RTAX2000S
Abstract: rtax2000 RTSX32SU-CQ208E RTSX32SU-CQ84E 5962-0422101QXC rtax2000s-cq352e 5962-0422102QXC 5962-0422104QNA rtsx32su apa600-cq208b
Text: DSCC Cross Reference Guide Table 1: Actel Part Numbers to DSCC Drawing Numbers Actel Part Number Devices A1010B A1020B Pin-Package 84-CPGA 84-CPGA 84-CQFP A1240A A1280A 132-CPGA 176-CPGA 172-CQFP A1280XL 176-CPGA 172-CQFP A1425A A1460A A14100A 132-CQFP 207-CPGA
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A1010B
84-CPGA
A1010B-PG84B
5962-9096403MXC
5962-9096403MXA
A1010B-1PG84B
A1020B
5962-9096404MXC
5962-9096404MXA
RTAX2000S
rtax2000
RTSX32SU-CQ208E
RTSX32SU-CQ84E
5962-0422101QXC
rtax2000s-cq352e
5962-0422102QXC
5962-0422104QNA
rtsx32su
apa600-cq208b
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TEA 1732
Abstract: A09 N03
Text: 1.6 PowerPC 603e Microprocessor Pinout Listings The following sections provide the pinout listings for the 603e CQFP and BGA packages. 1.6.1 Pinout Listing for the CQFP Package Table 10 provides the pinout listing for the 603e CQFP package. Table 10. Pinout Listing for the 240-pin CQFP Package
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240-pin
888888P
1234567I
TEA 1732
A09 N03
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RTAX2000S
Abstract: RTAX1000S-SL cga 624 RTAX1000S RTAX250S RTAX2000 624 CCGA SL D8 E26 RTAX4000S CCGA
Text: RTAX-S/SL RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View Note
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208-Pin
RTAX250S/SL
IO43PB2F2
IO76PB5F5/CLKGP
IO02NB0F0
RTAX2000S
RTAX1000S-SL
cga 624
RTAX1000S
RTAX250S
RTAX2000
624 CCGA
SL D8 E26
RTAX4000S
CCGA
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RTAX1000S
Abstract: RTAX250S RTAX2000S CCGA CQFP 208 RTAX2000 rtax2000* cqfp 292 CCGA RTAX-S 624 CCGA
Text: RTAX-S RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View A dv a nc ed v 0. 5
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208-Pin
RTAX250S
IO43PB2F2
IO76PB5F5/CLKGP
IO02NB0F0
IO44NB2F2
RTAX1000S
RTAX2000S
CCGA
CQFP 208
RTAX2000
rtax2000* cqfp
292 CCGA
RTAX-S
624 CCGA
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CERAMIC QUAD FLATPACK CQFP
Abstract: CQFP 240
Text: CQFP.FRM Page 1 Tuesday, February 9, 1999 4:20 PM CQFP Packaging Capabilities Surface Mount Description The Ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher lead count and smaller lead pitch than most
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GA98111PDF2/99
CERAMIC QUAD FLATPACK CQFP
CQFP 240
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Untitled
Abstract: No abstract text available
Text: 1. 6 Pow erPC 603e M icroprocessor Pinout Listings The following sections contain the pinout listings for the 603e CQFP and CBGA packages. 1.6.1 P i n o u t L is tin g for th e C Q F P P a c k a g e Table 10 provides the pinout listing for the 603e CQFP package.
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240-pin
PID6-603e
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8N07
Abstract: 030 b03 cn/A/U 237 BG
Text: 1. 6 Pow erPC 603e M icroprocessor Pinout Listings The following sections provide the pinout listings for the 603e CQFP and BGA packages. 1.6.1 P i n o u t L i s t i n g for t h e C Q F P P a c k a g e Table 10 provides the pinout listing for the 603e CQFP package.
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240-pin
PID7v-603e
8N07
030 b03
cn/A/U 237 BG
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2 010 073 007
Abstract: cqfp package outline CERAMIC QUAD FLATPACK CQFP CQFP 172 PIN
Text: AMI A M I S E M IC O N D U C T O R %s CQFP Packaging Capabilities Description Surface Mount The ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher leaad count and smaller lead pitch than most other ceramic packages. It has been provided in a
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b09 n03
Abstract: B07 P03
Text: 1. 6 Pow erPC 604e M icroprocessor Pinout Listings The following sections contain the pinout listings for the 604e C4-CQFP and BGA packages. 1.6.1 P i n o u t L i s t i n g for t h e C 4 - C Q F P P a c k a g e Table 10 provides the pinout listing for the 604e C4-CQFP package.
