DS2501
Abstract: tsoc package dallas ds2501 dallas ds2501 Datasheet ds2501 Datasheet DS25M02 DS2401 DS2405 6 lead tsoc package DS2423
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: 11/19/98 Subject: PRODUCT CHANGE NOTICE - I80901 Description: Qualifying ChipPac China for 6 lead TSOC Package
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I80901
DS2401
DS2405
DS2502
DS2505
DS24A30
DS2501
DS2407
DS9502
DS25S02
DS2501
tsoc package
dallas ds2501
dallas ds2501 Datasheet
ds2501 Datasheet
DS25M02
DS2401
DS2405
6 lead tsoc package
DS2423
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JESD51-2
Abstract: exposed QFP 144 100L JESD51-7 Techpoint
Text: MQFP-ed Exposed Drop-in Heat Slug Metric Quad Flat Pack • 14 x 20mm to 32 x 32mm • 100 to 240 lead count • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 14 x 20mm to 32 x 32mm STATS ChipPAC’s Exposed Drop-In Heat Slug Metric Quad
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Hyundai 9944
Abstract: nseb ds1000m-100 DS2165Q
Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS ChipPac, C 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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DS1000M-100
DS1000
DH927108AJC
DS87C520
DN901118AAB
Hyundai 9944
nseb
DS2165Q
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dallas date code ds12887
Abstract: dallas date code P23073 DS1225A DALLAS DS80C320 9832 P23403 dallas date code ds80c320 P23074
Text: RELIABILITY MONITOR STRESS: ULTRASOUND CONDITIONS: J-STD-020 MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS1233 A5 JAN 99 P23064 9842 CARSEM DM823017AB SOT-223 DS1803 A2 NOV 98 P22797 9833 CHIPPAC, KOREA DS1869 A3 MAR 99 P23360
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J-STD-020
DM823017AB
DS1233
DS1803
DS1869
DS2109
DS2153
DS2175
DS5002
P23064
dallas date code ds12887
dallas date code
P23073
DS1225A
DALLAS DS80C320
9832
P23403
dallas date code ds80c320
P23074
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Techpoint
Abstract: 100L JESD51-2 JESD51-7 lqfp 7x7 tray QFP 128 bonding
Text: LQFP Low Profile Quad Flat Pack • 7 x 7mm to 28 x 28mm body sizes • 32 to 208 lead counts • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 28 x 28mm STATS ChipPAC’s LQFP is a low profile 1.4mm version of the QFP. The LQFP is a leadframe based, plastic encapsulated
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100L
Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint
Text: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP
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STATS ChipPAC
Abstract: AN 7823 EP 603 LQFP Package LQFP Package tray QFP JEDEC tray 64 leads qfp 32 QFP PACKAGE thermal resistance Techpoint
Text: QFP-SD Stacked Die Quad Flat Pack • Stacking of die enables more functionality and integration in a conventional QFP package FEATURES DESCRIPTION • Combining devices into one package reduces PCB real estate and cost STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die
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PDIP28 PACKAGE
Abstract: chippac M28256 PDIP28 QREE0032
Text: QREE0032 QUALIFICATION REPORT PDIP28 ChipPAC Assembly Plant Transfer Using the M28256 THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify the transfer of the assembly plant of our subcontractor ChipPAC from Korea to China for PDIP28 package Plastic Dual
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QREE0032
PDIP28
M28256
PDIP28
M28256
32Kx8
PDIP28 PACKAGE
chippac
QREE0032
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dallas date code ds1230
Abstract: No abstract text available
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS1620 D1 JUN '01 27096 0109 CPS ChipPac, China DH046190AAI SOIC 50 50 DS1869 A3 JUN '00
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DH046190AAI
DS1620
DS1869
DH833210AAB
DS5002
DN028766AAD
DN030363AAA
J-STD-020
DS1302
dallas date code ds1230
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DS-1000
Abstract: DS1302 DIE REVISION DH020 ds1000m-100 25409
Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
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DS1000M-100
DS1000
DH927108AJC
J-STD-020
30C/60%
DS-1000
DS1302 DIE REVISION
DH020
25409
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DS87520
Abstract: P2305 P23855
Text: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 DH833179ADA 8 PIN PDIP CHIPPAC, CHINA CPS 9847 PROCESS Single Poly, Single Metal 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
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DS1000M-100
DS1000
DH833179ADA
P23057
P23178
DN825394AAB
P23415
P23306
P23307
J-STD-020
DS87520
P2305
P23855
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DM92
Abstract: DM-92 472E-06
Text: RELIABILITY MONITOR DS1232L APR '99 MONITOR-CHIPPAC,KOREA DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1232L C2 SOIC 150 CPK ChipPac, K 9848 PROCESS Single Poly, Single Metal DL829603AAC 8 0.8 µm Standard Process JOB NO DESCRIPT
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DS1232L
DL829603AAC
DM92
DM-92
472E-06
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DS87520
Abstract: dm8304 P2271 DS2165Q
Text: RELIABILITY MONITOR DS1232L OCT '98 MONITOR-HYUNDAI,KOREA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1232L C1 DL817678ABB 8 PIN SOIC CHIPPAC, KOREA 9830 PROCESS Single Poly, Single Metal 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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DS1232L
