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    TDK Corporation C2012X7R1H222K

    CAP CER 2200PF 50V X7R 0805
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    DigiKey C2012X7R1H222K Cut Tape
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    C2012X7R1H222K Digi-Reel 1
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    C2012X7R1H222K Reel
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    Bristol Electronics C2012X7R1H222K 3,123
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    Quest Components C2012X7R1H222K 2,498
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    TDK Corporation C2012X7R1H222KT

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    Bristol Electronics C2012X7R1H222KT 7,888
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    Quest Components C2012X7R1H222KT 24,388
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    C2012X7R1H222KT 6,310
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    Avnet Abacus C2012X7R1H222KT Reel 143 Weeks 4,000
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    TDK Corporation C2012X7R1H222KT0Y9N

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    Bristol Electronics C2012X7R1H222KT0Y9N 5,725
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    C2012X7R1H222KT0Y9N 4,455
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    TDK Corporation C2012X7R1H222KT000N

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    Bristol Electronics C2012X7R1H222KT000N 3,900
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    Others C2012X7R1H222KT009A

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    Chip 1 Exchange C2012X7R1H222KT009A 28,000
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    C2012X7R1H222K Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    C2012X7R1H222K TDK Ceramic Capacitors, Capacitors, CAP CER 2200PF 50V 10% X7R 0805 Original PDF

    C2012X7R1H222K Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CKD310

    Abstract: CGA3E C3216X7R2E473KT CKD310JB0J226S CC01005 AEC-Q200 C1005 C1608 C3216 CC0201
    Text: TDK MLCC US Catalog Version A10 This page is intentionally left blank. ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ General Application, C Series Mid Voltage Application, C Series High Voltage Application, C Series High Temperature Application, C Series Tight Tolerance Capacitor, C Series


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    CKD Technology

    Abstract: ckd310jb1c105s CKD610 CKD510JB CKD510JB1A105S CHIP TANTAL CAP CKD110JB digital IC TANTAL 104 TANTAL 16V
    Text: REV C Low ESL Feed Through Features Features CKD CKD series series LOW ESL FEED THROUGH TYPE CKD SERIES ARE CONSTRUCTED WITH 3 TERMINALS WHICH REDUCE INDUCTANCE AND EXTEND IN TO FOLLOWING APPLICATIONS. SIGNAL LINE FOR HIGH IMPEDANCE CIRCUIT. e.g. DIGITAL LINE.


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    PDF E22R0013-03 CKD610JB CKD510JB CKD110JB CKD310JB CKD Technology ckd310jb1c105s CKD610 CKD510JB CKD510JB1A105S CHIP TANTAL CAP CKD110JB digital IC TANTAL 104 TANTAL 16V

    C1608C0G1H5R6C

    Abstract: C1608X7R1E153K C0603X5R0J154 c2012 TDK ceramic capacitor C0402C0G1C910J C1005 C1608 C3216 CC0201 CC0805
    Text: C Series General Application Type: C0402 [EIA CC01005] C0603 [EIA CC0201] C1005 [EIA CC0402] C1608 [EIA CC0603] C2012 [EIA CC0805] C3216 [EIA CC1206] C3225 [EIA CC1210] C4532 [EIA CC1812] C5750 [EIA CC2220] Issue date: April 2011 TDK MLCC US Catalog Version B11


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    PDF C0402 CC01005] C0603 CC0201] C1005 CC0402] C1608 CC0603] C2012 CC0805] C1608C0G1H5R6C C1608X7R1E153K C0603X5R0J154 c2012 TDK ceramic capacitor C0402C0G1C910J C1005 C1608 C3216 CC0201 CC0805

    C1608C0G1H5R6C

    Abstract: C1608X7R1H104KT0Y9 C2012X5R1C226K C2012X7R1A475K
    Text: C Series General Application Type: C0402 [EIA CC01005] C0603 [EIA CC0201] C1005 [EIA CC0402] C1608 [EIA CC0603] C2012 [EIA CC0805] C3216 [EIA CC1206] C3225 [EIA CC1210] C4532 [EIA CC1812] C5750 [EIA CC2220] Issue date: April 2011 TDK MLCC US Catalog Version B11


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    PDF C0402 CC01005] C0603 CC0201] C1005 CC0402] C1608 CC0603] C2012 CC0805] C1608C0G1H5R6C C1608X7R1H104KT0Y9 C2012X5R1C226K C2012X7R1A475K

