E28F008 Search Results

E28F00855-1Megx8

Abstract: A1712 AN 5151 28F008S5 EDI7F88MB100S EDI7F88MB120S EDI7F88MB90S
Contextual Info: EDI7F88MB 8Meg x 8 Flash Module FIG. 1 BLOCK DIAGRAM EDI7F88MB 8Mx8 DESCRIPTION The EDI7F88MB is organized as a 8Mx8 Flash module. The module is based on Intel's E28F00855-1Megx8 Flash device in a TSOP package which is mounted on an FR4 substrate. A0-A9 W

Contextual Info: EDI7F88MB 8Megx8 8Megx8 Flash Module The EDI7F88MB is organized as a 8Mx8 Flash module. The module is based on Intel's E28F008551Megx8 Flash device in a TSOP package which is mounted on an FR4 substrate. Block Diagrams EDI7F88MB 8Megx8 The module offers access times between 90 and

Flash SIMM 80

Abstract: E28F008SA EDI7F341MC 80pin-SIMM SIMM 80 jedec
Contextual Info: EDI7F341MC White Electronic Designs 1Mx32 FLASH MODULE FIG. 1 DESCRIPTION BLOCK DIAGRAMS The EDI7F341MC and EDI7F2341MC are organized as one and two banks of 1Mx32 respectively. The modules are based on Intel's E28F008SA - 1Mx8 Flash device in TSOP packages

1mx8

Abstract: E28F008SA EDI7F4341MC
Contextual Info: EDI7F4341MC 4x1Mx32 FLASH MODULE FEATURES DESCRIPTION n 4x1Mx32 The EDI7F4341MC is organized as four banks of 1Mx32. The module is based on Intel's E28F008SA - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. n Based on Intel's E28F008SA Flash Device

Contextual Info: CIC-40TS-40D-F6-YAM-S 40-Lead TSOP to a 40-Pin DIP 7/97 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: E28F004B3 E28F008B3 E28F016B3 SOCKET: BASE 40-Pin DIP PIN NAMES SOCKET 40-Lead TSOP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27

Contextual Info: w o EDI7F88MB \ 8M egx8 ELECTRONIC DESIGNS, INC. 8Megx8 Flash Module Block Diagrams The EDI7F88MB is organized as a 8Mx8 Flash module. The module is based on Intel's E28F008551Megx8 Flash device in a TSOP package which is mounted on an FR4 substrate. EDI7F88MB

Contextual Info: CIC-40TS-40D-F6-YAM-S 40-Lead TSOP to a 40-Pin DIP 9/97 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: E28F004B3 E28F008B3 E28F016B3 SOCKET: BASE 40-Pin DIP PIN NAMES SOCKET 40-Lead TSOP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27

SIMM 80 jedec

Abstract: E28F008SA EDI7F341MC
Contextual Info: EDI7F341MC White Electronic 1Mx32 FLASH MODULE FIG. 1 DESCRIPTION BLOCK DIAGRAMS The EDI7F341MC and EDI7F2341MC are organized as one and two banks of 1Mx32 respectively. The modules are based on Intel's E28F008SA - 1Mx8 Flash device in TSOP packages which are mounted on a FR4 substrate.

1mx8

Abstract: E28F008S3 EDI7F4341MV
Contextual Info: EDI7F4341MV White Electronic Designs 4x1Mx32 FLASH MODULE FEATURES DESCRIPTION  4 x1Mx32 The EDI7F4341MV is organized as four banks of 1Mx32. The module is based on Intel's E28F008S3 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.

e28f008

Contextual Info: EDI7F341MC 1 MEG x 32 FLASH MODULE FIG. 1 DESCRIPTION BLOCK DIAGRAMS The EDI7F341MC and EDI7F2341MC are organized as one and two banks of 1 Meg x 32 respectively. The modules are based on Intel's E28F008SA - 1Meg x 8 Flash device in TSOP packages which are mounted on an FR4 substrate.

Contextual Info: EDI7F4341MC White Electronic Designs 4x1Mx32 FLASH MODULE FEATURES  4x1Mx32  Based on Intel's E28F008SA Flash Device  Fast Read Access Time - 90ns  5V - Only Reprogramming  Low Power Dissipation DESCRIPTION The EDI7F4341MC is organized as four banks of 1Mx32.