DL817678ABB
P22755
P22778
J-STD-020
DS87520
DN825394AAB
DS87C520
P23306
dm8304
P2271
DS2165Q
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JESD51-7
Abstract: 100L JESD51-2 STATS ChipPAC Techpoint
Text: MQFP Metric Quad Flat Pack • 10 x 10mm to 32 x 32mm body sizes • 44 to 240 lead counts • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 10 x 10mm to 32 x 32mm STATS ChipPAC’s Metric Quad Flat Pack MQFP is a leadframe based, plastic encapsulated package with gull
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80mmC
JESD51-7
100L
JESD51-2
STATS ChipPAC
Techpoint
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HCA8001AIB
Abstract: hca8001 HCA8001IB ca3080e HIP51222 CDP65C51AE2 HAA9P-51635R2869 hip51222db CDP68HC68R2E HIP6008CB
Text: PRODUCT CHANGE NOTICE Refer to: PCN00067 Date: 8/25//00 Intersil’s Agreement with ChipPAC Notice of Qualification of ChipPAC Sites for Commercial SOIC, PLCC and PDIP Products I N T E R S I L C O R P O R A T I O N Ã ÃÃ| Post Office Box 883 | Melbourne, FL USA 32902-0883 | Telephone 407-724-7000 | www.intersil.com
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PCN00067
PCN00061)
HC55185ECM96R4854
HC55185ECMR4854
HC55185FCM
HC55185FCM96
HC55185X
HC5523IM
HC5523IMR4706
HC5523IMR4722
HCA8001AIB
hca8001
HCA8001IB
ca3080e
HIP51222
CDP65C51AE2
HAA9P-51635R2869
hip51222db
CDP68HC68R2E
HIP6008CB
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74 HTC 00
Abstract: 74 HTC 08 DS1302 DIE REVISION Hyundai 9944
Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
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DS1000M-100
DS1000
DH927108AJC
DK935356AAB
J-STD-020
30C/60%
74 HTC 00
74 HTC 08
DS1302 DIE REVISION
Hyundai 9944
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25821
Abstract: dallas date code ds12887 25854
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 MAR '00 25224 9950 OSEP DE940040AAC SOIC 50 50 DS1869 A3 JUN '00 25547 0017 CPS ChipPac, China DH833210AAB SOIC
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DS1621
DS1869
DE940040AAC
DH833210AAB
DS2181A
DS5002
DE004552ABD
DN012259AAL
DN028766AAD
25821
dallas date code ds12887
25854
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AN 7823
Abstract: 100L JESD51-2 JESD51-7 Techpoint
Text: MQFP-d Heat Spreader Metric Quad Flat Pack • 14 x 14mm to 32 x 32mm • 64 to 240 lead count • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 14 x 14mm to 32 x 32mm STATS ChipPAC’s Heat Spreader Metric Quad Flat Pack MQFP-d is a thermally enhanced version of the QFP
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megatron
Abstract: SN60
Text: NETPAC Präzisions - Widerstandsnetzwerke ChipNet • • • • 3 - 16 Pin SIP Netzwerk SMD - Chip bestückt, sehr variabel Sonderlayouts auf Anfrage andersartige Bauelemente möglich ChipPac • • • • 4 - 16 Pin SIP Arrays Kombinationen mit anderen Bauelementen
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exposed QFP 144
Abstract: exposed QFP 128 TQFP-EP AN 7823 EP 603 QFP-EP 100L 144L JESD51-2 JESD51-7
Text: QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 24 x 24mm STATS ChipPAC’s Exposed Pad Quad Flat Pack QFP-ep is a thermally enhanced version of the QFP package. Thermal
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power amplifier ic ta2040
Abstract: Nokia 6100 LCD TA2040 Transceiver Broadcom 3G RF interfacing 8051 with bluetooth modem Tripath TA2040 AMPLIFIER pixelworks L7205 tft interface with 8051 trw radar ac
Text: SEMICONDUCTOR TIMES JULY 2000 / 1 JULY 2000 FOCUSED ON EMERGING SEMICONDUCTOR COMPANIES Radar Scope Bay Microsystems Bay Microsystems was recently founded to develop chips. What kind? The company wouldn’t disclose any details to us. One rumor is “high-speed interfaces” whatever
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IMX6 security reference
Abstract: No abstract text available
Text: Hardware Development Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors IMX6DQ6SDLHDG Rev 1 06/2013 How to Reach Us: Information in this document is provided solely to enable system and software Home Page: freescale.com implementers to use Freescale products. There are no express or implied copyright
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cmos static ram 1mx8 5v
Abstract: No abstract text available
Text: K5P6480YCM - T085 Document Title Multi-Chip Package MEMORY 64M Bit 8Mx8 Nand Flash Memory / 8M Bit (1Mx8/512Kx16) Full CMOS SRAM Revision History Revision No. History Draft Date Remark 0.0 Initial issue. Nov. 19th 2000 Advanced Information 0.1 -Changed Operating Voltage from 2.4V - 3.0V to 2.7V - 3.3V
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K5P6480YCM
1Mx8/512Kx16)
K5P6480TCM-T085
K5P6480YCM-T085
69-Ball
08MAX
cmos static ram 1mx8 5v
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IC HXJ 2038
Abstract: 1N52398 DB5T tfk 102 cny 70 hxj 2038 rca 40361 transistor rca 40362 TFK 680 CNY 70 Diode Equivalent 1N34A 2n5952 equivalent
Text: The Engineering Staff of TEXAS INSTRUMENTS INCORPORATED Components Group The T ransistor and Diode Data Book for Design Engineers T e x a s In s t r u m e n t s IN CO RPO RATED TYPE NUMBER INDEX GLOSSARY TRANSISTOR SELECTION GUIDES TRANSISTOR INTERCHANGEABILITY
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OCR Scan
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