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    CQFP 52 LEAD Search Results

    CQFP 52 LEAD Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    CQFP 52 LEAD Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    smd A018

    Abstract: top mark smd A12 CQFP top mark smd A9 smd A018 3 pin A13 smd Mark A12 SMD smd a7 transistor smd transistor a4 smd transistor A8
    Text: WS512K32-XXX 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 17, 20, 25, 35, 45, 55nS ■ Packaging • 66 pin, PGA Type, 1.385 inch square, Hermetic Ceramic HIP Package 402 , SMD Number 5962-94611 • 68 lead, 40mm Hermetic Low Capacitance CQFP, 5.1mm


    Original     		WS512K32-XXX 512Kx32 512Kx32, 1Mx16 09HMX 10HMX 05HNX 06HNX 07HNX 08HNX smd A018 top mark smd A12 CQFP top mark smd A9 smd A018 3 pin A13 smd Mark A12 SMD smd a7 transistor smd transistor a4 smd transistor A8 PDF

    O28 Package

    Abstract: No abstract text available
    Text: WS128K32-15XX 128Kx32 SRAM MODULE ADVANCED* FEATURES • Access Times of 15nS ■ Packaging • 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic HIP Package 400 • 68 lead, 40mm Low Profile CQFP, 3.5mm (0.140") (Package 502), Package to be developed


    Original     		WS128K32-15XX 128Kx32 66-pin, 128Kx32; 256Kx16 512Kx8 WS128K32-XG2X WS128K32-XHX 128Kx32 O28 Package PDF

    Untitled

    Abstract: No abstract text available
    Text: WED8LM32513C HI-RELIABILITY PRODUCT 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 15*, 17, 20, 25, 35, 45, 55ns ■ Low Power CMOS ■ Packaging ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation • 68 lead, 23.88mm Low Profile CQFP, 3.56mm 0.140"


    Original     		WED8LM32513C 512Kx32 512Kx32, 1Mx16 512Kx32 PDF

    WF4M32-XXX5

    Abstract: No abstract text available
    Text: WF4M32-XXX5 White Electronic Designs PRELIMINARY* 4Mx32 5V FLASH MODULE FEATURES „ „ „ „ „ Access Times of 100, 120, 150ns Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . • 68 lead, 40mm Low Profile CQFP (Package


    Original     		WF4M32-XXX5 4Mx32 150ns 990CQFJ 64KBytes 4Mx32 2x4Mx16 WF4M32-XXX5 PDF

    WF4M32-XXX5

    Abstract: No abstract text available
    Text: White Electronic Designs WF4M32-XXX5 PRELIMINARY* 4Mx32 5V FLASH MODULE FEATURES Access Times of 100, 120, 150ns Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . • 68 lead, 40mm Low Profile CQFP (Package 502), 3.5mm (0.140") height.


    Original     		WF4M32-XXX5 4Mx32 150ns 990CQFJ 64KBytes 4Mx32 2x4Mx16 WF4M32-XXX5 PDF

    CERAMIC QUAD FLATPACK CQFP

    Abstract: CQFP 240
    Text: CQFP.FRM Page 1 Tuesday, February 9, 1999 4:20 PM CQFP Packaging Capabilities Surface Mount Description The Ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher lead count and smaller lead pitch than most


    Original     		GA98111PDF2/99 CERAMIC QUAD FLATPACK CQFP CQFP 240 PDF

    Untitled

    Abstract: No abstract text available
    Text: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square


    Original     		WF2M32-XXX5 2Mx32 150ns 64KBytes WF2M32U-XG2UX 64KByte PDF

    WS128K32-XG2TXE

    Abstract: No abstract text available
    Text: White Electronic Designs WS128K32-XG2TXE ADVANCED* 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT FEATURES Access Times of 35, 45, 55ns TTL Compatible Inputs and Outputs Packaging • 68 lead, 22.4mm CQFP G2T , 4.57mm (0.180"), (Package 509) Built in Decoupling Caps and Multiple Ground Pins


    Original     		WS128K32-XG2TXE 128Kx32 128Kx32; 256Kx16 512Kx8 MIL-STD-883 128Kx32 WS128K32-XG2TXE PDF

    WF2M32-XXX5

    Abstract: No abstract text available
    Text: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square


