Application Note AN9046 Assembly Guidelines for Dual Power56 Packaging By Dennis Lang INTRODUCTION The Fairchild Dual Power56 package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its


    Original     		PDF AN9046 Power56 JESD22-B102D, FDMS9600S, FDMS9620S ipc 610D IPC-7525 IPC-SM-7525A J-STD-001C 7525a AN9046 Intel reflow soldering profile BGA voids J-STD-001 IPC-4101B

    ipc 610D

    Abstract: IPC-SM-7525A entek ht plus AN-9049 j-std-001d JESD22-B102D Fairchild, leadframe materials 100C IPC7525 J-STD-001C
    Text: www.fairchildsemi.com Application Note AN-9049 Assembly Guidelines for Fairchild’s TinyBuck Packaging By Dennis Lang INTRODUCTION BOARD MOUNTING The Fairchild TinyBuck™ package is based on Molded Leadless Packaging MLP technology. This technology


    Original     		PDF AN-9049 FAN2103MPX, FAN2103EMPX, FAN2106MPX, FAN2106EMPX, FAN2106MPX AA3E249, FAN2108MPX, FAN2108EMPX, FAN21SV06MPX, ipc 610D IPC-SM-7525A entek ht plus AN-9049 j-std-001d JESD22-B102D Fairchild, leadframe materials 100C IPC7525 J-STD-001C

    POWER33

    Abstract: IPCA610D sac 305 IPC-SM-7525A J-STD-001C IPC-A-610D IPC-4101B FDMC8554 IPC-7525 FDMC2523P
    Text: AN-9040 Assembly Guidelines for Power33 Packaging By Dennis Lang INTRODUCTION BOARD MOUNTING The Fairchild Power33 uses a flat leaded package to achieve SO-8 type performance in a form factor that is 70% smaller. This packaging technology has been increasingly used for power related


    Original     		PDF AN-9040 Power33 IPC-A-610-D, J-STD-001D, IPC-SM-7525A, JESD22-B102D, FDM3622, FDM6296, FDMC2523P, IPCA610D sac 305 IPC-SM-7525A J-STD-001C IPC-A-610D IPC-4101B FDMC8554 IPC-7525 FDMC2523P

    WLCSP stencil design

    Abstract: 7531A IPC-7531A FDZ191P FPF1003 AN-9045 WLCSP SMT IPC-SM-7525A FPF1004 JESD22-B102D
    Text: Application Note AN-9045 WLCSP Assembly Guidelines By Dennis Lang INTRODUCTION PAD FINISH Wafer level chip scale packaging WLCSP is actually an old packaging technology, likely the oldest finding significant growth today. The technology is valued today for the same reasons it


    Original     		PDF AN-9045 IPC-7531A JESD22-B102D, FPF1003, FPF1004, FDZ191P, FDZ193P WLCSP stencil design 7531A IPC-7531A FDZ191P FPF1003 AN-9045 WLCSP SMT IPC-SM-7525A FPF1004 JESD22-B102D

    IPC-SM-7525A

    Abstract: ipc 610D IPC-7525 J-STD-001C IPC-4101B entek ht plus JSTD001D 7525A smt j-std-001d IPC610D
    Text: AN-9048 Assembly Guidelines for Fairchild’s 6x6 DriverMOS Packaging By Dennis Lang INTRODUCTION The Fairchild 6x6 DriverMOS package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its


    Original     		PDF AN-9048 IPC-A-610-D, J-STD-001D, IPC-SM-7525A, JESD22-B102D, FDMF6700, FDMF6704, FDMF6704A, FDMF6704V, FDMF6730 IPC-SM-7525A ipc 610D IPC-7525 J-STD-001C IPC-4101B entek ht plus JSTD001D 7525A smt j-std-001d IPC610D

    IPC-7525

    Abstract: IPC-SM-7525A FDMF8705 QFN 52 8x8 footprint AN-9037 100C IPC610D JESD22-B102D J-STD-001C IPC-4101B
    Text: AN-9037 Assembly Guidelines for 8x8 MLP DriverMOS Packaging By Dennis Lang INTRODUCTION The Fairchild 8x8 DriverMOS package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its


    Original     		PDF AN-9037 IPC-A-610-D, J-STD-001D, IPC-SM-7525A, JESD22-B102D, FDMF8700, FDMF8704, FDMF8704V, FDMF8705 IPC-7525 IPC-SM-7525A FDMF8705 QFN 52 8x8 footprint AN-9037 100C IPC610D JESD22-B102D J-STD-001C IPC-4101B

    bcm 4330

    Abstract: telemecanique contactor catalogue A5 GNC mosfet philips ecg master replacement guide Elektronikon II keltron electrolytic capacitors PART NO SELEMA DRIVER MOTOR AC 12v dc EIM Basic MK3 lenze 8600 Atlas copco rc universal 60 min
    Text: NEED IT NOW? BUY REMAN! SEE PAGE lxx xx xvi SOLUTIONS, SOLUTIONS. Q A r e q u a l i t y, c o s t , a n d t i m e i m p o r t a n t to you? A ELECTRICAL SOUTH! Q Do you spend too much of your valuable time dealing with too m a n y d i ff e r e n t r e p a i r v e n d o r s ?


    Original     		PDF