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    CHOMERICS Search Results

    CHOMERICS Datasheets (15)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    05-0720-0432-02 Chomerics ACCESS SHIELD WRAP KNITTED WIRE MESH SHIELDING TAPE 1INCH Original PDF
    61-15-0808-1671 Chomerics Accessories, Thermally Conductive Elastomer Insulators Original PDF
    82-122-74004-00600 Chomerics Accessories, SOFT-SHIELD Conductive Jacket over Foam EMI Gaskets Original PDF
    82-122-74013-01269 Chomerics Accessories, SOFT-SHIELD Conductive Jacket over Foam EMI Gaskets Original PDF
    82-122-74013-01685 Chomerics Accessories, SOFT-SHIELD Conductive Jacket over Foam EMI Gaskets Original PDF
    82-122-74020-00240 Chomerics Accessories, Conductive Jacket over Foam continued Low Closure Force EMI Gaskets Original PDF
    82-122-74020-00330 Chomerics Accessories, Conductive Jacket over Foam continued Low Closure Force EMI Gaskets Original PDF
    82-122-74020-00680 Chomerics Accessories, Conductive Jacket over Foam continued Low Closure Force EMI Gaskets Original PDF
    82-122-74020-09600 Chomerics Accessories, Conductive Jacket over Foam continued Low Closure Force EMI Gaskets Original PDF
    82-122-74031-00600 Chomerics Accessories, SOFT-SHIELD Conductive Jacket over Foam EMI Gaskets Original PDF
    82-122-74031-01685 Chomerics Accessories, SOFT-SHIELD Conductive Jacket over Foam EMI Gaskets Original PDF
    82-122-74037-01175 Chomerics Accessories, SOFT-SHIELD Conductive Jacket over Foam EMI Gaskets Original PDF
    82-122-74048-00240 Chomerics Accessories, Conductive Jacket over Foam continued Low Closure Force EMI Gaskets Original PDF
    82-122-74048-00330 Chomerics Accessories, Conductive Jacket over Foam continued Low Closure Force EMI Gaskets Original PDF
    82-122-74048-00680 Chomerics Accessories, Conductive Jacket over Foam continued Low Closure Force EMI Gaskets Original PDF

    CHOMERICS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    cho-bond 1086

    Abstract: cho-bond 1075 Cho-Bond 584-29 cho-bond 1029 584-29 cho-bond primer 1086 RTV silicone viscosity 51-00-1035-0000 50-02-1075-0000 CHO-SEAL 1285
    Text: CONDUCTIVE COMPOUNDS CHO-BOND Conductive Adhesives Single- and two-component epoxy and silicone adhesives, with room temperature, elevated temperature or moisture cure mechanisms. Epoxies for Microelectronics Chomerics’ growing family of conductive epoxies now includes one-part, silver-filled pastes formulated for today’s


    Original     		PDF MIL-I-45208. cho-bond 1086 cho-bond 1075 Cho-Bond 584-29 cho-bond 1029 584-29 cho-bond primer 1086 RTV silicone viscosity 51-00-1035-0000 50-02-1075-0000 CHO-SEAL 1285

    1278n

    Abstract: S6305 chomerics MIL-G-83528 Cho-Seal 1298 S6305 CHO-SEAL 1215 Cho-Seal s6305 3M Nextel EPDM fungus resistance CEPS-0002
    Text: CONDUCTIVE ELASTOMERS ® CHO-SEAL & CHO-SIL Conductive Elastomers Since 1961, Chomerics has invented and extended virtually every aspect of conductive elastomer materials technology — from the earliest silver and silver/copper filled silicones to the


    Original     		PDF MIL-G-83528 MIL-G-83528, 1278n S6305 chomerics Cho-Seal 1298 S6305 CHO-SEAL 1215 Cho-Seal s6305 3M Nextel EPDM fungus resistance CEPS-0002

    T410R

    Abstract: No abstract text available
    Text: 371824B00034G - heatsinks for BGA Devices Page 1 of 2 Tel toll-free : +1-855-32-AAVID Register Log in Search Home Products Solutions Aavid Design Tools & Docs Contact Company Online Store » BGA Heat Sinks 371824B00034G Need assistance? Call us: 1-855-32-AAVID


    Original     		PDF 371824B00034G 1-855-32-AAVID 371824B00034G T410R com/products/bga/371824b00034g

    SAS 251

    Abstract: S6305 14f1 FS1-S01-14C1 SAS Connector pcb layout 19220 port
    Text: 8 7 6 5 3 4 1 2 REVISIONS REV. DESCRIPTION DATE APPROVED ELASTOMERIC GASKET OPTION ADDED SEP 15/09 ZLJ DETAIL J ADDED JAN 14/10 ZLJ ECN V Z F F FS1-S01-1XXX MOUNTING SCREW OPTION 1 = 8 mm MOUNTING SCREW SHIPPED BULK IN SAME TRAYS WITH CAGE ASSEMBLIES 2 = NO MOUNTING SCREW SUPPLIED


