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    BGA492 Search Results

    BGA492 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    BGA492 NXP Semiconductors Footprint for reflow soldering Original PDF

    BGA492 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    SOT514

    Abstract: MS-034
    Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA492: plastic ball grid array package; 492 balls; body 35 x 35 x 1.75 mm B D D1 SOT514-1 A ball A1 index area E1 E A A2 A1 detail X C e1 y1 C ∅v M C A B b 1/2 e e y ∅w M C AF AE e AD AC AB AA Y


    Original     		BGA492: OT514-1 MS-034 SOT514 MS-034 PDF

    sot514

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA492: plastic ball grid array package; 492 balls; body 35 x 35 x 1.75 mm SOT514-1 D D1 ball A1 index A2 A A1 E1 E detail X k A k b e ZD ∅w M ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D


    Original     		BGA492: OT514-1 sot514 PDF

    BGA492

    Abstract: SOT514
    Text: Philips Semiconductors Package outlines BGA492: plastic ball grid array package; 492 balls; body 35 x 35 x 1.75 mm 1998 Apr 08 641 SOT514-1


    Original     		BGA492: OT514-1 BGA492 SOT514 PDF

    SF-BGA492A-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA492A C 32.004mm See BGA pattern code to the right for actual pattern layout Y Ø 0.635mm Pad 32.004mm X Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] 31.75mm sq. B 1 3 Top View: Recommended PCB Layout


    Original     		BGA492A 004mm 635mm FR4/G10 26X26 SF-BGA492A-B-11 PDF

    SOT514

    Abstract: MO-151
    Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA492: plastic ball grid array package; 492 balls; body 35 x 35 x 1.75 mm B D D1 SOT514-1 A ball A1 index area E1 E A A2 A1 detail X k k e1 b e C v M B ∅w M v M A AF AE AD AC AB AA Y W V U T R P N


    Original     		BGA492: OT514-1 MO-151 SOT514 MO-151 PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10


    Original     		MBL179 BGA156 OT472-1 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA316 PDF

    13001 s 8d

    Abstract: WM-034BY NEC c157 13001 8d Zener C249 LP141X5 isuzu 13001 B 8D FUSE 3A 125V SMT mhd2032at
    Text: 1999/3/15 * NBX;6120/TGAA/32A/1EN1/N1DN1 Spare Parts List * 6120 A .1 .3 .3 .3 .4 .4 .4 .4 .4 .4 .4 .4 .3 .4 .4 .4 .4 .4 .3 .4 .4 .4 .4 .4 .4 .4 .4 .4 .4 .4 .4 .4


    Original     		6120/TGAA/32A/1EN1/N1DN1 340666E 5026VO 200MM 3020F 103AT-4 SF91E 13001 s 8d WM-034BY NEC c157 13001 8d Zener C249 LP141X5 isuzu 13001 B 8D FUSE 3A 125V SMT mhd2032at PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X PDF

    f9222

    Abstract: philips F2110 F8222 f7326 f9223 F11216 f8113 F9328 F7328 IEC C13 pinout
    Text: INTEGRATED CIRCUITS PZ3960C/PZ3960N 960 macrocell SRAM CPLD Product specification Supersedes data of 1998 Sep 01 IC27 Data Handbook Philips Semiconductors 1998 Sep 28 Philips Semiconductors Product specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES


    Original     		PZ3960C/PZ3960N CPLD--960 PZ3960 f9222 philips F2110 F8222 f7326 f9223 F11216 f8113 F9328 F7328 IEC C13 pinout PDF

    F1022

    Abstract: f1031 MC19 PZ3960C7EB PZ3960N8EB sot514 F929 F926 Philips F423 f811
    Text: INTEGRATED CIRCUITS PZ3960C/PZ3960N 960 macrocell SRAM CPLD Preliminary specification Supersedes data of 1998 Jan 21 IC27 Data Handbook Philips Semiconductors 1998 Jul 21 Philips Semiconductors Preliminary specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N


    Original     		PZ3960C/PZ3960N CPLD--960 PZ3960 F1022 f1031 MC19 PZ3960C7EB PZ3960N8EB sot514 F929 F926 Philips F423 f811 PDF

