Untitled
Abstract: No abstract text available
Text: Package outline BGA324: plastic ball grid array package; 324 balls SOT1129-2 B D D1 A ball A1 index area E1 E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e e2 1/2 e 1 3 5 7 9 11 13 15 17 19 21 shape
|
Original
|
BGA324:
OT1129-2
sot1129-2
MS-034
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Package outline BGA324: plastic ball grid array package; 324 balls; body 23 x 23 x 1.78 mm SOT1129-1 B D D1 A ball A1 index area E1 E A A2 A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A e2 1/2 e 1 2 3 4 5 6 7 9 11 13 15 17 19 21
|
Original
|
BGA324:
OT1129-1
sot1129-1
MS-034
|
PDF
|
19X19
Abstract: PBGA324 PRBG0324FA-A P-BGA-324 324f
Text: JEITA Package Code P-BGA324-19x19-1.00 RENESAS Code PRBG0324FA-A D B D1 Previous Code 324F7X-A MASS[Typ.] 1.1g A b A ZD S AB e ZE V U T R P N M L K J H G F E D C B E1 E e A1 A y S Index mark S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Reference Symbol D
|
Original
|
P-BGA324-19x19-1
PRBG0324FA-A
324F7X-A
19X19
PBGA324
PRBG0324FA-A
P-BGA-324
324f
|
PDF
|
pitch 0.4mm BGA
Abstract: SF-BGA324A-B-11
Text: C Package Code: BGA324A D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 19.00mm [0.748"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.50mm [0.020"] 2 5.32mm [0.210"]
|
Original
|
BGA324A
FR4/G10
20X20
SF-BGA324A-B-11
pitch 0.4mm BGA
|
PDF
|
0.4mm pitch BGA
Abstract: pitch 0.4mm BGA SF-BGA324G-B-11 1mm pitch BGA
Text: C Package Code: BGA324G D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 17.00mm [0.669"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]
|
Original
|
BGA324G
FR4/G10
18X18
SF-BGA324G-B-11
0.4mm pitch BGA
pitch 0.4mm BGA
1mm pitch BGA
|
PDF
|
SF-BGA324D-B-11
Abstract: No abstract text available
Text: D Package Code: BGA324D C 25.5mm [1.004"] 1.5mm [0.059"] See BGA pattern code to the right for actual pattern layout Y 1.5mm typ. [0.059"] X 25.5mm [1.004"] Top View reference only 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 Ø 0.64mm pad [Ø 0.025"]
|
Original
|
BGA324D
18X18
SF-BGA324D-B-11
|
PDF
|
SF-BGA324H-B-11
Abstract: No abstract text available
Text: D Package Code: BGA324H C 21.59mm [0.850"] 0.69mm [0.027"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] X 21.59mm [0.850"] Top View reference only 1.27mm typ. [0.050"] 2 0.36mm [0.014"] dia. 0.63mm [0.025"] 5.33mm 3.74mm [0.147"]
|
Original
|
BGA324H
FR4/G10
18X18
SF-BGA324H-B-11
|
PDF
|
BGA324B
Abstract: SF-BGA324B-B-11
Text: D C Package Code: BGA324B 24.13mm [0.950"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.76mm [0.030"] X 24.13mm [0.950"] Top View reference only 1.27mm [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
|
Original
|
BGA324B
FR4/G10
SF-BGA324B-B-11
BGA324B
|
PDF
|
SF-BGA324F-B-11
Abstract: land pattern BGA 0,50
Text: D Package Code: BGA324F C 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.76mm [0.030"] 0.025" dia . pad X 24.13mm [0.950"] Top View reference only 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] 3 Side View (reference only)
|
Original
|
BGA324F
FR4/G10
20X20
SF-BGA324F-B-11
land pattern BGA 0,50
|
PDF
|
BGA324
Abstract: BGA-324 MS-034 sot787
