cdfp3-f28
Abstract: dip 28 dimension
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K28.A MIL-STD-1835 CDFP3-F28 (F-11A, CONFIGURATION B) A e 28 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN
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MIL-STD-1835
CDFP3-F28
F-11A,
038mm)
cdfp3-f28
dip 28 dimension
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PDF
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DG509A
Abstract: CERAMIC FLATPACK 20pin dg509aal
Text: SCOPE: MONOLITHIC CMOS, ANALOG MULTIPLEXER Device Type 01 02 Generic Number DG508AA x /883B DG509AA(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter K L P Z Mil-Std-1835 GDIP1-T16 or CDIP2-T16 CDFP4-16
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DG508AA
/883B
DG509AA
/883B
Mil-Std-1835
GDIP1-T16
CDIP2-T16
CDFP4-16
DG509A
CERAMIC FLATPACK 20pin
dg509aal
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PDF
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Untitled
Abstract: No abstract text available
Text: MECHANICAL DATA MCDF001 – JANUARY 1997 HBK R-CDFP-F32 CERAMIC DUAL FLATPACK 0.006 (0,15) 0.004 (0,10) 0.117 (2,97) 0.097 (2,46) 0.033 (0,84) 0.027 (0,69) 0.336 (8,53) 0.324 (8,23) 0.310 (7,87) 0.290 (7,37) 0.415 (10,54) 0.405 (10,29) 16 17 0.755 (19,18)
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MCDF001
R-CDFP-F32)
4073159/A
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PDF
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R-CDFP-F20
Abstract: No abstract text available
Text: MECHANICAL DATA MHRR001 – MAY 1995 HR R-CDFP-F20 CERAMIC DUAL FLATPACK 0.100 (2,54) MIN 1 20 0.050 (1,27) TYP 0.715 (18,16) 0.685 (17,39) 0.022 (0,56) 0.015 (0,38) 10 11 0.500 (12,70) 0.480 (12,19) 0.370 (9,40) 0.250 (6,35) 0.035 (0,89) 0.025 (0,64) 0.100 (2,54)
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MHRR001
R-CDFP-F20)
R-CDFP-F20
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dual flatpack
Abstract: 634 transistor
Text: MECHANICAL DATA MCDF002 – NOVEMBER 1995 HKD R-CDFP-F50 CERAMIC DUAL FLATPACK 0.665 (16,90) 0.634 (16,10) 1 50 0.031 (0,80) 0.843 (21,40) 0.811 (20,60) 0.766 (19,45) 0.746 (18,95) 0.020 (0,50) 0.012 (0,30) 25 26 0.370 (9,40) 0.250 (6,35) 0.015 (0,38) MIN
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MCDF002
R-CDFP-F50)
4081537/B
dual flatpack
634 transistor
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PDF
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78 hkc
Abstract: No abstract text available
Text: MECHANICAL DATA MCFP011A – JANUARY 1995 – REVISED JANUARY 1997 HKC R-CDFP-F64 CERAMIC DUAL FLATPACK WITH NCTB 41,14 SQ 40,13 25,91 24,89 19,43 18,54 0,66 MIN 3,81 2,54 1,78 1,40 33 64 11,30 10,67 1 32 8,13 7,49 4,70 3,68 0,25 0,15 0,20 0,11 1,02 0,76
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MCFP011A
R-CDFP-F64)
4073160/C
78 hkc
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PDF
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CDFP4-F24
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K24.A MIL-STD-1835 CDFP4-F24 (F-6A, CONFIGURATION B) 24 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN
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Original
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MIL-STD-1835
CDFP4-F24
350ied.
038mm)
CDFP4-F24
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PDF
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CDFP3-F14
Abstract: K14.A Package
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K14.A MIL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B) 14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN
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MIL-STD-1835
CDFP3-F14
038mm)
CDFP3-F14
K14.A Package
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PDF
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5962-8750401XA
Abstract: qml-38535 5962-8750401EA CDFP4-F16 GDFP2-F16 GDIP1-T16 AS10H504F16
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Changes according to NOR 5962-R029-92. thn 91-11-22 Mionica L. Poelking B Changes according to NOR 5962-R130-93. tvn 93-04-12 Thomas M. Hess C Add package CDFP4-F16. Change document to current electronic format.
