DDR133 Search Results

IBM "embedded dram"

Abstract: m5m4v4169 Intel 1103 DRAM Nintendo64 IBM98 toshiba fet databook dynamic memory controler MOSYS eDRAM "1t-sram" MoSys
Contextual Info: ABSTRACT MODERN DRAM ARCHITECTURES by Brian Thomas Davis Co-Chair: Assistant Professor Bruce Jacob Co-Chair: Professor Trevor Mudge Dynamic Random Access Memories DRAM are the dominant solid-state memory devices used for primary memories in the ubiquitous microprocessor systems of

MPC8313C

Abstract: 516-ball POWERPC 8548 MMU mpc8270cxxmiba The PowerPC 620 ISA MPC180LMB MPC823 MPC823E MPC850 MPC755CT
Contextual Info: Network/Embedded Processors Quarter 4, 2007 SG1007Q42007 Rev 0 SECURITY AND INTEGRATED COMMUNICATIONS PROCESSORS Security Processors Description Packaging Speed MHz Rev Voltage Core (V) Voltage IO/tol (V) Status MPC180LMB Product Security co-processor which interfaces gluelessly to 8xx system bus and 8260 local bus.

PH6N

Abstract: TRANSISTOR PH6N transistor ph4n
Contextual Info: SPEAr600 Embedded MPU with dual ARM926 core, flexible memory support, powerful connectivity features and programmable LCD interface Datasheet − production data Features • Dual ARM926EJ-S core up to 333 MHz: – Each with 16 Kbytes instruction cache + 16

DDR133

Abstract: DDR200 K4X56163PE
Contextual Info: K4X56163PE-L F G Mobile-DDR SDRAM 16M x16 Mobile DDR SDRAM FEATURES • 1.8V power supply, 1.8V I/O power • Double-data-rate architecture; two data transfers per clock cycle • Bidirectional data strobe(DQS) • Four banks operation • Differential clock inputs(CK and CK)

1. Mobile Computing block diagram

Abstract: DDR2-667 STLS2E02 STLS2F01 Loongson block stages of laptop computers cache architecture for MIPS 1 stls
Contextual Info: Low power 64-bit CPU 1GHz, power-efficient, MIPS-based CPU for affordable computing, thin clients and web appliances STMicroelectronics’ ST STLS is a family of processors addressing all the applications requiring high levels of performance and low power dissipation. The STLS

D80008

Contextual Info: PRELIMINARY INFORMATION L9D340G64BG2 4.0 Gb, DDR3, 64 M x 64 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: 1 00 1 enter-ter inated, u ull IO a age: 16 22 , 13 21 atri 2 1 all Matri all it : 1 00 S a e a ing oot rint er all en an ed, I edan e

transistor PH6n

Abstract: transistor PH7n ph5n PH6N transistor ph4n transistor ph0n ph7n ph1n lk1 K20 transistor ph5n
Contextual Info: SPEAr600 Embedded MPU with dual ARM926 core, flexible memory support, powerful connectivity features and programmable LCD interface Features • Dual ARM926EJ-S core up to 333 MHz: – Each with 16 Kbytes instruction cache + 16 Kbytes data cache ■ High performance 8-channel DMA

G.975.1

Abstract: DDR3 layout OTN Framer MXP2 ODTU12 stm 4 muxponder CBR10G tt 6222-1 HD-SDI over sdh OTN SWITCH
Contextual Info: MXP2 Datasheet - G00676-07 20 Gb/s SONET/SDH/OTN Mapper and Multiplexor MXP2 20 Gb/s SONET/SDH/OTN Mapper and Multiplexor Document Number: G00676 Version Number: 7 Released on: 2 March 2011 Security: PROPRIETARY and CONFIDENTIAL PRELIMINARY EXAR Corporation and the EXAR Corporation logo are trademarks of EXAR Corporation.

DDR3-1066

Abstract: DDR3-1333 L9D320G32BG6 0-575V
Contextual Info: ADVANCE INFORMATION L9D320G32BG6 2.0 Gb, DDR3, 64 M x 32 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: • Vcc=VccQ=1.5V ± 0.075V • 1.5V center-terminated, push/pull I/O • Package: 16mm x 12mm, 10 x 13 matrix w/ 129 balls • Matrix ball pitch: 1.00mm

L9D340G64BG2I15

Abstract: DDR3-1066 DDR3-1333 L9D340G64B L9D340G64BG2
Contextual Info: PRELIMINARY INFORMATION L9D340G64BG2 4.0 Gb, DDR3, 64 M x 64 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: • Vcc=VccQ=1.5V ± 0.075V • 1.5V center-terminated, push/pull I/O • Package: 16mm x 22mm, 13 x 21 matrix w/ 271balls

