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    DS740 Price and Stock

    Brother International DS740D

    DS740D- DUPLEX MOBILE SCANNER WITH DESKTOP SAVING DESIGN UP TO 16 PPM
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    NAC DS740D 29 1
    • 1 $201.36
    • 10 $201.36
    • 100 $201.36
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    Neutron USA DS740D 50
    • 1 $224.99
    • 10 $224.99
    • 100 $224.99
    • 1000 $224.99
    • 10000 $224.99
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    Brother International DS-740D

    DS-740D MOBILE SCANNER
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    NAC DS-740D 4 1
    • 1 $201.81
    • 10 $201.81
    • 100 $201.81
    • 1000 $201.81
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    Signlent Technologies SDS7404A H12

    Siglent SDS7404A H12 Digital Oscilloscope, 4 CH, 4 GHz, 500 Mpts, 20 GS/s, 12 bit, SDS7000A Series
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TestEquity LLC SDS7404A H12
    • 1 $26880
    • 10 $26880
    • 100 $26880
    • 1000 $26880
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    DS740 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    DS 7408 Samsung Electronics Original PDF
    DS 7409 Samsung Electronics Original PDF

    DS740 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MDIO clause 45 specification

    Abstract: xaui marvell "reduced xaui" dune Marvell PHY Xilinx virtex rxaui marvell XGXS Marvell design guide marvell ethernet PHY transceivers Marvell PHY register map DS740
    Text: LogiCORE IP RXAUI v2.3 DS740 April 24, 2012 Product Specification Introduction LogiCORE IP Facts Table The LogiCORE IP RXAUI core is a high-performance, low pin count 10 Gb/s interface intended to allow physical separation between the data-link layer and


    Original     		PDF DS740 MDIO clause 45 specification xaui marvell "reduced xaui" dune Marvell PHY Xilinx virtex rxaui marvell XGXS Marvell design guide marvell ethernet PHY transceivers Marvell PHY register map

    mil-std 883d

    Abstract: CAS140B k9 diode Keithley 2400 mil-std-202f Mil-Std-883D 0603LGCT SN60 DS74
    Text: SURFACE MOUNT DEVICE LED Part No. : 0603LGCT REV:A / 01 PACKAGE OUTLINE DIMENSIONS Notes: 1. All dimensions are in millimeters. 2. Tolerance is ± 0.1mm .004" unless otherwise noted. Features Top view, wide view angle, single color Chip LED. Package in 8mm tape on 7" diameter reels.


    Original     		PDF 0603LGCT DS-74-03-0008 MIL-STD-202F MIL-STD-750D MIL-STD-883D 10mins mil-std 883d CAS140B k9 diode Keithley 2400 0603LGCT SN60 DS74

    E700G

    Abstract: No abstract text available
    Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF DS577G E700G

    DS7409HGB

    Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
    Text: Data Sheet LAMINATE FlipStack CSP Features FlipStack® CSP The FlipStack CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of


    Original     		PDF DS820C DS7409HGB DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G

    AD 469

    Abstract: SN60 AD469 471ad
    Text: SURFACE MOUNT DEVICE LED Part No. : 0603JBCT REV:A / 03 PACKAGE OUTLINE DIMENSIONS Notes: 1. All dimensions are in millimeters. 2. Tolerance is ± 0.1mm .004" unless otherwise noted. Features Top view, wide view angle, single color Chip LED. Package in 8mm tape on 7" diameter reels.


    Original     		PDF 0603JBCT DS-74-03-0008 0603JCT MIL-STD-202F MIL-STD-750D MIL-STD-883D 10mins AD 469 SN60 AD469 471ad

    L-C191LBCT

    Abstract: AD 469 high power infrared led AD469 0603LBCT SN60 DS-74-03-0008 LC191
    Text: SURFACE MOUNT DEVICE LED Part No. : 0603LBCT REV:A / 03 PACKAGE OUTLINE DIMENSIONS Notes: 1. All dimensions are in millimeters. 2. Tolerance is ± 0.1mm .004" unless otherwise noted. Features Top view, wide view angle, single color Chip LED. Package in 8mm tape on 7" diameter reels.


    Original     		PDF 0603LBCT DS-74-03-0008 MIL-STD-202F MIL-STD-750D MIL-STD-883D 10mins L-C191LBCT AD 469 high power infrared led AD469 0603LBCT SN60 DS-74-03-0008 LC191

    EN4900GC

    Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
    Text: PCN No: PCN1-110704 Qualification of selected products at additional assembly and test sites Initial Change Notification Date: 7/04/2011 This is an initial announcement of change to a device that is currently offered by Energy Micro. The details of this change are on the following pages.


    Original     		PDF PCN1-110704 EFM32G890F128 J-STD-020D, JESD22-A113 JESD22-A104 C/125 JESD22-A103 JESD22-A102 JESD22-A110 EN4900GC NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG

    HL832N

    Abstract: ELC4785 E679 DS7409 MO-298 amkor flip Amkor Technology HL832 MO-192 MO-195
    Text: LAMINATE data sheet FlipStack CSP FlipStack® CSP: The FlipStack® CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment


    Original     		PDF

    cu pillar

    Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF

    HL832N

    Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF

    Keithley 2400

    Abstract: SN60
    Text: SURFACE MOUNT DEVICE LED Part No. : 0603KRCT REV:A / 03 PACKAGE OUTLINE DIMENSIONS Notes: 1. All dimensions are in millimeters. 2. Tolerance is ± 0.1mm .004" unless otherwise noted. Features Top view, wide view angle, single color Chip LED. Package in 8mm tape on 7" diameter reels.


    Original     		PDF 0603KRCT DS-74-03-0007 MIL-STD-202F MIL-STD-750D MIL-STD-883D 10mins Keithley 2400 SN60

    JIS for humidity test for touch screen

    Abstract: Keithley 2400 light sensor 3 bin mil-std-202f method 208d 0603LWCT SN60 CAS140B DS-75-04-0012 555 "Application Note" led power
    Text: SURFACE MOUNT DEVICE LED Part No. : 0603LWCT Features Extra thin 0.4mm, Top view, Wide view angle, Bluish White color SMD chip LED . Special for Cellular Phone keypad / LCD backlighting or thin touch button LED backlighting. Packing in 8mm tape on 7" diameter reels.


    Original     		PDF 0603LWCT ANSI/EIA-481-B-2001) DS-75-04-0012 DEVICE00 MIL-STD-202F MIL-STD-750D MIL-STD-883D JIS for humidity test for touch screen Keithley 2400 light sensor 3 bin mil-std-202f method 208d 0603LWCT SN60 CAS140B DS-75-04-0012 555 "Application Note" led power