DO1N Search Results

PHA1 MARKING

Abstract: OC48 STM-16 DO13 package 330nF capacitor
Contextual Info: 2.5 Gbit/s Transponder Chip Set with Digital “Wrapping” GD16556/GD16557* Preliminary General Description Features The GD16556 and GD16557 constitute a high performance multi-bitrate transponder chip set designed for Optical Network applications. The devices are

SDS4 C1

Abstract: TLE8110 sds relays SDS4 A6901 Lambda LN
Contextual Info: TLE 8110 EE Smart Multichannel Low Side Switch with Parallel Control and SPI Interface coreFLEX TLE8110EE Data Sheet Rev. 1.3.1, 2011-05-26 Automotive Power TLE 8110 EE Smart Multichannel Switch Table of Content Table of Content 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

GD16578

Abstract: OC48 STM-16
Contextual Info: 2.5 Gbit/s Transponder Chip Set with Digital “Wrapping” GD16556/GD16557* an Intel company Preliminary General Description Features The GD16556 and GD16557 constitute a high performance multi-bitrate transponder chip set designed for Optical Network applications. The devices are

gd16054

Abstract: GD16131 GD16554 GD-16054 GD16132-GLP GD16132 GIGA GD16554 GD160 GD16131GLP GD16131-GLP
Contextual Info: 622 Mbit/s MUX/DeMUX Chip Set GD16131/GD16132 General Description Features The GD16131, 32:4 / Quad 8:1 MUX and the GD16132, 4:32 / Quad 1:8 DeMUX are intended for use in 2.5 Gbit/s transmission systems. The high-speed interface is designed to accommodate the

10gd1

Abstract: OC48 STM-16 GD16556-100BA 322581 regenerator 3R
Contextual Info: 2.5 Gbit/s Transponder Chip Set with Digital “Wrapping” GD16556/GD16557* an Intel company Preliminary General Description Features The GD16556 and GD16557 constitute a high performance multi-bitrate transponder chip set designed for Optical Network applications. The devices are

Contextual Info: OBSOLETE PRODUCT HMC670LC3C v02.1209 HIGH SPEED LOGIC - SMT 13 Gbps, 1:2 FANOUT BUFFER Typical Applications Features The HMC670LC3C is ideal for: Inputs Terminated Internally in 50 Ohms • RF ATE Applications Differential Inputs are DC Coupled • Broadband Test & Measurement

Contextual Info: Motors | Automation | Energy | Transmission & Distribution | Coatings Frequency Inverter MW500 User's Manual User’s Manual Series: MW500 Language: English Document Nº: 10002218015 / 01 Publishing Date: 02/2015 Summary of Reviews The information below describes the reviews made in this manual.

CDM4

Abstract: SDS4 C1 "Stepper Motors" 1.8 2V 1.45A 5MIO SDS4 TLE8110 PG-DSO-36-41 "Lambda Sensor" dso-36-41 sds relays
Contextual Info: Data Sheet, Rev. 1.0, June 2009 TLE8110EE Smart Multichannel Low Side Switch with Parallel Control and SPI Interface coreFLEX Automotive Power FLEX Smart Multi-Channel Switch 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

VSC716

Contextual Info: VSC7166 Data Sheet FEATURES ● OC-192 SONET Frame Transport Mechanisms ● Channel-to-Channel Deskewing in Receiver ● Converts Sixteen LVDS Inputs at 622Mb/s into Twelve 8B/10B Encoded LVDS Outputs at 1.244Gb/s ● Redundant Channel for Fault Tolerance

Contextual Info: HMC670LC3C v00.1207 13 Gbps, 1:2 Fanout Buffer Typical Applications Features The HMC670LC3C is ideal for: Inputs Terminated Internally in 50 Ohms • RF ATE Applications Differential Inputs are DC Coupled • Broadband Test & Measurement Propagation Delay: 55 ps

POR25K08SFPX

Abstract: POT25K08SFPX
Contextual Info: Optobahn Corporation/NGK Insulators 1/6 DATA SHEETS 2.5Gb/s 8ch SINGLE MODE PARALLEL OPTICAL INTERCONNECT GENERAL DESCRIPTIONS AND MAXIMUM RATINGS Table 1. General Descriptions Parameters Part Number Number of Channels Type of Optical Fiber Optical Connector

HMC670-LC3C

Abstract: HMC670LC3C N4901B
Contextual Info: HMC670LC3C v02.1209 13 Gbps, 1:2 Fanout Buffer HIGH SPEED LOGIC - SMT 7 Typical Applications Features The HMC670LC3C is ideal for: Inputs Terminated Internally in 50 Ohms • RF ATE Applications Differential Inputs are DC Coupled • Broadband Test & Measurement

Contextual Info: 9 x 3 0 x x [ 133H S - x - x x Z 0 0 S -0 L -Z x - x x - x x L A V d g - w d i ON -A 9 \LLZ\ \LLZ\ \LLZ\ \LL~Z\ V/N V/N V/N [Z6 I-] [Z6 I-] [Z6" L] [Z6" l] 9M a d Z N O d a d O H d S O H d n V N IL A / d d l

sck 054

Abstract: diagram HANNSTAR k mv SB824 Wistron Corporation PCI7412 BCM4401E S 2-H11 BT 342 project hannstar HD64F2111BV-C
Contextual Info: A B C AG1 Block Diagram Mobile CPU CLK GEN. 4 Yonah 478 Celeron M ICS954305D IDT CV155 3 D Project code: 91.4A901.001 PCB P/N : 55.4A903.XXX REVISION : 05225-1 (Hannstar, GCE) G792 19 400/533/667MHz 533/667MHz 533/667 MHz DDR2 14 CRT DCBATOUT 1D8V_S3 S TPS51100

Contextual Info: HMC670LC3C v00.1207 13 Gbps, 1:2 Fanout Buffer HIGH SPEED LOGIC - SMT 7 Typical Applications Features The HMC670LC3C is ideal for: Inputs Terminated Internally in 50 Ohms • RF ATE Applications Differential Inputs are DC Coupled • Broadband Test & Measurement

POT10K08SFPX

Abstract: do1n POR10K08SFPX Optobahn
Contextual Info: Optobahn Corporation/NGK Insulators 1/6 DATA SHEET 1.25Gb/s 8ch SINGLE MODE PARALLEL OPTICAL INTERCONNECT GENERAL DESCRIPTIONS AND MAXIMUM RATINGS Table 1. General Descriptions Parameters Part Number Number of Channels Type of Optical Fiber Optical Connector

POT10K08MFPX

Abstract: POR10K08MFPX
Contextual Info: Optobahn Corporation/NGK Insulators 1/6 DATA SHEET 1.25Gb/s 8ch MULTIMODE PARALLEL OPTICAL INTERCONNECT GENERAL DESCRIPTIONS AND MAXIMUM RATINGS Table 1. General Descriptions Parameters Part Number Number of Channels Type of Optical Fiber Optical Connector

10gd1

Abstract: GD16578 DO14 OC48 STM-16 bang bang phase detector GD16556-100BA 322581
Contextual Info: 2.5 Gbit/s Transponder Chip Set with Digital “Wrapping” GD16556/GD16557* an Intel company Preliminary General Description Features The GD16556 and GD16557 constitute a high performance multi-bitrate transponder chip set designed for Optical Network applications. The devices are