Untitled
Abstract: No abstract text available
Text: SILICONE RUBBER LAMINATED DRUM HEATERS SHDH Series Heavy Duty Drum Heaters ߜ Low Watt Density Electrical Resistance Heater ߜ 4.5 Watts/Sq. Inch Exposure Temperature up to 450°F ߜ Rugged & Flexible Heater Element ߜ Constant Watt Density ߜ Quick and Simple
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systems240
SHDH-1000-240
SSDH-C-1200-120
SHDH-C-1000-120
SSDH-C-1200-240
SHDH-C-1000-240
SSDH-700-120
SSDH-700-240
SSDH-550-120
SSDH-550-240
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rgn 1064
Abstract: vergleichsliste mo465 telefunken hr 660 tungsram Ubf 11 TK4100 RGN2004 Telefunken g-2504 Telefunken ebf 11
Text: ' RÖHRENDATEN für Schule u, Werkstatt y ^ 1. VergleichstabeSIe F 2, Austauschliste Ausgabe 1928— 1945 . ' *en W ü n schen v ie le r Interessenten, en tsp rech en d , bringen w ir mit n ach fo lg e n d e r A ufstellung eine Vergleichsliste d e r e u ro p äisch en Röhren so w ie eine Austaüschrtste* die
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OCR Scan
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cbc 182
Abstract: Taiyo Yuden LBC2518 4R7 Taiyo Yuden lem 2520 Inductor LBM2016 o820 LEM2520 Lem Flex lbr202
Text: 信号系巻線チップインダクタ WOUND CHIP INDUCTORS FOR SIGNAL LINE LB SERIES M TYPE LE SERIES M TYPE OPERATING TEMP. LBM2016 TYPE −25~+120℃(製品自己発熱含む) −25∼+120℃ (Inducting self-generated heat) −40∼+85℃
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LBM2016
LEM2520
LBM2016
LEM2520
cbc 182
Taiyo Yuden LBC2518 4R7
Taiyo Yuden lem 2520 Inductor
o820
Lem Flex
lbr202
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LBR2518
Abstract: LEM2520 LB2016 LB2518 LB3218 LBC2012 LBC2016 LBC2518 LBMF1608 LBR2012
Text: 巻線チップインダクタ WOUND CHIP INDUCTORS LB SERIES OPERATING TEMP. −25~+105℃(製品自己発熱含む) (Including self-generated heat) 特長 FEATURES 豊富なラインアップ形状と標準低Rdc、大電流シリーズでお客様の広範
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LB32183225
LBMF1608
LB3218
LBMF1608
LBR2518
LEM2520
LB2016
LB2518
LBC2012
LBC2016
LBC2518
LBR2012
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C322
Abstract: CB2012 CBC3225 CBMF1608 DSA0042841 LEM 3225 TAIYO YUDEN LEM
Text: 巻線チップパワーインダクタ WOUND CHIP POWER INDUCTORS CB SERIES OPERATING TEMP. −25~+105℃(製品自己発熱含む) (Including self-generated heat) 特長 FEATURES ・ LB / LBC シリーズに対し大電流化に対応しています。小型のDC/DCコン
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CBMF1608
C322
CB2012
CBC3225
DSA0042841
LEM 3225
TAIYO YUDEN LEM
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LEM2520
Abstract: Taiyo Yuden lem 2520 Inductor Lem Flex HP8720B LBM2016 LBMF1608
Text: Notice for TAIYO YUDEN products 1 Please read this notice before using the TAIYO YUDEN products. • Product information in this catalog is as of October 2008. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the
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C322
Abstract: CB2012 CBC3225 CBMF1608 R2M 23 R5M equivalent N/transistor c322 7
Text: Notice for TAIYO YUDEN products 1 Please read this notice before using the TAIYO YUDEN products. • Product information in this catalog is as of October 2008. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the
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LB2016
Abstract: LB2518 LB3218 LBC2012 LBC2016 LBC2518 LBMF1608 LBR2012 LBR2518 LEM2520 2R2M
Text: Notice for TAIYO YUDEN products 1 Please read this notice before using the TAIYO YUDEN products. • Product information in this catalog is as of October 2008. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the
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ST19NL66
Abstract: AES-128 MICROMODULES 20/ST19NL66
Text: ST19NL66 Smartcard MCU with Modular Arithmetic Processor and 66 KBytes High Density EEPROM Data Brief Features ST19NL66 major applications include: • ID cards ■ Pay TV ■ Access control Hardware features ■ Enhanced 8-bit CPU core with extended addressing modes
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ST19NL66
ST19NL66
AES-128
MICROMODULES
20/ST19NL66
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block diagram for RF transmitter AND RECEIVER doc
Abstract: BPSK ST19NR66 AES-128 iso 3309 eeprom st
Text: ST19NR66 Dual contactless smartcard MCU with 66 Kbytes high density EEPROM, enhanced RF performances and dedicated packages Features Hardware features • Enhanced 8-bit CPU core with extended addressing modes ■ 224 Kbytes User ROM ■ 6 Kbytes User RAM
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ST19NR66
block diagram for RF transmitter AND RECEIVER doc
BPSK
ST19NR66
AES-128
iso 3309
eeprom st
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iso 3309
Abstract: ST19NR66 AES-128 RSA 2048-bit KEY FEATURE epassport
Text: ST19NR66 Dual Contactless Smartcard MCU with 66 KBytes High Density EEPROM, Enhanced RF Performances and Dedicated Packages DATA BRIEF Feature summary ST19NR66 major applications include: • ePassport ■ ID cards ■ eGovernment cards Hardware features ■