    Original     		WF2M32-XXX5 2Mx32 150ns 64KBytes 2Mx32 64KByte 01HXX* 120ns WF2M32-XXX5 PDF

    WS512K32-XXX

    Abstract: WS512K32-XG2TX1
    Text: White Electronic Designs WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES • Access Times of 70, 85, 100, 120ns ■ 5V Power Supply ■ Packaging ■ Low Power CMOS • 68 lead, Hermetic CQFP G2T 1, 22.4mm (0.880 inch) square. 4.57mm (0.180 inch) high (Package


    Original     		WS512K32-XXX 512Kx32 120ns 512Kx32, 1Mx16 WS512K32-XG2TX1 WS512K32-XG2TX 512Kx32 02HMX WS512K32-XXX PDF

    smd code F18

    Abstract: act-s512k32n 5962-9461110HTC ACT-S512K32N-017P7Q 5962-9461110 CQFP 80 footprint cqfp 280
    Text: ACT–S512K32 High Speed 16 Megabit SRAM Multichip Module Features • 4 Low Power CMOS 512K x 8 SRAMs in one MCM ■ Factory configured as 512K x 32; User configurable as 1M x 16 or 2M x 8 ■ Input and Output TTL & CMOS Compatible Design ■ Fast 17,20,25,35,45,55ns Access Times


    Original     		S512K32 MIL-PRF-38534 MIL-STD-883 SCD1660 smd code F18 act-s512k32n 5962-9461110HTC ACT-S512K32N-017P7Q 5962-9461110 CQFP 80 footprint cqfp 280 PDF

    WS128K32-XG2TXE

    Abstract: No abstract text available
    Text: WS128K32-XG2TXE HI-RELIABILITY PRODUCT 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLERANT FEATURES • 5 Volt Power Supply ■ Access Times of 35, 45, 55ns ■ Packaging • 68 lead, 22.4mm CQFP G2T , 4.57mm (0.180"), (Package 509) ■ Organized as 128Kx32; User Configurable as 256Kx16


    Original     		WS128K32-XG2TXE 128Kx32 128Kx32; 256Kx16 512Kx8 WS128K32-XG2TXE 128Kx32 256Kx16 PDF

    WS128K32-XG2TXE

    Abstract: No abstract text available
    Text: White Electronic Designs WS128K32-XG2TXE ADVANCED* 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT FEATURES „ Access Times of 35, 45, 55ns „ TTL Compatible Inputs and Outputs „ Packaging • 68 lead, 22.4mm CQFP G2T , 4.57mm (0.180"), (Package 509)


    Original     		WS128K32-XG2TXE 128Kx32 128Kx32; 256Kx16 512Kx8 MIL-STD-883 128Kx32 WS128K32-XG2TXE PDF

    Untitled

    Abstract: No abstract text available
    Text: WS128K32-XG2TXE ADVANCED* 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT FEATURES  Built in Decoupling Caps and Multiple Ground Pins for Low Noise Operation  Access Times of 35, 45, 55ns  Packaging • 68 lead, 22.4mm CQFP G2T , 4.57mm (0.180"),


    Original     		WS128K32-XG2TXE 128Kx32 128Kx32; 256Kx16 512Kx8 PDF

    S128K32

    Abstract: ACT-S128K32 ACT-S128K32V 5962-9559509HMX 5962-9318710H4X
    Text: ACT-S128K32 High Speed 4 Megabit SRAM Multichip Module Features • 4 Low Power CMOS 128K x 8 SRAMs in one MCM ■ Overall configuration as 128K x 32 ■ Input and Output TTL Compatible ■ 17, 20, 25, 35, 45 & 55ns Access Times, 15ns Available by Special Order


    Original     		ACT-S128K32 MIL-STD-883 ACT-S128K32 SCD1659 S128K32 ACT-S128K32V 5962-9559509HMX 5962-9318710H4X PDF

    511S

    Abstract: WS1M32-XG3X ah55
    Text: WS1M32-XG3X 1Mx32 SRAM MODULE PRELIMINARY* FEATURES • Access Time of 70, 85, 100, 120ns ■ TTL Compatible Inputs and Outputs ■ 84 lead, 28mm CQFP, Package 511 ■ 5 Volt Power Supply ■ Organized as two banks of 512Kx32, User Configurable as 1Mx16 or 2Mx8


