2CTA-470/470M-Q20T
Abstract: MO-137 CTA20Q 2CTA-330/470M-Q20T
Text: oH V SC AV ER OM AI SIO PL LA N IA BL S NT E *R Features • ■ ■ ■ ■ Applications Lead free versions available RoHS compliant lead free version * 18 RC terminators tied to a common node Stable thin-film-on-silicon technology Ultra-miniature packages to JEDEC
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MO-137
Abstract: No abstract text available
Text: NT IA • ■ *R oH S CO M PL Features ■ ■ Applications RoHS compliant* 18 RC terminators tied to a common node Stable thin-film-on-silicon technology Ultra-miniature packages to JEDEC standards ■ ■ ■ High-speed bus termination Low power consumption
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MO-137
Abstract: No abstract text available
Text: IA NT Features CO M PL • *R oH S ■ ■ ■ Applications RoHS compliant* 18 RC terminators tied to a common node Stable thin-film-on-silicon technology Ultra-miniature packages to JEDEC standards ■ ■ ■ High-speed bus termination Low power consumption
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MS-013 Package
Abstract: CTA20Q 2QSP24 MO-137 MS-013 2TSP24
Text: For technical assistance use the Microelectronics Products number on the back cover. Features • ■ ■ ■ Applications 18 RC terminators tied to a common node Stable thin-film-on-silicon technology Ultra-miniature packages to JEDEC standards For package dimensions see page XX
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O-236.
MS-012.
2NBS14,
2NBS16
2NBS08
MS-013 Package
CTA20Q
2QSP24
MO-137
MS-013
2TSP24
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Untitled
Abstract: No abstract text available
Text: For technical assistance call the Microelectronics Products number on the back cover. Features Applications • 18 RC term in ato rs tied to a co m m o n node ■ H igh-speed bus term in ation ■ Low pow er consum ption ■ Stable th in -film -o n -silico n technology
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OCR Scan
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CTA20Q
470330MpYYWW^
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jedec package standards
Abstract: CTA20Q
Text: NT IA • ■ *R oH S CO M PL Features ■ ■ Applications RoHS compliant* 18 RC terminators tied to a common node Stable thin-film-on-silicon technology Ultra-miniature packages to JEDEC standards ■ ■ ■ High-speed bus termination Low power consumption
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