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KEMET Corporation PHE845VD5470MR30L2 CAP FILM 0.047UF 20% 1.5KVDC RAD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	PHE845VD5470MR30L2	Tray			616	1 - 10 - 100 - 1000 $0.62938 10000 $0.62938	Buy Now
KEMET Corporation PHE845VD5470MR30LL2 CAP FILM RAD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	PHE845VD5470MR30LL2	Tray			616	1 - 10 - 100 - 1000 $0.84549 10000 $0.84549	Buy Now
Mouser Electronics	PHE845VD5470MR30LL2		49			1 $2.26 10 $1.46 100 $1.07 1000 $0.884 10000 $0.884	Buy Now
Newark	PHE845VD5470MR30LL2	Bulk			616	1 - 10 - 100 - 1000 $0.812 10000 $0.748	Buy Now
Samtec Inc FFSD-25-D-54.70-01-N-R .050" LOW PROFILE TIGER EYE IDC Free Sample
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	FFSD-25-D-54.70-01-N-R	Bulk			1	1 $42.45 10 $42.45 100 $42.45 1000 $42.45 10000 $42.45	Buy Now
Avnet Americas	FFSD-25-D-54.70-01-N-R	Bulk			1	1 $29.39525 10 $28.92308 100 $24.79625 1000 $24.79625 10000 $24.79625	Buy Now
Master Electronics	FFSD-25-D-54.70-01-N-R					1 $39.33 10 $34.57 100 $28.42 1000 $25.21 10000 $25.21	Buy Now
Sager	FFSD-25-D-54.70-01-N-R				1	1 $39.6 10 $36.74 100 $28.04 1000 $24.88 10000 $24.88	Buy Now
KEMET Corporation PHE450SD5470JR06L2 Film Capacitor, 0.047 uF, 700 V, 2000 V, ? 5%, Double Metallized PP, Radial Box - 2 Pin - Trays (Alt: F450DM473J2K0C)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	PHE450SD5470JR06L2	Tray	1,846		616	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Mouser Electronics	PHE450SD5470JR06L2		1,434			1 $3.35 10 $2.28 100 $1.74 1000 $1.42 10000 $1.23	Buy Now
Newark	PHE450SD5470JR06L2	Bulk			308	1 $1.02 10 $1.02 100 $1.02 1000 $1.02 10000 $1.02	Buy Now
Avnet Abacus	PHE450SD5470JR06L2			31 Weeks	616	1 - 10 - 100 - 1000 - 10000 -	Buy Now
KEMET Corporation PHE845VD5470MR06L2 Safety Capacitor, 0.047 uF, 760 VAC, ? 20%, X1, Metallized PP, Radial Box - 2 Pin, Through Hole - Trays (Alt: F845DM473M760C)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	PHE845VD5470MR06L2	Tray	280	30 Weeks	1	1 $0.59173 10 $0.58669 100 $0.55648 1000 $0.55648 10000 $0.55648	Buy Now
Mouser Electronics	PHE845VD5470MR06L2		355			1 $2.14 10 $1.21 100 $0.925 1000 $0.839 10000 $0.839	Buy Now
Newark	PHE845VD5470MR06L2	Bulk	280		1	1 $0.592 10 $0.592 100 $0.592 1000 $0.592 10000 $0.592	Buy Now
TTI	PHE845VD5470MR06L2	Tray			616	1 - 10 - 100 - 1000 $0.637 10000 $0.637	Buy Now
TME	PHE845VD5470MR06L2		280		1	1 $1.63 10 $1.38 100 $0.98 1000 $0.69 10000 $0.66	Buy Now