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5962-R029-92.
5962-R130-93.
CDFP4-F16.
0EU86
5962-8750401XA
qml-38535
5962-8750401EA
CDFP4-F16
GDFP2-F16
GDIP1-T16
AS10H504F16
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PDF
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cdfp4-f16
Abstract: No abstract text available
Text: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K16.A MIL-STD-1835 CDFP4-F16 (F-5A, CONFIGURATION B) 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045
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MIL-STD-1835
CDFP4-F16
038mm)
cdfp4-f16
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PDF
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Untitled
Abstract: No abstract text available
Text: MECHANICAL DATA MCDF003A – JANUARY 1998 HKE R-CDFP-F36 CERAMIC DUAL FLATPACK 0.125 (3,18) 0.096 (2,44) 0.009 (0,23) 0.003 (0,08) 0.045 (1,14) 0.026 (0,66) 0.397 (10,08) 0.385 (9,78) 0.515 (13,81) 0.505 (12,83) 18 0.310 (7,87) 0.250 (6,35) 19 0.850 (21,59)
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MCDF003A
R-CDFP-F36)
4081545/B
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PDF
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cdfp4-f16
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K16.A MIL-STD-1835 CDFP4-F16 (F-5A, CONFIGURATION B) 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN
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Original
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MIL-STD-1835
CDFP4-F16
245lied.
038mm)
cdfp4-f16
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PDF
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Untitled
Abstract: No abstract text available
Text: MECHANICAL DATA MCFP011A – JANUARY 1997 HKC R-CDFP-F64 CERAMIC DUAL FLATPACK WITH NCTB 41,14 SQ 40,13 25,91 24,89 19,43 18,54 0,66 MIN 3,81 2,54 1,78 1,40 33 64 11,30 10,67 1 32 8,13 7,49 4,70 3,68 0,25 0,15 0,20 0,11 1,02 0,76 0,50 4073160/C 09/96 NOTES: A.
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MCFP011A
R-CDFP-F64)
4073160/C
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PDF
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10H524
Abstract: 5962-8756001ea qml-38535 CDFP4-F16 GDFP2-F16 GDIP1-T16 "5962-8756001FA"
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Made technical changes in Table I. Editorial changes throughout. mlp 92-01-27 Monica L. Poelking B Changes in accordance with NOR 5962-R268-92. tvn 92-08-04 Monica L. Poelking C Add package CDFP4-F16. Use new boilerplate. ljs
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Original
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5962-R268-92.
CDFP4-F16.
0EU86
10H524
5962-8756001ea
qml-38535
CDFP4-F16
GDFP2-F16
GDIP1-T16
"5962-8756001FA"
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PDF
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qml-38535
Abstract: CDFP4-F16 GDFP2-F16 GDIP1-T16 10h576
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Changes according to NOR 5962-R106-93. - ltg 93-03-29 Monica L. Poelking B Add package CDFP4-F16. Change document to current electronic format. Editorial changes throughout. - les 98-02-04 Raymond Monnin
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Original
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5962-R106-93.
CDFP4-F16.
0EU86
qml-38535
CDFP4-F16
GDFP2-F16
GDIP1-T16
10h576
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PDF
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Untitled
Abstract: No abstract text available
Text: SPP-10E-LR-CDFP Features Support 10GBASE-LR/LW and Data Center application Up to 1.4km transmission on SMF 1310nm FP laser and PIN receiver SFI high speed electrical interface 2-wire interface with integrated Digital Diagnostic monitoring
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SPP-10E-LR-CDFP
10GBASE-LR/LW
1310nm
MIL-STD-883E
61000m
DS-7159
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PDF
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Untitled
Abstract: No abstract text available
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Made technical changes to Table I. Figure 4 added. Editorial changes throughout. mlp 92-01-27 Monica L. Poelking B Changes in accordance with NOR 5962-R107-93. tvn 93-04-01 Monica L. Poelking C Add package CDFP4-F16. Use new boilerplate. ljs
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Original
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5962-R107-93.