    Original     		WS1M32-XG3X 1Mx32 120ns 512Kx32, 1Mx16 I/O31 I/O30 I/O29 I/O28 511S WS1M32-XG3X ah55 PDF

    WS1M32V-XG3X

    Abstract: No abstract text available
    Text: WS1M32V-XG3X HI-RELIABILITY PRODUCT 1Mx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES n Access Times of 17, 20, 25ns n 3.3 Volt Power Supply n 84 lead, 28mm CQFP, Package 511 n Low Power CMOS n Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8


    Original     		WS1M32V-XG3X 1Mx32 512Kx32, 2Mx16 WS1M32V-XG3X I/O31 I/O30 I/O29 I/O28 PDF

    2 010 073 007

    Abstract: cqfp package outline CERAMIC QUAD FLATPACK CQFP CQFP 172 PIN
    Text: AMI A M I S E M IC O N D U C T O R %s CQFP Packaging Capabilities Description Surface Mount The ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher leaad count and smaller lead pitch than most other ceramic packages. It has been provided in a


    OCR Scan     		PDF

    WS1M32-XG3X

    Abstract: No abstract text available
    Text: WS1M32-XG3X 1Mx32 SRAM MODULE FEATURES • Access Times of 17, 20, 25ns ■ Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Organized as two banks of 512Kx32, User Configurable as


    Original     		WS1M32-XG3X 1Mx32 512Kx32, 2Mx16 WS1M32-XG3X I/O31 I/O30 I/O29 I/O28 PDF

    WS1M32V-XG3X

    Abstract: No abstract text available
    Text: White Electronic Designs WS1M32V-XG3X PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES Access Times of 17, 20, 25ns 3.3V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8 Built-in Decoupling Caps and Multiple Ground Pins


    Original     		WS1M32V-XG3X 1Mx32 512Kx32, 2Mx16 WS1M32V-XG3X I/O31 I/O30 I/O29 I/O28 PDF

    CQFP 240 Aeroflex

    Abstract: 5962-9461110 military mcm 1553 5962-9461108 5962-9461109 5962-9461108hxc O28 Package 5962-9461109HM 5962-9461110HMC a1855
    Text: ACT–S512K32 High Speed 16 Megabit SRAM Multichip Module Features • 4 Low Power CMOS 512K x 8 SRAMs in one MCM ■ Factory configured as 512K x 32; User configurable as 1M x 16 or 2M x 8 ■ Input and Output TTL & CMOS Compatible Design ■ Fast 17,20,25,35,45,55ns Access Times


    Original     		S512K32 MIL-PRF-38534 MIL-STD-883 MIL-STD-883 SCD1660 CQFP 240 Aeroflex 5962-9461110 military mcm 1553 5962-9461108 5962-9461109 5962-9461108hxc O28 Package 5962-9461109HM 5962-9461110HMC a1855 PDF

    512k32n

    Abstract: SRAM 35ns
    Text: ¥71 ! I • : L | 12 ET -b u . m -ft £ ì ì ■ ■1 à d l >1 1■ ■ 1- \ 4 ■ t r i t u 5Ì Features ■ 4 Low Power CMOS 512K x 8 SRAMs in one MCM ■ Factory configured as 512K x 32; User configurable as 1M x 16 or 2M x 8 ■ Input and Output TTL & CMOS Compatible Design


    OCR Scan     		IL-STD-883 S512K32-B 512k32n SRAM 35ns PDF

    WS1M32-XG3X

    Abstract: No abstract text available
    Text: White Electronic Designs WS1M32-XG3X 1Mx32 SRAM MODULE FEATURES „ Access Times of 17, 20, 25ns „ Low Power CMOS „ Packaging „ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation „ Weight • 84 lead, 28mm CQFP, Package 511 „ Organized as two banks of 512Kx32, User


    Original     		WS1M32-XG3X 1Mx32 512Kx32, 2Mx16 WS1M32-XG3X I/O31 I/O30 I/O29 I/O28 PDF

    WS1M32V-XG3X

    Abstract: No abstract text available
    Text: WS1M32V-XG3X HI-RELIABILITY PRODUCT 1Mx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES • Access Times of 17, 20, 25ns ■ Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Organized as two banks of 512Kx32, User Configurable as


    Original     		WS1M32V-XG3X 1Mx32 512Kx32, 2Mx16 WS1M32V-XG3X I/O31 I/O30 I/O29 I/O28 PDF