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D5470 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
ASTM D374 Abstract: ASTM D2240, D412 ASTM D412 ASTM d412 ASTM D2240 D2240 ASTM d792 ASTM-D-257 ASTM-D-374 Text: TG2030 Ultra Soft Thermal Conductive Pad Features Superior thermal conductivity Highly compressible Naturally tacky Low Shore OO hardness Low oil bleed Electrically insulating Applications Electronic components: IC - CPU - MOS LED - M/B - P/S - Heat Sink LCD-TV - Notebook PC - PC Telecom Device - Wireless Hub.etc.	Original	TG2030 D5470 D2240 ASTM D374 ASTM D2240, D412 ASTM D412 ASTM d412 ASTM D2240 D2240 ASTM d792 ASTM-D-257 ASTM-D-374	PDF
bergquist Abstract: SIL-PAD 1000 TO 247 ASTM D2240, D412 ASTM D374 SIL-PAD 900S D149 D150 D2240 D257 D374 Text: Sil-Pad 900S High Performance Insulator for Low-Pressure Applications Features and Benefits TYPICAL PROPERTIES OF SIL-PAD 900S PROPERTY Color • Thermal impedance: 0.61°C-in2/W @50 psi • Electrically isolating • Low mounting pressures • Smooth and highly compliant surface	Original	D2240 bergquist SIL-PAD 1000 TO 247 ASTM D2240, D412 ASTM D374 SIL-PAD 900S D149 D150 D2240 D257 D374	PDF
optically clear adhesive Abstract: ecg master replacement guide 1115b silver conductive ink resins QTM-500 MGC 7805 CONDUCTIVE INK FOR FLEX CIRCUITS 3m 7815 8880-S7 UL-746 Text: 3M Electronics Assembly Solutions Product Selection Guide Smart Solutions for Building In Value 3M Company, operating in more than 60 countries, has over 60,000 products. These products, based on 40 technology platforms, have been developed by 6,500 3M Product Developers Worldwide.	Original	225-3S-06 7193HB optically clear adhesive ecg master replacement guide 1115b silver conductive ink resins QTM-500 MGC 7805 CONDUCTIVE INK FOR FLEX CIRCUITS 3m 7815 8880-S7 UL-746	PDF
astm D150 Abstract: D412 ASTM D412 ASTM D5470 ASTM D2240, D412 ASTM D2240 T-Flex 200 Outgassing CVCM ASTM Text: Laird Technologies Web site: www.LairdTech.com Item # Tflex 2130 V0, Tflex 200 V0 Series Gap Filler Material Tflex™ 200 V0 Series Gap Filler Material The Tflex™ 200 V0 Series is a very soft, free standing gap filler that is more compressible than most gap fillers. Tflex™	Original	D5470 IPC-TM-650 astm D150 D412 ASTM D412 ASTM D5470 ASTM D2240, D412 ASTM D2240 T-Flex 200 Outgassing CVCM ASTM	PDF
D149 Abstract: D2240 D257 D412 A15561-00 Text: TgardTM 3000 Thermally Conductive Insulators Innovative Technology for a Connected World Electrically Insulating, Thermally Conductive Material The TgardTM 3000 is specifically designed to solve over heating issues such as lower component efficiency, premature component failures, size limitations and other performance problems for today’s power	Original	A15561-00 A15099-00 D149 D2240 D257 D412	PDF
bergquist Abstract: 2500S2 Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at	Original	2500S20 2500S20 bergquist 2500S2	PDF
Thermal Gap Filler Abstract: D149 D2240 D257 D412 E595 Text: TflexTM 200 V0 Series Thermal Gap Filler Innovative Technology for a Connected World SOFT, FREESTANDING GAP FILLER Tflex 200 V0 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this	Original	A14175-00 Thermal Gap Filler D149 D2240 D257 D412 E595	PDF
Untitled Abstract: No abstract text available Text: Bond-Ply 400 Thermally Conductive,Un-Reinforced,Pressure Sensitive Adhesive Tape Features and Benefits • Thermal impedance: 0.87°C-in 2/W @50 psi • Easy application • Eliminates need for external hardware (screws,clips,etc.) • Available with easy release tabs	Original	E1356 D1002	PDF
Untitled Abstract: No abstract text available Text: Gap Pad 1500S30 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500S30 • Thermal conductivity: 1.3 W/m-K PROPERTY Color • Highly conformable / low hardness Reinforcement Carrier	Original	1500S30 E1269 D2240 1500S30	PDF
Untitled Abstract: No abstract text available Text: Hi-Flow 225U Un-Reinforced Phase Change Thermal Interface Material Features and Benefits T YPICAL PROPERT IES OF H I-FLOW 225U PROPERTY Color • Thermal impedance:0.07°C-in /W @25 psi • Hi-Flow coating will resist dripping • Thermally conductive 55°C phase change	Original	D3418	PDF
a3000 Abstract: No abstract text available Text: Gap Pad A3000 Thermally Conductive, Reinforced Gap Filling Material Features and Benefits • Thermal conductivity: 2.6 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Reduced tack on one side to aid in application assembly • Electrically isolating	Original	A3000 E1269 a3000	PDF
Untitled Abstract: No abstract text available Text: Sil-Pad 800 High Performance Insulator for Low-Pressure Applications Features and Benefits T YPICAL PROPERT IES OF SIL-PAD 800 PROPERTY Color • Thermal impedance: 0.45°C-in 2/W @50 psi • High value material • Smooth and highly compliant surface	Original	D2240	PDF
D150 Abstract: D257 INCOMING MATERIAL FLOW PROCESS Text: 45 Features • Out-of-the-Box Convenience • Exceptional Thermal Performance • Simplifies Bill of Materials and Purchasing Data Sheet ThermScreen TM Factory Applied Thermal Interface Product Overview ThermScreen is a factory applied thermal interface material available as an option for	Original	6/03/10M D150 D257 INCOMING MATERIAL FLOW PROCESS	PDF
Untitled Abstract: No abstract text available Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at	Original	2500S20 E1269 D2240 2500S20	PDF