MPC8379

Abstract: AN2583 ddr1 sdram mpc8343 sdram controller 001B MPC8347 MPC8349 MPC8540 MPC8541E
Contextual Info: Freescale Semiconductor Application Note AN2583 Rev. 5, 08/2007 Programming the PowerQUICC III/ PowerQUICC II Pro DDR SDRAM Controller The Freescale PowerQUICC™ III and PowerQUICC II Pro devices are the latest PowerQUICC integrated communication processors and the first PowerQUICC

mpc8314

Abstract: KMPC Freescale SST MPC mpc8313 etsec Ethernet freescale 352 tepbga MPC864x Freescale usb mcf51jm128 MPC55XX CONFIG P2010 MPC823
Contextual Info: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: CWH-PPC-8540N-VE, MPC55xx

db9 JTAG CONNECTOR

Abstract: Xilinx 8.1i spear linux ips project Head200 spear DDR133 CD ROM board diagram development board Xilinx Ethernet development
Contextual Info: SPEAr Head200 development board SPEAr Head200 core and FPGA customization mode supported, for quick and easy project development The SPEAr Head200 development board from STMicroelectronics has been specifically designed to provide a quick and easy route to SPEAr Head200 based project

Contextual Info: Intel Xeon® Processor E3-1200 v2 Product Family Datasheet – Volume 2 of 2 May 2012 Document Number: 326773-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

BA 5810

Abstract: MPC8548 mpc8379 MPC85xxEC uboot freescale mpc8313 MPC83xx 001B MPC8572 MPC8343 MPC8347
Contextual Info: Freescale Semiconductor Application Note AN2583 Rev. 8, 12/2008 Programming the PowerQUICC III/PowerQUICC™ II Pro DDR SDRAM Controller The Freescale PowerQUICC™ III and PowerQUICC™ II Pro devices are the latest PowerQUICC integrated communication processors and the first PowerQUICC

LM 7447

Abstract: IBM PowerPC 7448 user guide XPC823E MCF5327 MCF5328 MCF5329 MCF5372 MCF5372L MCF5373 MCF5373L
Contextual Info: Network and Communications Processors Quarter 4, 2005 SG1007Q42005 Rev 0 About This Revision–Q4/2005 When new products are introduced, a summary of new products will be provided in this section. However, the New Product section will only appear on this page when new products

AMCC date code

Abstract: MPC180LMB LM 7447 mc7447A freescale 352 tepbga MCF5208 SG1007 GBIC EVALUATION BOARD CodeTAP 68360 KMPC
Contextual Info: Network and Communications Processors Quarter 3, 2005 SG1007Q32005 Rev 0 About This Revision–Q3/2005 When new products are introduced, a summary of new products will be provided in this section. However, the New Product section will only appear on this page when new products

MS08QD4

Abstract: MCF52236 MPC56xx instruction set digrf MCF52252 MMM6000 MMM7010 MPC5602B MS08EL32 MPC56xx
Contextual Info: SG1000mini Freescale Semiconductor Product Selector Guides Quarter 2, 2009 Product Selector Guide Cross-Reference, SG1000CR Automotive, SG187 Analog and Mixed Signal Power Management, SG1002 Digital Signal Processors DSP , SG1004 Network/Embedded Processors, SG1007

TRANSISTOR PH6N

Abstract: ph6n transistor PH7n ph5n transistor ph5n transistor ph4n transistor ph0n ph7n M95xx "ph4n"
Contextual Info: SPEAr600 Embedded MPU with dual ARM926 core, flexible memory support, powerful connectivity features and programmable LCD interface Datasheet − production data Features • Dual ARM926EJ-S core up to 333 MHz: – Each with 16 Kbytes instruction cache + 16

ddr3 pinout

Abstract: wrs4 MR1121
Contextual Info: PRELIMINARY INFORMATION L9D340G64BG2 4.0 Gb, DDR3, 64 M x 64 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: s6CC6CC16Ò6 s6CENTER TERMINATED PUSHPULL )/ s0ACKAGEMMXMM X MATRIXWBALLS s-ATRIXBALLPITCHMM

b10 45g

Abstract: srt 8n PS-AC150 DDR3-1066 DDR3-1333
Contextual Info: ADVANCE INFORMATION L9D345G72BG5 4.5 Gb, DDR3, 64 M x 72 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: • Vcc=VccQ=1.5V ± 0.075V • 1.5V center-terminated, push/pull I/O • Package: 25mm x 25mm, 16 x 16 matrix w/ 255 balls • Matrix ball pitch: 1.00mm

LG MS 7541 MOTHERBOARD SERVICE MANUAL

Abstract: DDR3 DRAM layout AM2r2 Processor Functional amd socket s1g4 ED58 diode lg monitor 700e diagram A854 TOM - 2088 - BH IC TOP 8901 AMD Infrastructure Roadmap
Contextual Info: 31116 Rev 3.48 - April 22, 2010 AMD Family 10h Processor BKDG Cover page BIOS and Kernel Developer’s Guide BKDG For AMD Family 10h Processors Advanced Micro Devices 1 31116 Rev 3.48 - April 22, 2010 AMD Family 10h Processor BKDG 2005–2010 Advanced Micro Devices, Inc. All rights reserved.

amba bus architecture

Abstract: PPC440 AMBA AMBA APB bus protocol
Contextual Info: The CoreConnect Bus Architecture Recent advances in silicon densities now allow for the integration of numerous functions onto a single silicon chip. With this increased density, peripherals formerly attached to the processor at the card level are integrated onto the same die as the processor. As a result, chip designers must now address issues

Contextual Info: Intel Core i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 2 Supporting Desktop Intel® Core™ i7-3960X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-3000K and i7-3000 Processor Series for the LGA-2011 Socket