    121C-2

    Abstract: XC1765D XC95108 XL mp8000ch4 p103 pot datasheet reliability report PQFP240 XC95xxx 17256d D1 PGA 478
    Text: The Reliability Data Program Expanded Version Jan. 1, 2000 Cover P1 TABLE OF CONTENTS Introduction .…4 The Reliability Program. .…4


    Original     		XC4005XL PQFP-160 PLCC-84, HQFP-304, VQFP-100 XC4044XL XC4013XLA 121C-2 XC1765D XC95108 XL mp8000ch4 p103 pot datasheet reliability report PQFP240 XC95xxx 17256d D1 PGA 478 PDF

    Untitled

    Abstract: No abstract text available
    Text: INTEGRATED CIRCUITS l y i E I TI im m Xilinx has acquired the entire Philips CoolRurtner Low Power CPLD Product Family, For more technical or sales information^ please see; 8 £«& ^S l 8 ft « »0» X ft »« www.xillnx.com XCR3960 960 macrocell SRAM CPLD


    OCR Scan     		XCR3960 OT514-1 PDF

    manchester verilog decoder

    Abstract: Philips Semiconductors Selection Guide pzlcp AN057
    Text: Philips Semiconductors CONTENTS IC27: Complex Programmable Logic Devices CPLDs Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


    Original     		PDF

    XC95XXXL

    Abstract: XC95XXX XC1765D PQFP240 C17S xc9536 A9903 XCV1000E FG HT 12E APPLICATION Reliability Test Methods for Packaged Devices
    Text: The Reliability Data Program Expanded Version July 1, 2000 Cover P1 TABLE OF CONTENTS Introduction .…4 The Reliability Program. .…4


    Original     		XC4005XL PQFP-160 PLCC-84, HQFP-304, VQFP-100 XC4044XL XC4013XLA XC95XXXL XC95XXX XC1765D PQFP240 C17S xc9536 A9903 XCV1000E FG HT 12E APPLICATION Reliability Test Methods for Packaged Devices PDF

    Motherboard Intel fw82443bx

    Abstract: WM034B MAX3234 lcd screen hyundai LVDS connector 20 pins 442-665 p4 motherboard fan track rout sb3052 ht13x mother board lcd tv block diagram fw82443bx
    Text: 6120 N/B MAINTENANCE 1. DEFINITION & LOCATION CONNECTORS/ SWITCHES… … ….… P.2 2. DEFINITION & LOCATION MAJOR COMPONENTS… … … … . …P.4… 3. PIN DESCRIPTIONS OF MAJOR COMPONENTS … … … … … …P.5… … 4. 6120 BLOCK DIAGRAM … … … … … … ….…


    Original     		EXPL3664710002 5026VO 200MM 300MM 3020F Motherboard Intel fw82443bx WM034B MAX3234 lcd screen hyundai LVDS connector 20 pins 442-665 p4 motherboard fan track rout sb3052 ht13x mother board lcd tv block diagram fw82443bx PDF

    kbc 1070 nu

    Abstract: toshiba c850 JRC 386 amp LYNXEM4 D5024 hosiden DC motor 12V DFWP0125WA R5C475 Matsua inverter MID manual B9017
    Text: ORDER NO. CPD0102001C0 Notebook Computer CF-28 This is the Service Manual for the following areas. M .for U.S.A. and Canada E .for U.K. G .for Germany F .for France S .for Sweden When this product is repaired, the Access Key is necessary to release security of electrical and mechanical.


    Original     		CPD0102001C0 CF-28 CF-28 kbc 1070 nu toshiba c850 JRC 386 amp LYNXEM4 D5024 hosiden DC motor 12V DFWP0125WA R5C475 Matsua inverter MID manual B9017 PDF

    LM-JK63-22NTR

    Abstract: Video capture card location in PC MOTHERBOARD intel 845 circuit diagram with problem location TM41PDG220-2 lt 7233 AA121SJ03 Intel 82371MB USER GUIDE FW82443BX MOTHERBOARD mitac 8 lmjk6322ntr INTEL PENTIUM PROCESSOR MOBILE MODULE
    Text: 7233 N/B MAINTENANCE 0. Introduction … … … … … … … … … … … … … … … … … … … … … … … … … … … . . P. 2 1. Definition & Location Connectors/ Switches … … … … … … … … … … … … … … . . P.20


