DIP32 PACKAGE Search Results

Contextual Info: DIP32-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 4.70 TYP. 3/Dec. 11, 1996

DIP32

Abstract: dip32 package
Contextual Info: PACKAGE DIMENSIONS DIP32 41.9 ± 0.3 17 1 16 14.0 ± 0.3 32 1.27 2.54 GD-D03201H-2 Ver.2004-03-10 15.24 3.3 4.83M AX 0.45 ± 0.1 0.64M IN 1.91 0 to 15° 0.25 ± 0.13 UNIT : mm

dip32 package

Abstract: DIP32
Contextual Info: SANYO Semiconductor Dual In-line Package 32Pin Plastic DIP32 600mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

DIP32

Abstract: diode databook dip32 package
Contextual Info: DIP32-P-600-2.54 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

Contextual Info: Adapters - Phyton, Inc. Page 1 of 2 Device Programmers and Development Tools for Microcontrollers Home Quick Links Help Desk Downloads All Programmers Products E-Shop Support Contact News Site Map AE-Q32U DIP32/QFP32 universal adapter. Device Search Description:

Contextual Info: AE-TS32W Page 1 of 2 AE-TS32W DIP32/TSOP32 specialized adapter for Flash memory. Device package dimensions: 8 x 20 mm, 0.5 mm pitch. Click the programmer model below to get an appropriate list of the devices supported by the adapter: z z z ChipProg+ ChipProg-40

DIP32

Abstract: LC33864M LC33864P LC33864P-80 en4701 EN4701A
Contextual Info: Ordering number : EN4701A CMOS LSI LC33864P-80, M-70/80/10 512 K 65536 words x 8 bits Pseudo-SRAM Overview Package Dimensions The LC33864 series is com posed o f pseudo static RAM unit: mm that operate on a single 5 V pow er supply and is organized 3192-DIP32

DIP32-P-400-2

Abstract: DIP32-P-400
Contextual Info: 32P4F Plastic 32pin 400mil DIP Weight g 3.24 Lead Material Alloy 42 17 1 16 E 32 c JEDEC Code – e1 EIAJ Package Code DIP32-P-400-2.54 Symbol L A1 A A2 D e SEATING PLANE b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.08

32P4

Abstract: JEDEC 600Mil dip
Contextual Info: 32P4 Plastic 32pin 600mil DIP JEDEC Code – Lead Material Alloy 42 17 1 16 E 32 e1 c EIAJ Package Code DIP32-P-600-2.54 Weight g 4.08 D L A1 A A2 Symbol SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.1 0.51

sot201

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane DIP32: plastic dual in-line package; 32 leads 600 mil SOT201-1 ME D A2 L A A1 c e Z (e 1) w M b1 MH b 17 32 pin 1 index E 1 16 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Contextual Info: 32P4Y Plastic 32pin 300mil DIP 17 1 16 E 32 c JEDEC Code – Lead Material Alloy 42 e1 EIAJ Package Code DIP32-P-300-2.54 Weight g Symbol L A1 A A2 D SEATING PLANE e b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 4.75 0.51

JEDEC 600Mil dip

Abstract: "lead material" DIP 32P4
Contextual Info: EIAJ Package Code DIP32-P-600-2.54 32P4 e b 16 1 D 17 Lead Material Alloy 42 32 JEDEC Code – Weight g 4.08 SEATING PLANE b1 A L E A2 A1 A A1 A2 b b1 c D E e e1 L Symbol Plastic 32pin 600mil DIP c Mar.’98 Dimension in Millimeters Min Nom Max – – 5.1

SOT201

Abstract: DIP32 package DIP32
Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane DIP32: plastic dual in-line package; 32 leads 600 mil SOT201-1 ME D A2 L A A1 c e Z (e 1) w M b1 MH b 17 32 pin 1 index E 1 16 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

DIP32

Contextual Info: SANYO Semiconductor Dual In-line Package 32Pin Plastic DIP32 600mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

USB "DALI bridge"

Abstract: ST7FLITE09Y0B6 inDART ST72334N4 ST7FLITE29F2B6 ST7FLITE05Y0B6 ST7MDT20M-EPB hid usb circuit board dvp 336 ST7C334-INDART
Contextual Info: BACK NEXT MCU / MPU STMICROELECTRONICS Current 8-Bit Microcontrollers DIP-16 DIP-20 DIP-20 STMicroelectronics CURRENT STANDARD 8-BIT MICROCONTROLLERS cont. Abbreviations: ST7 Industry Standard Fast Core Architecture 8-Bit • • • Fast multiplication: 11 cycles or 1.37 µsecs for 8 x 8 bits (16-bit result).