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ST19NR66
ST19NR66
iso 3309
AES-128
RSA 2048-bit
KEY FEATURE
epassport
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET MOS INTEGRATED CIRCUIT MC-454BA72 4M-WORD BY 72-BIT SYNCHRONOUS DYNAMIC RAM MODULE BUFFERED TYPE Description The MC-454BA72 is a 4,194,304 words by 72 bits synchronous dynamic RAM module on which 18 pieces of 16 M SDRAM: mPD4516421 are assembled.
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MC-454BA72
72-BIT
MC-454BA72
mPD4516421
MC-454BA72-A10
MC-454BA72-A12
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ST19NR66
Abstract: AES-128
Text: ST19NR66 Dual contactless smartcard MCU with 66 Kbytes high density EEPROM, enhanced RF performances and dedicated packages Features Hardware features • Enhanced 8-bit CPU core with extended addressing modes ■ 224 Kbytes User ROM ■ 6 Kbytes User RAM
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ST19NR66
ST19NR66
AES-128
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DSLAM d50
Abstract: Zephyr Engineering AN2577 harrier
Text: Advance Information MPC185HWRM Rev. 2.2, 4/2003 MPC185 Hardware Reference Manual Matthew Short Security Applications matt.short@motorola.com This document describes how to design a system with the MPC185 and the MPC8260 or MPC107. This document describes pertinent electrical and physical characteristics of the
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MPC185HWRM
MPC185
MPC8260
MPC107.
MPC185.
XPC185VFA
DSLAM d50
Zephyr Engineering
AN2577
harrier
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Untitled
Abstract: No abstract text available
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
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OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x
OMAP3530
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4X16 lcd
Abstract: No abstract text available
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
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OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x
OMAP3530
4X16 lcd
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Untitled
Abstract: No abstract text available
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
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OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x
OMAP3530
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12ae7
Abstract: A7B9 hamming code 512 bytes OMAP3530DCBB72 cmos IMAGE SENSOR global shutter HD
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
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OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x
OMAP3530
12ae7
A7B9
hamming code 512 bytes
OMAP3530DCBB72
cmos IMAGE SENSOR global shutter HD
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Untitled
Abstract: No abstract text available
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
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OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x+
OMAP3530
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transistor g23
Abstract: No abstract text available
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
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OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x
OMAP3530
transistor g23
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GPIO113
Abstract: No abstract text available
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
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OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x
OMAP3530
GPIO113
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Untitled
Abstract: No abstract text available
Text: OMAP3515/03 Applications Processor www.ti.com SPRS505F – FEBRUARY 2008 – REVISED SEPTEMBER 2009 1 OMAP3515/03 Applications Processor 1.1 Features • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
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OMAP3515/03
SPRS505F
720-MHz
OMAP3515
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s-PBGA-515
Abstract: No abstract text available
Text: OMAP3515/03 Applications Processor www.ti.com SPRS505F – FEBRUARY 2008 – REVISED SEPTEMBER 2009 1 OMAP3515/03 Applications Processor 1.1 Features • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
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OMAP3515/03
SPRS505F
720-MHz
OMAP3515
s-PBGA-515
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SPRS507F
Abstract: No abstract text available
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
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OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x
OMAP3530
SPRS507F
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