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    PCN0712

    Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
    Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array


    Original     		PCN0712 CEL-9750ZHF10AKL GE-100LFCS GE-100LFCS PCN0712 GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100 PDF

    M82172G-13

    Abstract: GE-100L CEL-9750ZHF10AKL CEL9750 M82154G-13 CEL-9750 M82154-13 GE100L M82108G-13 M82152G-13
    Text: October 30, 2009 CN-103009 Customer Notification M821XX Second Source Assembly Site Dear Valued Customer: This notification is for the purpose of informing you of a second assembly site for the products listed below. Purpose To assure long term supply for the M821XX product family, Mindspeed is qualifying a second assembly site at ASE


    Original     		CN-103009 M821XX M82104-13 M82152-13 M82170-13 M82172G-13 M82104G-13 M82152G-13 M82170G-13 M82172G-13 GE-100L CEL-9750ZHF10AKL CEL9750 M82154G-13 CEL-9750 M82154-13 GE100L M82108G-13 M82152G-13 PDF