    Original     		PDF FS1-S01-1XXX S6305 123XX P-FS1-S01-1XXX SAS 251 S6305 14f1 FS1-S01-14C1 SAS Connector pcb layout 19220 port

    250 mhz IBM PowerPC Processor

    Abstract: EMPPC740 interface 740 IBM PowerPC 740 reference manual emppc750 IBM PowerPC 250 EMPPC750L
    Text: PowerPC 740TM and PowerPC 750TM Embedded Microprocessor Datasheet IBM CMOS 0.20 µm Copper Technology EMPPC740L and EMPPC750L Version 1.51 7/15/99 IBM Microelectronics Division Notices Before using this information and the product it supports, be sure to read the general information on the


    Original     		PDF 740TM 750TM EMPPC740L EMPPC750L 250 mhz IBM PowerPC Processor EMPPC740 interface 740 IBM PowerPC 740 reference manual emppc750 IBM PowerPC 250 EMPPC750L

    powerpc 750l compatible

    Abstract: PowerPC 750 IBM25ppc750L PID8p-750 PID-8p
    Text: PowerPC 750TM SCM RISC Microprocessor for the PID8p-750 Version 2.0 09/30/1999 IBM Microelectronics Division Notices Before using this information and the product it supports, be sure to read the general information on the back cover of this book. Trademarks


    Original     		PDF 750TM PID8p-750 PID8p750. powerpc 750l compatible PowerPC 750 IBM25ppc750L PID8p-750 PID-8p

    M83528

    Abstract: WR340 flange dimensions OSD-6411A wr 2300 flange waveguide Waveguide Gaskets 20-03-3731-1212 CMR-137 WR137 gasket dimensions RG-106 wr 2300 waveguide flange
    Text: CONDUCTIVE ELASTOMERS Waveguide Gaskets Waveguide Gaskets CHO-SEAL CHO-SEAL 1212 1239 SPECIFICATIONS Type Ref: MIL-G-83528 Volume Resistivity (ohm-cm, max) as supplied (without pressure-sensitive adhesive) K G 0.005 0.007 Hardness (Shore A ±5) 80 80 Specific Gravity (±0.25)


    Original     		PDF MIL-G-83528) M83528 WR340 flange dimensions OSD-6411A wr 2300 flange waveguide Waveguide Gaskets 20-03-3731-1212 CMR-137 WR137 gasket dimensions RG-106 wr 2300 waveguide flange

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor MPC8349EEC Rev. 2, 5/2005 Advance Information MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8349E contains a PowerPC processor core with system logic required for networking, storage, and general-purpose embedded applications. For functional


    Original     		PDF MPC8349EEC MPC8349E MPC8349E

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor MPC8349EEC Rev. 8, 2/2007 Technical Data MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8349E PowerQUICC™ II Pro is a next generation PowerQUICC II integrated host processor. The MPC8349E contains a PowerPC™ processor core built on Power


    Original     		PDF MPC8349EEC MPC8349E MPC8349E

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Technical Data Document Number: MPC8533EEC Rev. 0, 04/2008 MPC8533E PowerQUICC III Integrated Processor Hardware Specifications 1 MPC8533E Overview This section provides a high-level overview of MPC8533E features. Figure 1 shows the major functional units within


    Original     		PDF MPC8533EEC MPC8533E MPC8533E 32-bit 32-Kbyte

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor MPC8347EEC Rev. 2, 5/2005 Advance Information MPC8343E PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8343E contains a PowerPC processor core with system logic required for networking, storage, and general-purpose embedded applications. For functional


    Original     		PDF MPC8347EEC MPC8343E MPC8349E MPC8343EEC

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Document Number: MPC8377EEC Rev. 7, 10/2011 Technical Data MPC8377E PowerQUICC II Pro Processor Hardware Specifications This document provides an overview of the MPC8377E PowerQUICC II Pro processor features, including a block diagram showing the major functional components. This


    Original     		PDF MPC8377EEC MPC8377E

    flotherm

    Abstract: Nippon capacitors
    Text: MPE603E7TEC/D Motorola Order Number 1/1999 REV. 2.0 ª Advance Information EC603e Ô Embedded RISC Microprocessor (PID7t) Hardware SpeciÞcations The EC603e microprocessor from Motorola is an implementation of the PowerPCª family of reduced instruction set computing (RISC) microprocessors. The EC603e


    Original     		PDF MPE603E7TEC/D EC603e EC603e MPC603e flotherm Nippon capacitors

    uPD71054

    Abstract: PD71054 8259 programmable interval timer
    Text: AIP-8d 8 Channel Analogue Input Board User Manual AIP-8d User Manual Document Part N° Document Reference Document Issue Level 0127-1004.doc AIP-8d\.\0127-1004.doc 2.0 Manual covers PCBs identified AIP-8d Rev. C All rights reserved. No part of this publication may be reproduced, stored in any retrieval system, or