TIC 220 Abstract: D257 D792 TIC1000A Text: TIC 1000A High Performance, Value Compound for High-End Computer Processors Features and Benefits • High thermal performance: 0.32°C/W TO-220 thermal test @ 50 psi • Good screenability • Room temperature storage • No post “cure” required	Original	O-220 D5470 TIC1000A TIC 220 D257 D792	PDF
C351 Abstract: D149 D150 D2240 D257 D374 D575 D792 ASTM d792 ASTM D2240 Text: Gap Pad 2000S40 Highly Conformable,Thermally Conductive “S-Class” Gap Filling Material Features & Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color • Thermal conductivity = 2.0 W/mK • Low S-Class thermal resistance at very low pressures	Original	2000S40 C351 D149 D150 D2240 D257 D374 D575 D792 ASTM d792 ASTM D2240	PDF
Untitled Abstract: No abstract text available Text: TflexTM 300 Series Thermal Gap Filler Innovative Technology for a Connected World UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing	Original	50psi, 300-H A15293-00	PDF
Untitled Abstract: No abstract text available Text: TgardTM 20 Thermally Conductive Insulators Innovative Technology for a Connected World LOW COST, MEDIUM PERFORMANCE INSULATOR MATERIAL The TgardTM 20 is designed to solve over heating issues such as lower component efficiency, premature component failures, size limitations and other performance	Original	A15561-00	PDF
a13514 Abstract: D149 D150 D2240 D257 D412 E595 ASTM D2240, D412 ASTM-D257 Dielectric Constant Silicon Nitride Text: T-gardTM 200 Series global solutions : local support TM T-gard 200 Series Features and Benefits: High Performance Thermal Interface Products • High thermal Conductivity of 5.0 W/mK The T-gard™ 200 is a high performance interface pad. Consisting of silicon/	Original		PDF
D149 Abstract: D150 D2240 D257 D412 E595 Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These	Original		PDF
Untitled Abstract: No abstract text available Text: Poly-Pad 400 Polyester-Based,Thermally Conductive Insulation Material Features and Benefits • Thermal impedance: 1.13°C-in2/W @50 psi • Polyester based • For applications requiring conformal coatings • Designed for silicone-sensitive standard	Original	D2240 D1458	PDF
Untitled Abstract: No abstract text available Text: Gap Pad VO Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO • Thermal conductivity: 0.8 W/m-K • Enhanced puncture, shear and tear resistance • Conformable gap filling material • Electrically isolating	Original	E1269	PDF
Untitled Abstract: No abstract text available Text: TG-X Ultra Soft Thermal Conductive Pad Features Superior thermal conductivity Highly compressible Naturally tacky Low Shore OO hardness Low oil bleed Electrically insulating Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /	Original	D5470 320-320mm D2240	PDF
Untitled Abstract: No abstract text available Text: DC0040/01/PC99AL-0.10-0.1 Die Cut PCM SCR Darlington Module Features Low thermal resistance Natural tack Applications SCR Darlington Module REACH Compliant Properties RoHS Compliant Property PC99AL Unit Test Method Colour Grey - Visual Thickness 0.10 mm ASTM D374	Original	DC0040/01/PC99AL-0 PC99AL D5470 DC0040/01 DC0040/02 DC0040/03 DC0040/04 DC0040/05 DC0040/06	PDF

D5470 Search Results

D5470 Price and Stock

KEMET Corporation PHE845VD5470MR30L2

KEMET Corporation PHE845VD5470MR30LL2

Samtec Inc FFSD-25-D-54.70-01-N-R

KEMET Corporation PHE450SD5470JR06L2

KEMET Corporation PHE845VD5470MR06L2

D5470 Datasheets Context Search

ASTM D374

bergquist

optically clear adhesive

astm D150

D149

bergquist

Thermal Gap Filler

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a3000

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D150

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TIC 220

C351

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a13514

D149

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