Contextual Info: ¡Ordering number : ENi%5093A CMOS LSI No. * 5093A SA%YO LC378200PP, PM-10/LC378200PP, PM-20LV 8 MEG 1048576 words x 8 bits Mask ROM Internal Clocked Silicon Gate Preliminary Package Dimensions Overview The LC378200PP, PM-10 and LC378200PP, PM-20LV are 8388608-bit M ask Program m able Read Only

em78p372nso14j

Abstract: em78p372 EM78P259ND18J EM78P259NS EM78P153SP EM78P372N EM78P153SN EM78P374 IC51-0644-1972 EM78F661NA
Contextual Info: UWTR EM78 series USB writer UWTR v1.05.09 support body list 1 Support body sort by Body : (The Red line is update for v1.05.09) IC body Supporting Devices Package Type Package UWTR ADPNum UWTR SMD socket number Textool Part number EM78F541N EM78F541NAD16

Contextual Info: [Ordering number: EN %5092A CMOS LSI No.S*i5092A SAMYÖ LC374200RP, RM-10/LC374200RP, RM-20LV 4 MEG 524288 words x 8 bits Mask ROM Internal Clocked Silicon Gate Preliminary Overview Package Dimensions The LC374200RP, RM-10 and LC374200RP, RM-20LV are 4194304-bit M ask Program m able R ead Only

HMU 1

Contextual Info: ¡Ordering number : EN%; 5090A | CMOS LSI No. X 5090A SAXYO LC378100PP, PM-10/LC3781OOPP, PM-20LV 8 MEG 1048576 words x 8 bits Mask ROM Internal Clocked Silicon Gate Preliminary Overview Package Dimensions The LC3781 OOPP, PM-10 and LC378100PP, PM-20LV a re 8 3 8 8 6 0 8 -b it M ask P ro g ra m m a b le R ead O nly

marking Sanyo

Abstract: M 3211 TSOP44 M 3211 A
Contextual Info: MEMORY P A C K A G E D IM EN SIO N S 0A11 of Sanyo Memory package dimensions are illustrated below. #A11 dimensions are in mm, and dimensions which are not followed by min. or max. are represented by typical values. •N o marking is indicated. Package Dimensions 3192 unit : mm

Winslow ADAPTICs

Abstract: DIP40 PIC16C64
Contextual Info: Winslow ADAPTICs W939x DIP to PLCC T lead adapter series - o . r oooooooooooooooooooo B C oooooooooooooooooooo U e j - 0 . 24 " T ~ 0 . 4” 0 . 050 " - Part Num ber Top Package Bottom Package Device ‘A ’ ‘B’ ‘C ‘D’ ‘E’ W9390 DIP20

Contextual Info: ¡O rdering nu m b e r : E N SK5092A CMOS LSI NO .3& 5092A LC374200RP, RM-10/LC374200RP. RM-20LV 4 MEG 524288 words x 8 bits Mask ROM Internal Clocked Silicon Gate Preliminary Overview Package Dimensions The LC374200RP, RM-10 and LC374200RP, RM-20LV are 4 1 94304-bit M ask P rogram m able Read Only

tca 780

Abstract: SOP32 DIP32 TA4F
Contextual Info: ¡Ordering number : ENì*< 5090A CMOS LSI No. 5090A LC3781OOPP, PM-10/LC3781OOPP, PM-20LV 8 MEG 1048576 words x 8 bits Mask ROM Internal Clocked Silicon Gate Preliminary Overview Package Dimensions The LC3 781 OOPP, PM-10 and LC378100PP, PM-20LV are 8 3 8 8 6 0 8 -b it M ask Program m able Read Only

SOP32 data sheet

Abstract: LC371100SM LC371100SM-10 LC371100SM-20LV LC371100SP LC371100SP-10 LC371100SP-20LV LC371100ST LC371100ST-10 LC371100ST-20LV
Contextual Info: Ordering number : EN*5087C CMOS LSI LC371100SP, SM, ST-10/20LV 1 MEG 131072 wordsx 8 bits Mask ROM Internal Clocked Silicon Gate Preliminary Overview Package Dimensions The LC371100SP, LC371100SM and LC371100ST are 131,072-word × 8-bit organization (1,048,576-bit) mask