TMS320
Abstract: TMS320C17 TMS370
Text: TMS320C17 and TMS370C010 Serial Interface APPLICATION REPORT: SPRA391 Wallace Anderson Computer Science Center Dallas, TX Peter Robinson Regional Technology Center Waltham, Massachusette Tim Settle Automotive Applications Carmel, Indiana Texas Instruments
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TMS320C17
TMS370C010
SPRA391
TMS320
TMS370
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Untitled
Abstract: No abstract text available
Text: CARMEL DSP 20xx Q&A 1. What is the difference between Carmel 10xx and Carmel 20xx? The main difference between the 10xx and the 20xx is a doubling in performance. In some applications the difference is even more than a factor two. This is achieved by allowing
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200mW
250MHz,
500mW
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CARMEL
Abstract: viterbi algorithm
Text: CARMEL DSP Product Overview Applications ● Next Generation Wireless – Handsets and Base Stations – Modems for WANs and LANs ● Telecom and Broadband Communications – Voice-over-Internet-Protocol VoIP – Cable modems – xDSL ● Multimedia and Consumer Electronics
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16-bit,
CARMEL
viterbi algorithm
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max1987
Abstract: US015 LM393 MDC ICH4 CPAR-A13 LM339 1u235 13LVDS 0603 104P CE34
Text: A B C D E FILE LIST 1 CARMEL LED BOARD THERMAL CLOCK GEN 05 34 BANIAS FAN Block Diagram 32 03 31 POWER IMVP4 04 35 POWER ON/OFF CKTS 41 33 PSB 2 26 13 LVDS LCD MCHM MONTARA -GM RGB 14 IO BOARD CRT 06 3 DC-DC JACK LAN PHY USB PORT MIC OP AC97 08 12 DDR DDR
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SI3456DV
2N7002
104P/X7R
100K/?
max1987
US015
LM393 MDC
ICH4
CPAR-A13
LM339
1u235
13LVDS
0603 104P
CE34
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PA2032
Abstract: fpi bus TRMD-030-L LED DIP2 82C54 LED10 PC16550 J10132 0x000030 ISA connector
Text: 2000-01-25 @ 14:54 CAREB Users Manual CARMEL Test and Evaluation Board V0.90 1999-12 Confidential Infineon Technologies Table of Contents Table of Contents Page 1 1.1 1.1.1 1.2 1.2.1 1.2.2 1.2.3 1.3 1.3.1 1.3.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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CARMEL
Abstract: 1kx16 4KX16
Text: Power Consumption of a Carmel system 1. Introduction 3. Power Consumption Dependencies Applications including DSPs continue to demand more and more performance and features while consuming less power. By using the Carmel DSP core we provide a high performance DSP on the market with a low power
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128kx24
4kx16)
64kx16
1kx96
1kx16)
APCA0101
CARMEL
1kx16
4KX16
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CARMEL
Abstract: Tricore C166 C500
Text: FŸr die Fachpresse MŸnchen, April 1999 Infineon Technologies stellt erste Funktionsmuster des CARMEL DSP-Kerns vor Infineon Technologies prŠsentiert die ersten Funktionsmuster des Carmel DSP-Kerns mit den zugehšrigen Software-Entwicklungswerkzeugen. Der Carmel Development
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D-81609
CARMEL
Tricore
C166
C500
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CERBERUS
Abstract: PAE1 CERBERUS ocds generic debug interface JTAG via rs232 DSA00366514 debugging emulation support ocds
Text: Emulation Debugging Concept 2.1. Downloading 1. Introduction This Application Note discusses the debugging concept of a Carmel based DSP application. The objective was to satisfy the challenging demands for debugging a Carmel based application software requested by hardware and
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infineon technologies formerly siemens
Abstract: CARMEL C166
Text: For the trade press Munich, November 1999 INFINEON ANNOUNCES DSP ALLIANCE CARMEL DSP’ open architecture wins commitment from development tool and software vendors Infineon Technologies today announced the formation of the CARMEL DSP Alliance, a community of software and design tool developers committed to supporting
