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    bga 484 0.8mm pitch

    Abstract: land pattern 484 BGA SF-BGA484B-B-11 BGA484B
    Text: D Package Code: BGA484B C .0225" dia. tooling holes X2 non plated (optional) 0.624mm See BGA pattern code to the right for actual pattern layout Y 0.878mm 0.025" dia. pad X 31.75mm Top View (reference only) 2 1.27mm [0.050"] 0.36mm [0.014"] dia. 0.635mm


    Original     		PDF BGA484B 624mm 878mm 635mm 882mm FR4/G10 26X26X5 SF-BGA484B-B-11 bga 484 0.8mm pitch land pattern 484 BGA BGA484B

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X