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Catalog Datasheet	MFG & Type	PDF	Document Tags
TI date code Abstract: No abstract text available Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C3 JUN '00 25568 0011 Carsem S DM941230AG	Original	PDF	DM941230AG DM941226AA DS2502 DM941226AA DM941230AG TI date code
DALLAS DS80C320 Abstract: 25863 Text: RELIABILITY MONITOR DS1232L JAN '00 Monitor DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1232 C2-L 150 9948 PROCESS Single Poly, Single Metal DK933191AAJ 8 SOIC ATP Anam, PI 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7	Original	PDF	DS1232L DS1232 DK933191AAJ HRS87C520 DS87C520 DE013425AAD J-STD-020 30C/60% DALLAS DS80C320 25863
Untitled Abstract: No abstract text available Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY READ POINT QTY FAILS LOT NO. PACKAGE DS2502 C3 MAR '00 25253 0005 Carsem S DM941226AA	Original	PDF	DM941226AA DM941230AG DS2502 DM941230AG DM941226AA
DS-1000 Abstract: DS1302 DIE REVISION DH020 ds1000m-100 25409 Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%	Original	PDF	DS1000M-100 DS1000 DH927108AJC J-STD-020 30C/60% DS-1000 DS1302 DIE REVISION DH020 25409
dallas date code ds1230 Abstract: dallas ds1230 25919 DS1230 Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 DE940040AAC SOIC A7 MAR '00 25224 9950 OSEP PACKAGE READ POINT QTY FAIL 50 50 RELIABILITY MONITOR STRESS:	Original	PDF	DS1621 DE940040AAC DS5002 DS87C520 DM925587AAF DK935356AAB DK933191AAJ DE952427AAD DE014522ADB dallas date code ds1230 dallas ds1230 25919 DS1230
dallas date code ds1230 Abstract: dallas date code dallas ds1230 code 25807 Text: RELIABILITY MONITOR STRESS: VAPOR PHASE REFLOW CONDITIONS: 217C MONITOR DATE ASSEMBLY DATE PRODUCT REV JOB NO CODE FACILITY LOT NO. DS5002 C4 PACKAGE READ POINT QTY FAIL APR '00 25428 0004 Carsem DM925587AAF MQFP 3 203 DS87C520 A14 NOV '99 24798 9931 ATK Anam, K	Original	PDF	DS5002 DS87C520 DM925587AAF DN901118AAB DK935356AAB J-STD-020 DM929359AB DS1232 DS1233 dallas date code ds1230 dallas date code dallas ds1230 code 25807
25821 Abstract: dallas date code ds12887 25854 Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 MAR '00 25224 9950 OSEP DE940040AAC SOIC 50 50 DS1869 A3 JUN '00 25547 0017 CPS ChipPac, China DH833210AAB SOIC	Original	PDF	DS1621 DS1869 DE940040AAC DH833210AAB DS2181A DS5002 DE004552ABD DN012259AAL DN028766AAD 25821 dallas date code ds12887 25854
997E-07 Abstract: No abstract text available Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS21352 A4 DK031452AB LQFP STRESS: HIGH VOLTAGE LIFE MONITOR DATE ASSEMBLY	Original	PDF	DK031452AB DS21352 DM941230AG DN041061AAE DK007198AAF DK016058AA DK016058AA DS2108 997E-07
25804 Abstract: No abstract text available Text: RELIABILITY MONITOR DS1000Z-25 OCT '00 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 150x1.4 OSEP 0033 PROCESS Single Poly, Single Metal DE009456ACE 8 SOIC 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1	Original	PDF	DS1000Z-25 DS1000 DE009456ACE 150x1 DS87C520 DE029195AAB 650x65 25804