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    ipc 610D

    Abstract: IPC-7525 IPC-SM-7525A J-STD-001C 7525a AN9046 Intel reflow soldering profile BGA voids J-STD-001 IPC-4101B
    Text: Application Note AN9046 Assembly Guidelines for Dual Power56 Packaging By Dennis Lang INTRODUCTION The Fairchild Dual Power56 package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its


    Original     		PDF AN9046 Power56 JESD22-B102D, FDMS9600S, FDMS9620S ipc 610D IPC-7525 IPC-SM-7525A J-STD-001C 7525a AN9046 Intel reflow soldering profile BGA voids J-STD-001 IPC-4101B