DPDD32MX4RSAY5 Search Results

Contextual Info: 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 PRELIMINARY PIN-OUT DIAGRAM DESCRIPTION: The is a Dense-Pac core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the LP-Stack family which applies the Dense-Pac technology to create a 128Mb

Contextual Info: ADVANCE D COM P ON E NTS PACKAG I NG 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 DESCRIPTION: The LP-Stack is DPAC core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the Memory Stack™ family which applies the DPAC technology to create a 128Mb Double Data Rate DDR SDRAM

Contextual Info: 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 PRELIMINARY PIN-OUT DIAGRAM DESCRIPTION: The is a Dense-Pac core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the LP-Stack family which applies the Dense-Pac technology to create a 128Mb

Contextual Info: ADVANCE D COM P ON E NTS PACKAG I NG 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 DESCRIPTION: The LP-Stack is DPAC core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the Memory Stack™ family which applies the DPAC technology to create a 128Mb Double Data Rate DDR SDRAM

Contextual Info: ADVANCE D COM P ON E NTS PACKAG I NG 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 DESCRIPTION: FEATURES: • Electrical characteristics meet semiconductor manufacturers’ datasheet • Memory organization: 2 64Mb memory devices. Each device arranged as 16M x 4 bits (4M x 4 bits x 4 banks)

Contextual Info: M t n t» DENSE-PAC MICROSYSTEMS "7\ /H-Dênsus a ^ 128 Aa dpdd32mx4riay5 Megabit CM OS DDR SDRAM High Density Memory Device d pd d 32 m X 4 R S A Y 5 ADVANCED INFORMATION DESCRIPTION: Jhe/k-'D eH JH j series is a family of interchangeable memory devices.