CDFP4-F16.
MIL-PRF-38535
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PDF
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Untitled
Abstract: No abstract text available
Text: SCOPE: QUAD SPST CMOS ANALOG SWITCHES Device Type 01 02 Generic Number DG201AA x /883B DG202A(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter L K Z Mil-Std-1835 CDFP4-F16 GDIP1-T16 or CDIP2-T16
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DG201AA
/883B
DG202A
/883B
Mil-Std-1835
CDFP4-F16
GDIP1-T16
CDIP2-T16
CQCC1-N20
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PDF
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Untitled
Abstract: No abstract text available
Text: MECHANICAL DATA MCFP008 – OCTOBER 1994 HKA R-CDFP-F28 CERAMIC DUAL FLATPACK 0.045 (1,14) 0.026 (0,66) Lid 0.009 (0,23) 0.004 (0,10) 0.130 (3,32) 0.090 (2,29) 0.400 (10,16) 0.200 (5,08) 0.030 (0,76) MIN 2 Places 0.010 (0,25) MIN 4 Places 0.370 (9,40) 0.250 (6,35)
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MCFP008
R-CDFP-F28)
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PDF
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CDFP
Abstract: No abstract text available
Text: MECHANICAL DATA MCFP009B– JANUARY 1995 – REVISED JUNE 1999 HKB R-CDFP-F28 CERAMIC DUAL FLATPACK 0.045 (1,14) 0.026 (0,66) Lid 0.009 (0,23) 0.004 (0,10) 0.130 (3,32) 0.090 (2,29) 0.400 (10,16) 0.350 (8,89) 0.030 (0,76) MIN 2 Places 0.010 (0,25) MIN 4 Places
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MCFP009B
R-CDFP-F28)
CDFP
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MCFP008
Abstract: R-CDFP-F28
Text: MECHANICAL DATA MCFP008 – OCTOBER 1994 HKA R-CDFP-F28 CERAMIC DUAL FLATPACK 0.045 (1,14) 0.026 (0,66) Lid 0.009 (0,23) 0.004 (0,10) 0.130 (3,32) 0.090 (2,29) 0.400 (10,16) 0.200 (5,08) 0.030 (0,76) MIN 2 Places 0.010 (0,25) MIN 4 Places 0.370 (9,40) 0.250 (6,35)
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MCFP008
R-CDFP-F28)
MCFP008
R-CDFP-F28
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PDF
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CDFP3-F10
Abstract: k10a
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K10.A MIL-STD-1835 CDFP3-F10 (F-4A, CONFIGURATION B) 10 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE e A INCHES A -A- D -BPIN NO. 1 ID AREA b E1 0.004 M H A-B S Q D S S1
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Original
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MIL-STD-1835
CDFP3-F10
038mm)
CDFP3-F10
k10a
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PDF
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Untitled
Abstract: No abstract text available
Text: SCOPE: QUAD SPST CMOS ANALOG SWITCHES Device Type 01 02 Generic Number DG201AA x /883B DG202A(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter L K Z Mil-Std-1835 CDFP4-F16 GDIP1-T16 or CDIP2-T16
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Original
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DG201AA
/883B
DG202A
/883B
Mil-Std-1835
CDFP4-F16
GDIP1-T16
CDIP2-T16
CQCC1-N20
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PDF
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R-CDFP-F50
Abstract: No abstract text available
Text: MECHANICAL DATA MCDF002 – NOVEMBER 1995 HKD R-CDFP-F50 CERAMIC DUAL FLATPACK 0.665 (16,90) 0.634 (16,10) 1 50 0.031 (0,80) 0.843 (21,40) 0.811 (20,60) 0.766 (19,45) 0.746 (18,95) 0.020 (0,50) 0.012 (0,30) 25 26 0.370 (9,40) 0.250 (6,35) 0.015 (0,38) MIN
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Original
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MCDF002
R-CDFP-F50)
4081537/B
R-CDFP-F50
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