CLDCC Search Results

WS27C210L-15

Contextual Info: WS27C210L Military 64K x 16 CMOS EPROM KEY FEATURES • JEDEC Standard Pin Configuration Ultra-High Performance — 40 Pin CERDIP Package — 44 Pin Leadless Chip Carrier CLLCC — 44 Pin Leaded Chip Carrier (CLDCC) — 120 ns Access Time DESC SMD No. 5962-86805

0542

Contextual Info: Package Information Drawing L3 – 32-Pin Ceramic Leaded Chip Carrier CLDCC – CERQUAD (Package Type L) D D1 3 2 1 32 E1 E C B1 A2 B e1 D3 A1 E3 E2 A D2 Family: Ceramic Leaded Chip Carrier – CERQUAD Millimeters Symbol Min Max Inches Notes Min Max A 3.30

Q2220

Contextual Info: FEATU R ES • Low-Cost, High Resolution 50 MHz Direct Digital Synthesizer • Simple-to-Use Parallel Frequency Control Interface • Frequency Resolution: < 3.0 Hz with System Clock Frequency = 50 MHz • Compact 44-pin PLCC Package 44-pin CLDCC for MIL version

CLDCC

Abstract: cllcc transistor smd j4 WS57C128FB WS57C256F "16k x 8"
Contextual Info: FAMILY OF HIGH PERFORMANCE CMOS EPROMs PART NUMBER PAGE NO. DENSITY SPEED ARCHITECTURE BITS (ns) WS57C128FB 3-7 128K 16K x 8 WS57C256F 3-13 256K 32K x 8 DRAWING NO. NO. OF PINS 35 –70 C2 D2 J4 L3 32 28 32 32 CLLCC CERDIP, 0.6" PLDCC CLDCC 35 –70 C2 D2

Q2220

Abstract: AN2334-4 821575-1 Q2220I-50N Q0320 Qualcomm DDS Qualcomm an2334 Q0320-2 Qualcomm dac Q2220I50N
Contextual Info: CIPCC PACKAGING 02220M -40H The Q2220M-40L is packaged in a 44-pin ceramic leaded chip carrier (CLDCC (Figure 7). Dimensions are given in inches (mm!. Figure 7. CLDCC Padcaging .0 0 6 .0 1 0 (.1 5 2 -2 5 4 ) .030 ( .7 6 2 ) T Y P .— .0 1 7 (.4 3 2 ) T Y P .- H

D-1632

Abstract: 27C010 wsi
Contextual Info: WS27C010L LOW POWER 1 MEG 128K x 8 CMOS EPROM KEY FEATURES • High Performance CMOS — * DESC SMD No. 5962-89614 je d e C Standard Pin Configuration 90 ns Access Time • • Standby Current <100 |JA — 32 Pin CERDIP Package 32 Pin Leaded Chip Carrier (CLDCC)

CERQUAD

Contextual Info: Package Information Drawing L5 – 68-Pin Pocketed Ceramic Leaded Chip Carrier CLDCC – CERQUAD (Package Type L) D D1 3 2 1 68 E1 To reduce lead damage, lead tips reside in pockets on the bottom of the package. E View A B1 C A2 View A e1 B D3 D2 A1 E3 E2

CERQUAD

Abstract: D1128
Contextual Info: Package Information Drawing L2 – 28-Pin Ceramic Leaded Chip Carrier CLDCC – CERQUAD (Package Type L) 3 2 D D1 1 28 E1 E C B1 A2 B A1 D3 e1 A E3 D2 E2 Family: Ceramic Leaded Chip Carrier – CERQUAD Millimeters Symbol Min Max Inches Notes Min Max A 3.94

Contextual Info: WS27C210L Military 64 K x 16 CMOS EPROM KEY FEATURES Ultra-High Performance JEDEC Standard Pin Configuration — 120 ns Access Time — 40 Pin CERDIP Package — 44 Pin Leadless Chip Carrier CLLCC — 44 Pin Leaded Chip Carrier (CLDCC) DESC SMD No. 5962-86805

27C010L

Contextual Info: WS27C010L LOW POWER 1 MEG 128Kx 8 CMOS EPROM KEY FEATURES High Performance CMOS • DESC SMD No. 5962-89614 • JEDEC Standard Pin Configuration — 90 ns Access Time Standby Current <100 pA — 32 Pin CER d ip Package 32 Pin Leaded Chip Carrier (CLDCC)

WS27C210L-15

Abstract: WS27C210L-15CMB
Contextual Info: WS27C210L Military 64K x 16 CMOS EPROM KEY FEATURES • JEDEC Standard Pin Configuration Ultra-High Performance — 120 ns Access Time — 40 Pin CERDIP Package DESC SMD No. 5962-86805 EPI Processing — 44 Pin Leadless Chip Carrier CLLCC — 44 Pin Leaded Chip Carrier (CLDCC)

qualcomm

Contextual Info: JU L 2 9 1993 02220 DIRECT DKHTAL SYNIHESIZER SÍ y „*»- i'-x *v - ‘•'•váifí' #K¡ ' ’ ‘/ ' Q / u a u x v w v a VLSI Products CONTENTS PLCC PACKAGING Q2220I-50N . 13 FEATURES. 3 CLDCC PACKAGING

