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    Chip 1 Exchange C2012Y5V1E334ZT000N 1,700
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    C2012SL1H101K

    Abstract: C2012SL1H020C c2012c0g1h101k C2012X7R1E473K C2012C0G1H561K C2012SL1H102J C2012SL1H152J C2012X7R1H332M C2012C0G1H471J C2012SL1H222K
    Text: MULTILAYER CERAMIC CHIP CAPACITORS C series, C2012 [EIA CC0805] type FEATURES • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength


    Original     		PDF C2012 CC0805] C2012Y5V1E154Z C2012Y5V1E224Z C2012Y5V1E334Z C2012Y5V1E474Z C2012Y5V1C224Z C2012Y5V1C334Z C2012Y5V1C474Z C2012Y5V1C684Z C2012SL1H101K C2012SL1H020C c2012c0g1h101k C2012X7R1E473K C2012C0G1H561K C2012SL1H102J C2012SL1H152J C2012X7R1H332M C2012C0G1H471J C2012SL1H222K

    C2012X7R1C104M

    Abstract: C2012X5R0J155K C3216C0G1H152 C3216X7R1C684 C2012X7R1E154 C2012SL1H331J C2012SL1H101K C2012X7R1H102M
    Text: MULTILAYER CERAMIC CHIP CAPACITORS C series, C1608 [EIA CC0603] type FEATURES • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength


    Original     		PDF C1608 CC0603] C3216X7R1C684K C3216X7R1C684M C3216X7R1C824K C3216X7R1C105K C3216X7R1C105M C3216X7R1C155K C3216X7R1C155M C3216X7R1C225K C2012X7R1C104M C2012X5R0J155K C3216C0G1H152 C3216X7R1C684 C2012X7R1E154 C2012SL1H331J C2012SL1H101K C2012X7R1H102M