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INFCMD199911
D-81609
infineon technologies formerly siemens
CARMEL
C166
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fpi bus
Abstract: No abstract text available
Text: Data Transfer between external and internal memory SP SRAM This CarmelNote is useful for system designers to make decision regarding the trade-off and the relation between external and internal memory. We will not discuss any cache-concepts or the detailed connection of external
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siemens 1800
Abstract: BY120 CARMEL
Text: Semiconductors For the trade press Munich, March 1998 Cebit ‘98 Siemens Semiconductors Enters High-Performance DSP Market with New "Carmel" Programmable DSP Core New Licensable DSP Core Targets Advanced Consumer and Communications Applications Siemens Semiconductors launched its entry into the high-end digital signal
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D-81617
siemens 1800
BY120
CARMEL
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Xilinx Spartan-6 LX9
Abstract: No abstract text available
Text: Maxim > Design Support > Technical Documents > Subsystem Boards > APP 5742 Keywords: Carmel, MAXREFDES18, analog output, conditioner, programmable logic controllers PLC , distributed control systems (DCS), industrial control and automation SUBSYSTEM BOARD 5742
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MAXREFDES18,
MAXREFDES18#
200mA,
MAX5316
16-Bit,
MAX6126
com/an5742
AN5742,
APP5742,
Xilinx Spartan-6 LX9
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INFINEON PLANT CODE
Abstract: No abstract text available
Text: Für die Fachpresse München, Oktober 1999 Infineon Technologies eröffnet neues Entwicklungszentrum in Israel Infineon Technologies gab heute die Eröffnung eines neuen Entwicklungszentrums in Israel bekannt. Das Center wird seinen Schwerpunkt auf die Digital-SignalProcessing- DSP Technologie legen, auf der Infineons lizenzierbarer High-EndDSP-Core Carmel beruht. Die Eröffnung folgt der Übernahme des auf DSP-Design
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INFXX199910
D-81609
INFINEON PLANT CODE
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fpi bus
Abstract: GPO-3 vector quantization
Text: Architecture Overview w w w. i n f i n e o n . c o m / d s p Never stop thinking. CARMEL DSP Core Technical Overview Handbook About this Document This document was created with Adobe FrameMaker 5.5.6 at Infineon Technologies North America Corp., 1730
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30INT
Abstract: TTL LA 78141 la 78141 pinout "CMOS GATE ARRAY" fuji st zo 607
Text: TICPAL22V10Z-25C, TICPAL22V10Z-30I EPIC CMOS PROGRAMMABLE ARRAY LOGIC CIRCUITS SRPS007C – D3323, SEPTEMBER 1989 – REVISED FEBRUARY 1992 • • • • • • Virtually Zero Standby Power CLK/I I I I I I I I I I I GND Propagation Delay Time: I, I/O to I/O in the Turbo Mode
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TICPAL22V10Z-25C,
TICPAL22V10Z-30I
SRPS007C
D3323,
24-Pin
30INT
TTL LA 78141
la 78141 pinout
"CMOS GATE ARRAY" fuji
st zo 607
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8 bit booth multiplier
Abstract: videophone circuit diagram emblaze G.723. c code ARM926 ARM946 booth multiplier audio encoder mpeg 1 geo emblaze
Text: MPEG-4 over Wireless Networks Ian Thornton ARM Ltd. Cambridge 2000 1 1.1 Introduction The Future of Mobile Phones Third generation mobile networks and terminals will be available within the next few years. When they arrive the mobile phone or device will have the ability to send and receive very much more data than it
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TIBPAL16R4-7C
Abstract: TIBPAL16R8-7C TIBPAL16R6-7C
Text: TIBPAL16L8-7C, TIBPAL16R4-7C, TIBPAL16R6-7C, TIBPAL16R8-7C TIBPAL16L8-10M, TIBPAL16R4-10M, TIBPAL16R6-10M, TIBPAL16R8-10M HIGH-PERFORMANCE IMPACT-X PAL CIRCUITS SRPS006D – D3115, MAY 1988 – REVISED MARCH 1992 • • • • • TIBPAL16L8’ C SUFFIX . . . J OR N PACKAGE