Text: PDF: 2002 Oct 18 Philips Semiconductors Package outline BGA324: plastic ball grid array package; 324 balls; body 23 x 23 x 1.75 mm SOT787-1 B D A D1 ball A1 index area A A2 A 1 E1 E detail X C e1 e 1/2 ∅v M b e ∅w M AB AA Y W V U T R P N M L K J H G F
|
Original
|
BGA324:
OT787-1
MS-034
BGA324
BGA-324
MS-034
sot787
|
PDF
|
SF-BGA324E-B-11
Abstract: No abstract text available
Text: D C Package Code: BGA324E 24.13mm [0.950"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.76mm [0.030"] X 24.13mm [0.950"] Top View reference only 1.27mm [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
|
Original
|
BGA324E
FR4/G10
SF-BGA324E324
SF-BGA324E-B-11
|
PDF
|
pitch 0.4mm BGA
Abstract: 22X22 SF-BGA324J-B-11
Text: C Package Code: BGA324J D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 21.00mm [0.827"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 2 0.508 mm
|
Original
|
BGA324J
FR4/G10
22X22
SF-BGA324J-B-11
pitch 0.4mm BGA
22X22
|
PDF
|
Untitled
Abstract: No abstract text available
Text: ARM-based Embedded MPU SAMA5D3 Series SUMMARY DATASHEET Description The Atmel SAMA5D3 series is a high-performance, power-efficient embedded MPU based on the ARM Cortex ® -A5 processor, achieving 536 MHz with power consumption levels below 0.5 mW in low-power mode. The device features a floating
|
Original
|
|
PDF
|
ADM5120 reference board
Abstract: ADM5120 RS232 infineon Infineon EASY 5120 NETWORK ROUTER SOC soc 5120
Text: To o l B r i e f EASY 5120-RT Wired Router Reference Package V1.1 The EASY 5120-RT reference package demonstrates Infineon’s wired router capabilities. This reference platform allows system engineers to develop time-to-market router products. Hardware Features
|
Original
|
5120-RT
5120-RT
RS-232
B000-H0000-X-X-7600
ADM5120 reference board
ADM5120
RS232 infineon
Infineon EASY 5120
NETWORK ROUTER SOC
soc 5120
|
PDF
|
|
gps tracker circuit diagram
Abstract: dc-dc PID 13 smr 40000c circuit marking m3 transistor 6249C VID 200-12 S4 DSI LCD TFT FM Stereo Decoder Integrated Circuit BA 758 N7E50-7516VY-20 ptz decoder
Text: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • • • – DSP Instruction Extensions, Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer
|
Original
|
ARM926EJ-STM
32-bit-layer
6249C
01-Jun-07
gps tracker circuit diagram
dc-dc PID 13
smr 40000c circuit
marking m3 transistor
VID 200-12 S4
DSI LCD TFT
FM Stereo Decoder Integrated Circuit BA 758
N7E50-7516VY-20
ptz decoder
|
PDF
|
HD62
Abstract: DMA11 c589 ha md55 hd61 HA20 HD-61
Text: 1 2 3 HBE#[0.7] 5 6 7 8 2,4 HD[0.63] HD[0.63] 2,4 +3VS HD0 HD1 HD2 HD3 HD4 HD5 HD6 HD7 HD8 HD9 HD10 HD11 HD12 HD13 HD14 HD15 HD16 HD17 HD18 HD19 HD20 HD21 HD22 HD23 HD24 HD25 HD26 HD27 HD28 HD29 HD30 HD31 HD32 HD33 HD34 HD35 HD36 HD37 HD38 HD39 HD40 HD41
|
Original
|
JT512
0603B
5033HPM
SD411665500201
HD62
DMA11
c589
ha md55
hd61
HA20
HD-61
|
PDF
|
GPO23
Abstract: mitac 6120 M9-M10 IQR15 fw82371 FW82371EB
Text: 5 6 R133 D15 2 GND SD[0.15] +3VS_USB SMBDATA0/1 1 PWROK SPKR TEST# CONFIG1 CONFIG2 APICACK# APICCS# APICREQ# REQA# REQB# REQC# GNTA# GNTB# GNTC# gpo9 1 gpo10 gpo11 18,20 10,20 10,20 SCI# 19,20 DOCK_IN 10,20 12,20 LCD_ID2 CARD_ACT JT511 12,13 1 JT510 JT523
|
Original
|
RLS4148
MLL34B
0603B
JT523
JT511
gpo27
gpo28
gpo29
0603B
GPO23