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PID9v-604e
b09 n03
B07 P03
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CERAMIC QUAD FLATPACK CQFP
Abstract: 8361H CY7C37512P208B-UM
Text: Cypress Semiconductor Assembly Site Transfer Qualification Report QTP# 003102 VERSION 1.0 December, 2000 160/208-pin Ceramic Quad Flatpack CQFP Alphatec, Bangkok CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069
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160/208-pin
160/208-lead
160-lead
7C375DT-GAUMB
CERAMIC QUAD FLATPACK CQFP
8361H
CY7C37512P208B-UM
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5271SC
Abstract: military mcm 1553 military mcm cpu R4400 RM5271
Text: Standard Products ACT5271SC Multichip Module Microprocessor with 2MB Secondary Cache www.aeroflex.com/Avionics May 5, 2005 FEATURES ❑ Footprint Compatible with Aeroflex-Plainview original ACT4431SC 1MB Secondary Cache MCM in a 280 lead Ceramic Quad Flat Pack CQFP
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ACT5271SC
ACT4431SC
RM5271
25MHz,
75MHz,
150MHz
R4400
R4400
64-bit
SCD5271SC
5271SC
military mcm 1553
military mcm cpu
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QL24X32B-1PQ208C
Abstract: ql24x32b PF144 PQ208 QL24X32B-1PF144C
Text: Appendix F - QL24x32B Pinout Diagrams Appendix F: QL24x32B Pinout Diagrams QL24x32B Packages Summary Total # Pins 144 208 Package Type TQFP PQFP CQFP No Connect VCC and GND 20 28 28 Clock 2 2 2 User Pins Input-Only Input/Output 6 116 6 172 6 172 Appendix F
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QL24x32B
PF144)
QL24X32B-1PF144C
QL24x32B)
QL24X32B-1PQ208C
PF144
PQ208
QL24X32B-1PF144C
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DSP96000
Abstract: DSP56000 DSP56100 DSP56166 DSP56166ROM DSP96002 brand tai hen FE60 marking ha02 Nippon capacitors
Text: Freescale Semiconductor, Inc. Order this document by DSP56166/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA DSP56166 Advance Information 16-bit General Purpose Digital Signal Processor Ceramic Quad Flat Pack CQFP Available in a 112 pin, small footprint, surface mount package.
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DSP56166/D
DSP56166
16-bit
DSP56166
DSP56100
DSP96000
DSP56000
DSP56166ROM
DSP96002
brand tai hen
FE60
marking ha02
Nippon capacitors
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FBGA-484
Abstract: A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base CQ256 land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 FG484
Text: Actel CQFP – FBGA484 Adapter Boards SI-SX32-ACQ256SFG484 and SI-SX72-ACQ256SFG484 Contents 1). Introduction 2). Appendix A – SI-SX32-ACQ256SFG484 Mechanical Drawing and Assembly instructions 3). Appendix B – SI-SX72-ACQ256SFG484 Mechanical Drawing and Assembly
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FBGA484
SI-SX32-ACQ256SFG484
SI-SX72-ACQ256SFG484)
SI-SX72-ACQ256SFG484
CQ256
FG484
SI-SX72ACQ256SFG484)
FBGA-484
A54SX32A-CQ256
actel FG484 package mechanical drawing
B22 filament base
land pattern QFP 208
SX72
A54SX32A-FG484
silicone paste p4
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QL24X32B-1PF144C
Abstract: OPTOCOUPLER 817c data sheet 77-I PF144 PQ208 QL24X32B-1PQ208C
Text: Appendix F - QL24x32B Pinout Diagrams Appendix F: QL24x32B Pinout Diagrams QL24x32B Packages Summary Total # Pins 144 208 Package Type TQFP PQFP CQFP No Connect VCC and GND 20 28 28 Clock 2 2 2 User Pins Input-Only Input/Output 6 116 6 172 6 172 Appendix F
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QL24x32B
PF144)
QL24X32B-1PF144C
QL24x32B)
QL24X32B-1PF144C
OPTOCOUPLER 817c data sheet
77-I
PF144
PQ208
QL24X32B-1PQ208C
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footprint jedec MS-026 TQFP
Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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schematic impulse sealer
Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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FG860
FG900
FG1156
schematic impulse sealer
leadframe C7025
MO-151-BAR
PG223-XC4013E
XC4010E-PQ208
BGA 31 x 31 mm
footprint jedec MS-026 TQFP 128
footprint jedec mo-067
XC4013E-PQ240
EIA standards 481
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emcp 162
Abstract: DL10 DL12 emcp TEA 2111 WT111 eMCP qualification dh29 code
Text: WC64P603EV-XQ3X RISC 603e MODULE, SECONDARY L2 CACHE ADVANCED * MAIN FEATURES • Based on RISC 603e 3.3V Microprocessor ■ Processor Clock Frequencies: 66.6, 80, 100 MHz ■ Footprint compatible with 603e µp CQFP package ■ Bus Clock Frequencies: Up to 66.6 MHz
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WC64P603EV-XQ3X
32-bit
Bus/64-bit
16KByte
512KByte
64Kx72)
Packaging240
P603E
240-Pin
emcp 162
DL10
DL12
emcp
TEA 2111
WT111
eMCP qualification
dh29 code
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JEDEC Package Code MS-026-AED
Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
Text: • Packages and Thermal Characteristics November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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schematic impulse sealer
Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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UT6325
Abstract: 484-CLGA CL484 CQFP 208 datasheet PBGA 484P UT-SG-CQ208 CQ208 QT-SG-PS484
Text: RadHard Eclipse Devices UT6325-W* 208-PQFP 9 N/A UT8RHEEB-208PC UT8RHE-SKT208P N/A N/A QT-SG-PQ208 9 UT6325-X* 208-CQFP 9 9 UT8RHEEB-208PC UT8RHE-SKT208C UT8RHE-SKT208P with proper land pads 9 UT-SG-CQ208 9 UT6325-P* 280-PBGA 9 N/A UT8RHEEB-288PC UT8RHE-SKT280P
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UT6325-W*
208-PQFP
UT8RHEEB-208PC
UT8RHE-SKT208P
UT8RHE-SKT208C
UT8RHEEB-288PC
UT8RHE-SKT280P
UT6325
484-CLGA
CL484
CQFP 208 datasheet
PBGA 484P
UT-SG-CQ208
CQ208
QT-SG-PS484
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Analog Dialogue
Abstract: la 4440 amplifier circuit diagram 300 watt ad7730 pcb circuit example cd player amplifier double ic 4440 matlab code for filter Emg signal motorcycle regulator microcontroller based water level controller circuit pcb ad7730 AD7730 weighing scale code example 0.2MF CAPACITOR
Text: A forum for the exchange of circuits, systems, and software for real-world signal processing Li-Ion BATTERY CHARGING REQUIRES ACCURATE VOLTAGE SENSING page 3 Quad-SHARC in CQFP—A 480-MFLOPS DSP Powerhouse (page 10) Ask the Applications Engineer—Capacitive Loads on Op Amps (page 19)
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480-MFLOPS
Analog Dialogue
la 4440 amplifier circuit diagram 300 watt
ad7730 pcb circuit example
cd player amplifier double ic 4440
matlab code for filter Emg signal
motorcycle regulator
microcontroller based water level controller circuit
pcb ad7730
AD7730 weighing scale code example
0.2MF CAPACITOR
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Untitled
Abstract: No abstract text available
Text: Com m ercial/Industrial D ev ice s PLCC 44 68 84 PQFP 100 144 160 208 240 RQFP 208 240 VQFP 80 TQFP 100 144 BGA 225 176 272 313 CPGA 329 84 100 132/133 175/176 207 257 CQFP 84 132 172 196 208 256 HiRel/Space D evice RadTolerant < o o 12 x CM CO X 5 A </
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1200XL
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schematic impulse sealer
Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").
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PK100
060ROM
schematic impulse sealer
qfp 64 0.4 mm pitch land pattern
Rotron
pk100 power supply
XC4013E-PQ240
EFTEC-64
XC4010E-PQ208
MO-151-AAN-1
PK100
land pattern for TSOP 2 86 PIN
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