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TIBPAL16L8-7C,
TIBPAL16R4-7C,
TIBPAL16R6-7C,
TIBPAL16R8-7C
TIBPAL16L8-10M,
TIBPAL16R4-10M,
TIBPAL16R6-10M,
TIBPAL16R8-10M
SRPS006D
D3115,
TIBPAL16R4-7C
TIBPAL16R8-7C
TIBPAL16R6-7C
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OMAP 4470
Abstract: TIBPAL22VP10-20C
Text: TIBPAL22VP10-20C, TIBPAL22VP10-25M HIGH-PERFORMANCE IMPACT-X PROGRAMMABLE ARRAY LOGIC CIRCUITS SRPS013A − D2943, FEBRUARY 1987 − REVISED DECEMBER 2010 • • Choice of Operating Speeds: TIBPAL22VP10-20C . . . 20 ns Max TIBPAL22VP10-25M . . . 25 ns Max
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TIBPAL22VP10-20C,
TIBPAL22VP10-25M
SRPS013A
D2943,
TIBPAL22V10/10A,
TIBPAL22VP10-20C
TIBPAL22VP10-25M
OMAP 4470
TIBPAL22VP10-20C
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PAL20L8
Abstract: TIBPAL20L8-5C TIBPAL20L8-7M TIBPAL20R4-5C TIBPAL20R4-7M TIBPAL20R6-5C TIBPAL20R6-7M TIBPAL20R8-5C TIBPAL20R8-7M
Text: OBSOLETE - No Longer Available TIBPAL20L8-5C, TIBPAL20R4-5C, TIBPAL20R6-5C, TIBPAL20R8-5C TIBPAL20L8-7M, TIBPAL20R4-7M, TIBPAL20R6-7M, TIBPAL20R8-7M HIGH-PERFORMANCE IMPACT-X PAL CIRCUITS SRPS010F – D3353, OCTOBER 1989 – REVISED SEPTEMBER 1992 •
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TIBPAL20L8-5C,
TIBPAL20R4-5C,
TIBPAL20R6-5C,
TIBPAL20R8-5C
TIBPAL20L8-7M,
TIBPAL20R4-7M,
TIBPAL20R6-7M,
TIBPAL20R8-7M
SRPS010F
D3353,
PAL20L8
TIBPAL20L8-5C
TIBPAL20L8-7M
TIBPAL20R4-5C
TIBPAL20R4-7M
TIBPAL20R6-5C
TIBPAL20R6-7M
TIBPAL20R8-5C
TIBPAL20R8-7M
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LA 78141 data
Abstract: No abstract text available
Text: TIBPAL22VP10-20C, TIBPAL22VP10-25M HIGH-PERFORMANCE IMPACT-X PROGRAMMABLE ARRAY LOGIC CIRCUITS SRPS013 – D2943, FEBRUARY 1987 – REVISED JUNE 1991 • • • • • • • • CLK/I I I I I I I I I I I GND Choice of Operating Speeds: TIBPAL22VP10-20C . . . 20 ns Max
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TIBPAL22VP10-20C,
TIBPAL22VP10-25M
SRPS013
D2943,
TIBPAL22V10/10A,
TIBPAL22VP10-20C
TIBPAL22VP10-25M
LA 78141 data
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sk 8050 rf
Abstract: TIBPAL20R4-10C
Text: TIBPAL20L8-10C, TIBPAL20R4-10C, TIBPAL20R6-10C, TIBPAL20R8-10C HIGH-PERFORMANCE IMPACT-X PAL CIRCUITS SRPS008A – D3336, OCTOBER 1989 – REVISED MARCH 1992 • • • • • TOP VIEW I I I I I I I I I I I GND Functionally Equivalent, but Faster Than
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TIBPAL20L8-10C,
TIBPAL20R4-10C,
TIBPAL20R6-10C,
TIBPAL20R8-10C
SRPS008A
D3336,
TIBPAL20R'
TIBPAL20'
sk 8050 rf
TIBPAL20R4-10C
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ipc-7351
Abstract: PA 66 GF 20
Text: High Reliability COTS CWR09/19/29 Style T497 High Grade COTS MnO2 Series Overview The KEMET T497 Series is designed for the COTS (Commercial Off-The-Shelf) requirements of military, medical, and aerospace applications. This product is a COTS version of CWR09, 19, and
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CWR09/19/29
CWR09,
ipc-7351
PA 66 GF 20
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Richey
Abstract: 673432
Text: Distributor List USA ALABAMA ARIZONA CALIFORNIA COLORADO CONNECTICUT FLORIDA GEORGIA IOWA ILLINOIS INDIANA KANSAS LOUISIANA MASSACHUSETTS MARYLAND MICHIGAN MINNESOTA HUNTSVILLE PHOENIX PHOENIX TEMPE CALABASAS CYPRESS FREMONT GARDEN GROVE IRVINE SAN DIEGO SAN DIEGO
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AME60
Richey
673432
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BV EI 304 3160
Abstract: str f 6456 ic sw 2604 BV EI 304 3510 BV EI 303 3535 STR 6755 STR 6456 STR G 6352 AMI Semiconductor 9449 sw 2604 ic
Text: T e m ic Sales Offices Semiconductors Addresses Europe France TEMIC France Les Quadrants 3, avenue du centre B.P. 309 78054 St.-Q uentin-en-Y velines Cedex Tel: 33 1 3060 7000 Fax: 33 1 3060 7111 Germany TEMIC TELEFUNKEN m icroelectronic GmbH Erfurter Strasse 31
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