    C2012SL1H101K

    Abstract: C2012SL1H020C c2012c0g1h101k C2012X7R1E473K C2012C0G1H561K C2012SL1H102J C2012SL1H152J C2012X7R1H332M C2012C0G1H471J C2012SL1H222K
    Text: MULTILAYER CERAMIC CHIP CAPACITORS C series, C2012 [EIA CC0805] type FEATURES • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength


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    PDF C2012 CC0805] C2012Y5V1E154Z C2012Y5V1E224Z C2012Y5V1E334Z C2012Y5V1E474Z C2012Y5V1C224Z C2012Y5V1C334Z C2012Y5V1C474Z C2012Y5V1C684Z C2012SL1H101K C2012SL1H020C c2012c0g1h101k C2012X7R1E473K C2012C0G1H561K C2012SL1H102J C2012SL1H152J C2012X7R1H332M C2012C0G1H471J C2012SL1H222K

    C2012X7R1C104M

    Abstract: C2012X5R0J155K C3216C0G1H152 C3216X7R1C684 C2012X7R1E154 C2012SL1H331J C2012SL1H101K C2012X7R1H102M
    Text: MULTILAYER CERAMIC CHIP CAPACITORS C series, C1608 [EIA CC0603] type FEATURES • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength


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    PDF C1608 CC0603] C3216X7R1C684K C3216X7R1C684M C3216X7R1C824K C3216X7R1C105K C3216X7R1C105M C3216X7R1C155K C3216X7R1C155M C3216X7R1C225K C2012X7R1C104M C2012X5R0J155K C3216C0G1H152 C3216X7R1C684 C2012X7R1E154 C2012SL1H331J C2012SL1H101K C2012X7R1H102M

    C1005X7R1H104K

    Abstract: C1608C0G1H5R6C C1005X7R1H473K C1005X5R0J475K C3216X5R1C476M C1005X5R0J475M C1608C0G1H911J C3225X7S1H106K C1608X5R1A106M C1005C0G1H2R7B
    Text: C Series General Application Type: C0402 [EIA CC01005] C0603 [EIA CC0201] C1005 [EIA CC0402] C1608 [EIA CC0603] C2012 [EIA CC0805] C3216 [EIA CC1206] C3225 [EIA CC1210] C4532 [EIA CC1812] C5750 [EIA CC2220] Issue date: January 2011 TDK MLCC US Catalog Version A11


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    PDF C0402 CC01005] C0603 CC0201] C1005 CC0402] C1608 CC0603] C2012 CC0805] C1005X7R1H104K C1608C0G1H5R6C C1005X7R1H473K C1005X5R0J475K C3216X5R1C476M C1005X5R0J475M C1608C0G1H911J C3225X7S1H106K C1608X5R1A106M C1005C0G1H2R7B

    CKCM25X7R

    Abstract: inside parts for plasma tv C4520X7R3D tdk c4532x5r0j107m C5750X7R1H106 CKG57NX7R2 CKG57NX7R1H C5750Y5V1H226 C1608X7R0J MLCC CRACK
    Text: TDK MLCC US Catalog Version B11 of TDK MLCC US Catalog                General Application, C Series …….………………………… 3 Mid Voltage Application, C Series ….….…………………. 75 High Voltage Application, C Series .…………………….105


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    h432j

    Abstract: CC0805HX7R104K TDK CC0805HNP H103J C2012COG1H102J CC0805HNPO220J C1608COG1H220 C2012X7R1H471K C3225COG CC1206CX7R105K
    Text: Page: 1 Thursday, May 22, 1997 0603 NPO 50V DC Size Chart mm inches Type Length Width Thickness Max. B/Min. 0603 0.063 (1.6) 0.031 (0.8) 0.035 (0.9) 0.008 (0.2) Packaging Quantities Type Packaging Style 0603 4,000 pieces paper tape file:///smoke/%20CURRENT%20PROJECTS/TDK/


