C39Q2 Search Results

C3293

Abstract: D1804 c3807 C3953 C3502 C3467 d1815 B985 B1166 c3950
Text: SA0YO N e w P a c k a g e FLP Full M o l d L a r ge P a c k a g e S e r i e s Sanyo hasdeveloped FLP (Full Mold Large Package) to meet the needs of miniaturization and automatic insertion in themidst of progressingindustrial and consumer electronics. Though it is a large power type with Pc=1.5ff, it is achieved that