DIE ATTACH MCU Search Results

200B

Abstract: AN598 DK-2750 RG41 popcorn defect analysis to-220
Contextual Info: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of

MC81F4104M

Abstract: MC81F4104S ABOV MC81F 84-1SR4 MP-8000CH4 MP-8000 JESD22 a113 MAGNACHIP MagnaChip Semiconductor
Contextual Info: Document name Page RT_Report 1 of 9 MC81F4104x Include : MC81F4104M, MC81F4104S Qualification Report Report No. AQA-09-06-03 Issued Date 30. June. 2009 Issued By ◈ Part Number MC81F4104x Dong Hee Park ◈ Process Feature ( QA Engineer) 2Poly 4 Metal 4KB Flash 8Bit MCU

Moisture Sensitivity Levels MICROCHIP PIC Package

Abstract: 78610 delamination leadframe barber excursion AN598
Contextual Info: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of

amkor

Abstract: amkor exposed pad
Contextual Info: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a

amkor exposed pad

Abstract: exposed QFP 128 amkor exposed QFP 144
Contextual Info: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small

CS-007

Abstract: Amkor Electronics Amkor mold compound
Contextual Info: LEADFRAME data sheet FusionQuad Body Exposed Pad Size mm Size (mm) 176 ld 14 x 14 6.5 x 6.5 A Electrical: Theta JA (°C/W) by Velocity (m/s) 1.0 2.5 24.6 19.9 17.9 Body Pad Size Size Pkg (mm) 14 x 14 Inductance Capacitance Resistance (mm) Lead 6.5 x 6.5 176 ld

C21DC

Abstract: SWRR064 CC1190EM RF pcb antenna for cc430 CC102X CC1190 QFN-16 CC1190RGVT CC110X antenna for cc430
Contextual Info: CC1190 www.ti.com SWRS089 A – NOVEMBER 2009 – REVISED FEBRUARY 2010 850 – 950 MHz RF Front End Check for Samples: CC1190 FEATURES APPLICATIONS • • • • • • • • 1 • • • • • • • • • • Seamless Interface to Sub-1 GHz Low Power

C21DC

Abstract: SWRR064 cc111x CC1190 RF pcb antenna for cc430 GRM1555C1H120JZ01D antenna for cc430 CC110X QFN-16 CC1190RGVT
Contextual Info: CC1190 www.ti.com SWRS089 A – NOVEMBER 2009 – REVISED FEBRUARY 2010 850 – 950 MHz RF Front End Check for Samples: CC1190 FEATURES APPLICATIONS • • • • • • • • 1 • • • • • • • • • • Seamless Interface to Sub-1 GHz Low Power

SWRR064

Abstract: CC1190EM
Contextual Info: CC1190 www.ti.com SWRS089 A – NOVEMBER 2009 – REVISED FEBRUARY 2010 850 – 950 MHz RF Front End Check for Samples: CC1190 FEATURES APPLICATIONS • • • • • • • • 1 • • • • • • • • • • Seamless Interface to Sub-1 GHz Low Power

SWRR064

Abstract: CC110X SWRS089 OMAP 850 CC11XX CC1190EM
Contextual Info: CC1190 www.ti.com SWRS089 A – NOVEMBER 2009 – REVISED FEBRUARY 2010 850 – 950 MHz RF Front End Check for Samples: CC1190 FEATURES APPLICATIONS • • • • • • • • 1 • • • • • • • • • • Seamless Interface to Sub-1 GHz Low Power

CC1190EM

Contextual Info: CC1190 www.ti.com SWRS089 A – NOVEMBER 2009 – REVISED FEBRUARY 2010 850 – 950 MHz RF Front End Check for Samples: CC1190 FEATURES APPLICATIONS • • • • • • • • 1 • • • • • • • • • • Seamless Interface to Sub-1 GHz Low Power

Cymbet EnerChip User Guide

Abstract: Application Notes application-notes
Contextual Info: Cymbet EnerChip Smart Solid State Batteries Product Overview and User Guide AN-72-1026 Version 9.0 AN-72-1026 v9.0 Copyright 2008-2012 Cymbet Corporation. All rights reserved. Cymbet Corporation 18326 Joplin St. NW Elk River, MN 55330 Phone 763-633-1780

DE104iML

Abstract: prepreg 7628 AT05 7628M PCB f antenna balun 2.4ghz cc2500 tl131 CC24xx CC2500 GRM1555C1HR50BZ01 prepreg 7628 LWQ15AN1N5B00
Contextual Info: CC2590 www.ti.com . SWRS080 – SEPTEMBER 2008 2.4-GHz RF Front End, 14-dBm output power

prepreg 7628 AT05

Abstract: prepreg 7628 CC2500
Contextual Info: CC2590 www.ti.com . SWRS080 – SEPTEMBER 2008 2.4-GHz RF Front End, 14-dBm output power

prepreg 7628 AT05

Abstract: CC2500
Contextual Info: CC2590 www.ti.com . SWRS080 – SEPTEMBER 2008 2.4-GHz RF Front End, 14-dBm output power

tl131

Abstract: CC2510 balun matching circuit design of Balun for CC2420, CC243x, and CC2480 CC2590EM f antenna balun 2.4ghz prepreg 7628 AT05 7628M CC2500
Contextual Info: CC2590 www.ti.com . SWRS080 – SEPTEMBER 2008 2.4-GHz RF Front End, 14-dBm output power

DE104iML

Abstract: CC2500 CC2400 CC2510 CC2511 CC2590 QFN-16 AN032 CC2510 balun matching circuit CC2590EM
Contextual Info: CC2590 www.ti.com . SWRS080 – SEPTEMBER 2008 2.4-GHz RF Front End, 14-dBm output power

RF MODULE CC2500 CIRCUIT DIAGRAM

Abstract: tl131 prepreg 7628 AT05 C102 M DE104 CC2500 CC2590EM CC2400 CC2520 AN032
Contextual Info: CC2590 www.ti.com . SWRS080 – SEPTEMBER 2008 2.4-GHz RF Front End, 14-dBm output power

DE104iML

Abstract: CC2510 balun matching circuit CC2590EM DE104 CC2500 PCB f antenna balun 2.4ghz cc2500 prepreg 7628 AT05 RF MODULE CC2500 CIRCUIT DIAGRAM AN032 AT05
Contextual Info: CC2590 www.ti.com . SWRS080 – SEPTEMBER 2008 2.4-GHz RF Front End, 14-dBm output power

Contextual Info: MAX7049 RELIABILITY REPORT FOR MAX7049ATI+ PLASTIC ENCAPSULATED DEVICES October 9, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Richard Aburano Quality Assurance Manager, Reliability Engineering Maxim Integrated Products. All rights reserved.

Contextual Info: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a

vFBGA* 96 bALL

Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
Contextual Info: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are

Contextual Info: UCS1002-1 Programmable USB Port Power Controller with Charger Emulation PRODUCT FEATURES Datasheet General Description Features The UCS1002 provides a USB port power switch for precise control of up to 2.5 amperes continuous current with over-current limit OCL , dynamic thermal

Contextual Info: UCS8100X Automotive USB Port Power Controller with Charger Emulation PRODUCT FEATURES Datasheet General Description Features The UCS81001 and UCS81002 referred to as the UCS8100X in this document provide a USB port power switch for precise control of up to 2.5 amperes continuous