    Original     		PDF

    PC7448

    Abstract: microprocessor DIODE 921 LGA PACKAGE thermal resistance Freescale powerpc 7448
    Text: PC7448 PowerPC 7448 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 3000 Dhrystone 2.1 MIPS at 1.3 GHz Selectable Bus Clock 30 CPU Bus Dividers up to 28x Selectable MPx/60x Interface Voltage (1.5V; 1,8V; 2.5V)


    Original     		PDF PC7448 MPx/60x 64-bit 36-bit Hz/166 0814D microprocessor DIODE 921 LGA PACKAGE thermal resistance Freescale powerpc 7448

    PC8640

    Abstract: openpic
    Text: PC8640 and PC8640D Power Architecture Integrated Processor Datasheet - Preliminary Specification Features • • • • • • • • • • • • • Dual-e600 Power Architecture Processor Cores PD Typically 21.7W at 1.25 GHz VDD = 1.05V Selectable MPX Bus up to 600 MHz (64 bits)


    Original     		PDF PC8640 PC8640D Dual-e600 125Gbaud) 64-bit 0948C openpic

    pci slot pinout

    Abstract: e2v GTX 120 PC8640
    Text: PC8640 and PC8640D Power Architecture Integrated Processor Datasheet Features • • • • • • • • • • • • • Dual-e600 Power Architecture Processor Cores PD Typically 21.7W at 1.25 GHz VDD = 1.05V Selectable MPX Bus up to 600 MHz (64 bits)


    Original     		PDF PC8640 PC8640D Dual-e600 125Gbaud) 64-bit Chan49 0948E pci slot pinout e2v GTX 120

    Untitled

    Abstract: No abstract text available
    Text: PC7448 PowerPC 7448 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 3000 Dhrystone 2.1 MIPS at 1.3 GHz Selectable Bus Clock 30 CPU Bus Dividers up to 28x Selectable MPx/60x Interface Voltage (1.5V; 1.8V; 2.5V)


    Original     		PDF PC7448 MPx/60x 64-bit 36-bit Hz/166 0814G

    AOP-8

    Abstract: 200H H300 H301
    Text: AOP-8 8 Channel Analogue Output Board User Manual AOP-8 User Manual Document Part N° Document Reference Document Issue Level 0127-1011 0127-1011.Doc 1.0 Manual covers PCBs identified AOP-8 Rev. B All rights reserved. No part of this publication may be reproduced, stored in any retrieval system, or


    Original     		PDF

    PC MOTHERBOARD CIRCUIT diagram of LG computers

    Abstract: AD585 AIP-24 H300 H301 H302 lm35 to 1-5 volts
    Text: AIP-24 24 Channel Analogue Input Board User Manual AIP-24 User Manual Document Part N° Document Reference Document Issue Level 0127-1012 0127-1012.Doc 1.2 Manual covers PCBs identified AIP-24 Rev F All rights reserved. No part of this publication may be reproduced, stored in any retrieval system, or


    Original     		PDF AIP-24 AIP-24 PC MOTHERBOARD CIRCUIT diagram of LG computers AD585 H300 H301 H302 lm35 to 1-5 volts

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    Untitled

    Abstract: No abstract text available
    Text: ffc14 ^ Pll rI aa «1 CHAUN-CHOUNG- TECHNOLOGY CORP. U ^ 7 U ^ 7 HEAT PIPE DEPARTMENT J_ NO. 184, CHUNG HSING N. ST., SANCHUNG CITY, TAIPEI, TAIWAN, R.G.C TEL: 886-2-9952666-8 FAX: 886-2-9958258-9 fS □ /b APPROVAL SHEET CCI PART NAME : COST REDUCED BROOKDALE-G WSHS


    OCR Scan     		PDF 849602B 45X52 83X29 83X24 05X19 00C849602B 332C8 9601A 3321817902B

    UX31

    Abstract: No abstract text available
    Text: 4 2 3 NOTE: [TjM a rkin g i The Supplier ID format is C C C 2 Y W W . X X X Vendor tracking nunber Work week “the product was nomufactured Year the product was manufactured 2 ] M a r k in g : B B In te l P a r t Number 3, C LIP MUST STAY ATTACHED TD HEATSINK


    OCR Scan     		PDF 351830301A 334C846101A 335I830302A D2/16/' D2/16/ UX31

    Untitled

    Abstract: No abstract text available
    Text: IBM PowerPC 750 SCM RISC Microprocessor PID8P-750 Preface The PowerPC PID8p-750 microprocessor is an implementation of the PowerPC family of reduced instruc­ tion set computer RISC microprocessors. In this document, the term “PID8p-750” is used as an abbreviation


    OCR Scan     		PDF PID8P-750 PID8p-750 PID8p-750â