L 0742

Abstract: CERQUAD CLDCC
Contextual Info: Package Information Drawing L6 – 52-Pin Ceramic Leaded Chip Carrier CLDCC – CERQUAD (Package Type L) D D1 3 2 1 52 51 E1 E .025 .045 R View A C B1 A2 e1 B D3 D2 A1 View A E3 E2 A Family: Ceramic Leaded Chip Carrier – CERQUAD Millimeters Symbol Min

CERQUAD

Abstract: 0656 CLDCC
Contextual Info: Package Information Drawing L4 – 44-Pin Pocketed Ceramic Leaded Chip Carrier CLDCC – CERQUAD (Package Type L) D D1 3 2 1 44 E1 View A E Commercial and Industrial packages include the lead pocket on the underside of the package but Military packages do not.

Contextual Info: WS27C210L Military 64K x 16 CMOS EPROM KEY FEATURES Ultra-High Performance • JEDEC Standard Pin Configuration — 120 ns Access Time — 40 Pin CERDIP Package — 44 Pin Leadless Chip Carrier CLLCC — 44 Pin Leaded Chip Carrier (CLDCC) DESC SMD No. 5962-86805

Q2230

Abstract: Qualcomm an2334 Qualcomm DDS Q2520
Contextual Info: 02230 DIRECT M Gim i SYNTHESIZER • ■ Q ■ u ■ a ■ l q ■ c v ■ w ■ m I ^ » ^ ^ V T S J Products ■ O TH ER Q U ALC O M M VLSI PR O DU CTS • Dual Direct Digital Synthesizer CONTENTS PQFP PACKAGING

CS10

Abstract: PQFP44 PSD211R ZPSD211R ZPSD211RV psd3xx
Contextual Info: PSD211R ZPSD211R, ZPSD211RV Low Cost Field Programmable Microcontroller Peripherals FEATURES SUMMARY • Single Supply Voltage: Figure 1. Packages – 5 V±10% for PSD211R and ZPSD211R – 2.7 to 5.5 V for ZPSD211RV ■ Up to 256 Kbit of EPROM ■ Input Latches

57C128FB-70

Abstract: WS57C128FB WS57C128FB-35 WS57C128FB-45 WS57C128FB-55 WS57C128FB-70
Contextual Info: WS57C128FB HIGH SPEED 16K x 8 CMOS EPROM KEY FEATURES • Very Fast Access Time • Standard EPROM Pinout • DIP and Surface Mount Packaging — 35 ns • Low Power Consumption • EPI Processing Available — Latch-up Immunity Up to 200 mA GENERAL DESCRIPTION

LSI LOGIC

Abstract: 4x4 bit multipliers kt 714 metal detector plans types of 4x4 binary multipliers
Contextual Info: LSI LOGIC LCA100K Compacted Array Plus Series 0.7-Micron HCMOS Preliminary The LCA100K Compacted Array Plus series is an HCMOS array-based ASIC product offering ex tremely high performance, combined with very high gate counts. The LCA100K series is manufactured

57C256f

Abstract: military part marking symbols 57C256 WS57C256F-55DMB WS57C256F-35J 57C256F-55 WS57C256F WS57C256F-35 WS57C256F-45 WS57C256F-55
Contextual Info: WS57C256F HIGH SPEED 32K x 8 CMOS EPROM KEY FEATURES • Immune to Latch-UP • Fast Access Time — t ACC = 35 ns — Up to 200 mA • ESD Protection Exceeds 2000 Volts • Available in 300 Mil DIP and PLDCC • DESC SMD No. 5962-86063 — t CE = 35 ns • Low Power Consumption

PSD4xx

Abstract: 413A2 psd403a2-c-90 PSD402A2-C-70J 80C196 PSD401A1C90
Contextual Info: PSD4XX Family PSD4XX/ZPSD4XX Field-Programmable Microcontroller Peripherals February, 1999 47280 Kato Road, Fremont, California 94538 Tel: 510-656-5400 Fax: 510-657-8495 800-TEAM-WSI 800-832-6974 Web Site: waferscale.com E-mail: info@waferscale.com Return to Main Menu

H12A5

Abstract: 22 35L CAPacitor 50/WS57C49C-25J
Contextual Info: WS57C49C HIGH SPEED 8Kx 8 CMOS PROM/RPROM KEY FEATURES • Ultra-Fast Access Time — *acc = 25 ns • Pin Compatible with Bipolar PROMs • Immune to Latch-UP — tc s = 12 ns — Up to 200 mA • Low Power Consumption • Fast Programming • ESD Protection Exceeds 2000 V

PSD303

Abstract: PSD301 PSD302
Contextual Info: Programmable Peripheral PSD303 Field-Programmable Microcontroller Peripheral Key Features □ Single Chip Programmable Peripheral for Microcontroller-based Applications □ 19 Individually Configurable I/O pins that can be used as: — — — — Microcontroller I/O port expansion

TIL32

Abstract: 80196 sample programs sab 80c196
Contextual Info: Programmable Peripheral PSD5XX Family Field-Programmable Microcontroller Peripherals Preliminary Key Features □ Complete family of Field Programmable Microcontroller Peripherals enables the user to efficiently implement a highly integrated embedded control system in a short time. The