    Original     		PT-23 MMBT2222AL O236AB PQ501 MMBT2907AL O-236AB MMBT3904L Tr35NS O236Q1 MMBT4401 LM-JK63-22NTR Video capture card location in PC MOTHERBOARD intel 845 circuit diagram with problem location TM41PDG220-2 lt 7233 AA121SJ03 Intel 82371MB USER GUIDE FW82443BX MOTHERBOARD mitac 8 lmjk6322ntr INTEL PENTIUM PROCESSOR MOBILE MODULE PDF

    f7326

    Abstract: f9114 F6222
    Text: [M m SlnlEET PZ3960C/PZ3960N 960 macrocell SRAM CPLD Product specification Supersedes data of 1998 Jul 21 IC27 Data Handbook Philips Semiconductors 1998 Sep 01 PHILIPS Philips Semiconductors Product specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES


    OCR Scan     		PZ3960C/PZ3960N CPLD--960 f7326 f9114 F6222 PDF

    F9222

    Abstract: 05464 MC19 PZ3960C7EB PZ3960N8EB F9328 F9221 f9114 F6222 F9220
    Text: INTEGRATED CIRCUITS PZ3960C/PZ3960N 960 macrocell SRAM CPLD Product specification Supersedes data of 1998 Sep 28 IC27 Data Handbook Philips Semiconductors 1999 Mar 18 Philips Semiconductors Product specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES


    Original     		PZ3960C/PZ3960N CPLD--960 PZ3960 F9222 05464 MC19 PZ3960C7EB PZ3960N8EB F9328 F9221 f9114 F6222 F9220 PDF

    SOT411

    Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
    Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which


    Original     		PDF

    diode c649 ST

    Abstract: C526 Zener KE45WS RMA-010-FP 904251 TM121SV-02L01 6133 diode u34 schottky diode ST HDK632 h8 sot23 diode zener
    Text: 1999/3/15 * NBX;6133/T2XA/XXA/3FR7/NXCN1 Spare Parts List * 6133 Spare Parts List Reference A PART_NO 526266610038 .2 416266610004 .4 411666100001 .5 225665500001 .5 242600000001 .5 242600000145 .5 242600000364 .5 242600000170


    Original     		6133/T2XA/XXA/3FR7/NXCN1 K950418A6 LP486 5026VO 3020F diode c649 ST C526 Zener KE45WS RMA-010-FP 904251 TM121SV-02L01 6133 diode u34 schottky diode ST HDK632 h8 sot23 diode zener PDF

    USER GUIDE FW82443BX MOTHERBOARD

    Abstract: Mainboard Schematics mitac 6120 Transistor U503 insyde debug card code PD510 mosfet 716 FW82371EB pci set intel pci set fw82371eb mitac 8
    Text: 7020 MAINTENANCE CONTENTS 1. Definition and Location of Connectors & Jumpers. … . … … . … … … … … … … . … … … . 2~4 2. Location of Major Components. … . … . … … … … … … … . … … . 5~7


    Original     		2N7002 PD507 BAS32L PL508 PL507 PU502 PR515 NDC7002N TL594C PR507 USER GUIDE FW82443BX MOTHERBOARD Mainboard Schematics mitac 6120 Transistor U503 insyde debug card code PD510 mosfet 716 FW82371EB pci set intel pci set fw82371eb mitac 8 PDF

    f1031

    Abstract: f422 f931 F918
    Text: INTEGRATED CIRCUITS Xilinx has acquired the entire Philips CoolRunner Low Power CPLD Product Family. For more technical or sales information, please see: www.xilinx.com XCR3960 960 macrocell SRAM CPLD Preliminary specification Supersedes data of 1998 Jan 21


    Original     		XCR3960 XCR3960 CPLD--960 f1031 f422 f931 F918 PDF

    handbook philips ic26 packaging

    Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
    Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3


    Original     		AN01026 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA304 OT550-1 BGA316 handbook philips ic26 packaging AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50 PDF