mitac 6120
M9-M10
IQR15
fw82371
FW82371EB
|
PDF
|
MITAC schematic
Abstract: mitac 5033 Trident Cyber9385 CCS C TOUCHPAD CIRCUIT CLPD6701 MITAC SO-DIMM 144-pin trident schematic keyboard and touchpad schematic ha7 msd
Text: 5033 Circuit Diagram Index Table Sheet# 01 02 03 04 05 06 07 08 09 10 11 12 13 Description Jumper Settings CPU MTXC Cache Memory Clock Synthesizer and Driver PIIX4 Primary IDE and G.Pad Connector Trident 9385 Video Memory Bank 0 LCD Connector PCMCIA Controller
|
Original
|
ESS1869
SW501-1
VMD43
VMD44
VMD45
VMD46
VMD47
VMD48
VMD49
------------------------------------VMD50
MITAC schematic
mitac 5033
Trident Cyber9385
CCS C TOUCHPAD CIRCUIT
CLPD6701
MITAC
SO-DIMM 144-pin
trident schematic
keyboard and touchpad schematic
ha7 msd
|
PDF
|
r548
Abstract: JT509 GPI16 GPO11 GPO27
Text: 8 19 JT6 JT15 JT7 VGA_SUS FDD_MODE MODEM_OFF# 1 1 1 gpo27 gpo28 gpo29 1 TC XOE# XDIR# BIOSCS# KBCCS# MCCS# PCS0# PCS1# USBP1+ USBP1USBP0+ USBP0OC0# OC1# SIORDY SDIOW# SDIOR# SDDREQ SDDACK# 8 8 8 8 8 8 SDD[0.15] SDCS3# SDCS1# SDA0 SDA1 SDA2 PIORDY PDIOW# PDIOR#
|
Original
|
RLS4148
MLL34
MLL34B
0603B
0603B
gpo27
gpo28
gpo29
r548
JT509
GPI16
GPO11
|
PDF
|
VD58
Abstract: CQ58 Z247 qe r603 Z258 MC140138 DB25 90 connector 78l05 so8 z232 74hct373a
Text: Mainboard 1 of 32 R51 R52 1 2 3 4 5 GNT #[0.3] 16,19,24,30• 10 9 8 7 6 10 9 8 7 6 10K 10K T SMC8R-10K 1 2 3 4 5 RP9 VCC3 G NT #4 G NT #0 G NT #1 G NT #2 G NT #3 REQ#4 REQ#0 REQ#1 REQ#2 REQ#3 CLKRUN# PCIRST # GNT #[0.3] REQ #[0.4] 24• 7• 7• FRAME#
|
Original
|
71-85P00-D04A
VD58
CQ58
Z247
qe r603
Z258
MC140138
DB25 90 connector
78l05 so8
z232
74hct373a
|
PDF
|
SPC563M64
Abstract: SPC564A80 SPC564A chip amp ta 8268 e200z448n3 e200z4 PowerPC core Reference manual PCR131 K20 LQFP144 SPC564A80L7 flexcan spc56
Text: SPC564A80B4, SPC564A80L7 32-bit MCU family built on the embedded Power Architecture Preliminary data Features • ■ 150 MHz e200z4 Power Architecture core – Variable length instruction encoding VLE – Superscalar architecture with 2 execution units
|
Original
|
SPC564A80B4,
SPC564A80L7
32-bit
e200z4
24-entry
SPC563M64
SPC564A80
SPC564A
chip amp ta 8268
e200z448n3
e200z4 PowerPC core Reference manual
PCR131
K20 LQFP144
SPC564A80L7
flexcan spc56
|
PDF
|
Manchester CODING DECODING FPGA
Abstract: iso7816 sim 8x 8 led dot matrix AC97 ARM926EJ-S ISO7816
Text: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer – 220 MIPS at 200 MHz
|
Original
|
ARM926EJ-STM
6270AS
10-Jan-08
Manchester CODING DECODING FPGA
iso7816 sim
8x 8 led dot matrix
AC97
ARM926EJ-S
ISO7816
|
PDF
|
BD16925EFV-M
Abstract: rain sensor ML512010 ML511003 "rain sensor" BD81A ML9636GDZB5A BD16805FV-M bd3021 ML86V76653
Text: A G 2011 1st Automotive Body General Purpose ICs Video and Imaging ICs Audio ICs IT Equipment ICs Consumer Product ICs Automotive ICs Discrete Semiconductors Optoelectronics Modules APPLICATION GUIDE Site Search www.rohm.com AG03 Enter the code above for additional details
|
Original
|
53A6386E
BD16925EFV-M
rain sensor
ML512010
ML511003
"rain sensor"
BD81A
ML9636GDZB5A
BD16805FV-M
bd3021
ML86V76653
|
PDF
|
BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
|
Original
|
BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
|
PDF
|