Contextual Info: EDI7F4341MV White Electronic 4x1Mx32 FLASH MODULE FEATURES DESCRIPTION „ 4 x1Mx32 The EDI7F4341MV is organized as four banks of 1Mx32. The module is based on Intel's E28F008S3 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. „ Based on Intel's E28F008S3 Flash Device

Contextual Info: ^EDI EDI7F34IMZ 1Megx32 ELECTRONIC DESIGNS, INC 1Megx32 Flash Module Block Diagrams The EDI7F34IMZ and EDI7F2341MZ are orga­ nized as one and two banks of 1 Meg x 32 respec­ tively. The modules are based on Intel's E28F008SA - 1Megx8 Flash device in TSOP packages which

E28F008SA

Abstract: EDI7F341MC
Contextual Info: EDI7F341MC 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F341MC and EDI7F2341MC are organized as one and two banks of 1Mx32 respectively. The modules are based on Intel's E28F008SA - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.

1mx8

Abstract: E28F008SA EDI7F341MC
Contextual Info: EDI7F341MC 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F341MC and EDI7F2341MC are organized as one and two banks of 1Mx32 respectively. The modules are based on Intel's E28F008SA - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.

1mx8

Abstract: EDI7F4341MV E28F008S3
Contextual Info: EDI7F4341MV 4 x 1 MEG x 32 FLASH MODULE FEATURES DESCRIPTION • 4 x 1 Meg x 32 The EDI7F4341MV is organized as four banks of 1 Meg x 32. The module is based on Intel's E28F008S3 - 1 Meg x 8 Flash device in TSOP packages which are mounted on an FR4 substrate.

E28F00SA

Abstract: E28F008SA
Contextual Info: EDI7F34IMZ 1Megx32 1Megx32 Flash Module The EDI7F34IMZ and EDI7F2341MZ are organized as one and two banks of 1 Meg x 32 respectively. The modules are based on Intel's E28F008SA - 1Megx8 Flash device in TSOP packages which are mounted on an FR4 substrate. Both modules offer access times between 90 and

Contextual Info: CIC-40TS-40D-B6-YAM-S REV 2 40-Lead TSOP to a 40-Pin DIP 7/97 (EXAMPLES) TSOP DEVICES: PIN CONFIGURATION: BASE 40-Pin DIP E28F002BC / BL / BV / BX E28F004BE / BL / BV / BX E28F008BE / BV (TE extended temp range) SOCKET: Yamaichi IC191-0402-002N PRICING:

E28F008SA-120

Abstract: gold capacitor E28F008SA-85 80 pin simm flash E28F008SA edge connector 22 pin 28F008SA
Contextual Info: SL29041-xxx1VI 1M X 32 Bits Flash Memory Module 5V Supply; 12V Program FEATURES GENERAL DESCRIPTION Access Time of 90 and120ns 1 TTL compatible inputs and outputs 5V VCC and 12V VPP JEDEC standard Tin or Gold edge connectors 1 Intel Part Number E28F008SA-85, E28F008SA-120 flash

1mx8

Abstract: E28F008SA EDI7F4341MC A1359
Contextual Info: EDI7F4341MC White Electronic 4x1Mx32 FLASH MODULE FEATURES DESCRIPTION „ 4x1Mx32 „ Based on Intel's E28F008SA Flash Device „ Fast Read Access Time - 90ns „ 5V - Only Reprogramming „ Low Power Dissipation The EDI7F4341MC is organized as four banks of 1Mx32.

CIC-40TS-40D-A6-YAM-S

Abstract: E28F016Sc E28F008SA a6ya
Contextual Info: CIC-40TS-40D-A6-YAM-S Rev 2 40-Lead TSOP to a 40-Pin DIP 9/97 (EXAMPLES) TSOP DEVICES: PIN CONFIGURATION: E28F004SC / S3 / S5 E28F008SA / SA-L / SC / S3 / S5 E28F016SC / S3 / S5 SOCKET: Yamaichi IC191-0402-002N PRICING: QTY PRICE EACH 1-4 5-9 10-24 25-49

Contextual Info: I P ^ iU ö Ä Ä f in te i 28F008SA 8-MBIT 1-MBIT x 8 F la s h F ile T M MEMORY Extended Temperature Specifications Included High-Density Symmetrically Blocked Architecture — Sixteen 64-Kbyte Blocks Very High-Performance Read — 85 ns Maximum Access Time

Contextual Info: int ! PRELIMINARY BYTE-WIDE SMART 5 FlashFile MEMORY FAMILY 4, 8, AND 16 MBIT 28F004S5, 28F008S5, 28F016S5 Includes Commercial and Extended Temperature Specifications SmartVoltage Technology — Smart 5 Flash: 5 V Vcc and 5 V or 12 V V p p High-Performance

Contextual Info: PRODUCT PREVIEW BYTE-WIDE SMART 3 FlashFile MEMORY FAMILY 4, 8, AND 16 MBIT 28F004S3, 28F008S3, 28F016S3 Includes Commercial and Extended Temperature Specifications • SmartVoltage Technology — Smart 3 Flash: 2.7V Read-Only or 3.3V Vcc and 3.3V or 12V VPP