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    PDF 20CURRENT 20PROJECTS/TDK/ 20Web 20Site 20Revisions/htdocs/ CC0603HNPO100D CC0603HNPO120J CC0603HNPO150J CC0603HNPO180J CC0603HNPO220J h432j CC0805HX7R104K TDK CC0805HNP H103J C2012COG1H102J CC0805HNPO220J C1608COG1H220 C2012X7R1H471K C3225COG CC1206CX7R105K

    npo 22j

    Abstract: C2012COG1H capacitor type 104z 50v capacitors 22j NPO ceramic Y5V 104Z V104Z CC0603HNP0120J CC0805C CC0805HNPO C3216Y5V1C105
    Text: CAPACITORS C A P AC ITO R S Ceramic Chip TDK’s n4k> Sub-Miniature chip capacitor additions answer tbe electronics industry’s needfo r , bigber density packaging. TDK’s advanced technology allows fo r smaller size, bigbest capaci­ tance, increased reliability, and automated assembly. Applications include computers and


    OCR Scan
    PDF 30ppm/ VoltageR1C473M CKCA43X7R1C104M CKCA43Y5V1H223Z CKCA43V5V1H473Z CKCA43Y5V1H1 CKCA43X7R1H471M CA43X7R1H102M OCA43X7R1H222M CA43X7R npo 22j C2012COG1H capacitor type 104z 50v capacitors 22j NPO ceramic Y5V 104Z V104Z CC0603HNP0120J CC0805C CC0805HNPO C3216Y5V1C105

    capacitor 104m z5u 50

    Abstract: 104m Z5U 50 TDK CC0805HNP CC0603H CC0805HX7R104K CC0805HX7R103K Z5U 104M C3216COG1H CC1206HNP0392J CC0603HX7R103K
    Text: CAPACITORS Ceramic Chip Electrical Specification Capacitance Range Temperature Characteristic 10pF to 10.0p,F NPO: 0±30ppm /°C -55°C to + 125°C 1Vrms, 1kHz 25°C X7R: NPO 1,000pF and less: 1MHz X5R: ±15% (-55°C to +85°C) Y5V: +22-82% (-30°C to +85°C)


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    PDF 000pF 30ppm C3216Y5V1H474Z C3216Y5V1H105Z 1206EZ5U CC1206EZ5U224M C3216Z5U1E104M C3216Z5U1E224M CC1210CY5V106Z C3225Y5V1C capacitor 104m z5u 50 104m Z5U 50 TDK CC0805HNP CC0603H CC0805HX7R104K CC0805HX7R103K Z5U 104M C3216COG1H CC1206HNP0392J CC0603HX7R103K

    H070D

    Abstract: 1608C0G1H080D 3216X7R E472M H220K h432j C5650C 1608X7R 1H104M C2012SL1H010D
    Text: Multilayer Ceramic Chip Capacitors C Series TDK Multilayer Ceramic Chip Capacitors are the product of many years of experience in material and production technology. All products manufactured are, therefore, highly reliable. FEATURES • Thin layers in ceramic dielectric and multilayer


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    CC0603HNP0

    Abstract: C1608COG1H 1h473m CC0805HNP0 CC0805HNP0151J C1608COG1H820J
    Text: CAPACITORS CAPACITORS Ceramic Chip ti TDK’s ndbi Sub-Miniature chip capacitor additions answer tbe electronics industry’s need fo r , higher density packaging. TDK’s advanced technology allows fo r smaller size, highest capaci­ tance, increased reliability, and automated assembly. Applications include computers and


    OCR Scan
    PDF CA43X7R1H CKCA43X7R1H CKCA43Y5V1H223Z CKCA43V5V1H473Z 43Y5V1H C224Z CKCA43Y5V1C474Z CC0603HNP0 C1608COG1H 1h473m CC0805HNP0 CC0805HNP0151J C1608COG1H820J

    473m ceramic capacitors

    Abstract: C2012CH1H C2012PH1H101J 1H273K C2012X7R1H 331J COG 100 C2012X7R1C103K C2012CH1H130J 111J C2012X8R1H
    Text: Multilayer Ceramic Chip Capacitors C Series C2012 TYPE [EIA: CC0805] SHAPES AND DIMENSIONS 2 ± 0.2 c\j ö +i Dimensions in mm -0 .2 min. T Thickness 0.6±0.15_ 0.85±0.15_ 1.25±0.2_ • gg |K i CAPACITANCE RANGE/CLASS I (TEMPERATURE COMPENSATION)


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    PDF C2012 CC0805] 30ppm/ C2012C0G1H080D C2012C0G1H080F C2012C0G1H5Z 2012Y 1E472Z 1E682Z 473m ceramic capacitors C2012CH1H C2012PH1H101J 1H273K C2012X7R1H 331J COG 100 C2012X7R1C103K C2012CH1H130J 111J C2012X8R1H