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    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA324: plastic ball grid array package; 324 balls SOT1129-2 B D D1 A ball A1 index area E1 E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e e2 1/2 e 1 3 5 7 9 11 13 15 17 19 21 shape


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    BGA324: OT1129-2 sot1129-2 MS-034 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA324: plastic ball grid array package; 324 balls; body 23 x 23 x 1.78 mm SOT1129-1 B D D1 A ball A1 index area E1 E A A2 A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A e2 1/2 e 1 2 3 4 5 6 7 9 11 13 15 17 19 21


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    BGA324: OT1129-1 sot1129-1 MS-034 PDF

    19X19

    Abstract: PBGA324 PRBG0324FA-A P-BGA-324 324f
    Text: JEITA Package Code P-BGA324-19x19-1.00 RENESAS Code PRBG0324FA-A D B D1 Previous Code 324F7X-A MASS[Typ.] 1.1g A b A ZD S AB e ZE V U T R P N M L K J H G F E D C B E1 E e A1 A y S Index mark S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Reference Symbol D


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    P-BGA324-19x19-1 PRBG0324FA-A 324F7X-A 19X19 PBGA324 PRBG0324FA-A P-BGA-324 324f PDF

    pitch 0.4mm BGA

    Abstract: SF-BGA324A-B-11
    Text: C Package Code: BGA324A D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 19.00mm [0.748"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.50mm [0.020"] 2 5.32mm [0.210"]


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    BGA324A FR4/G10 20X20 SF-BGA324A-B-11 pitch 0.4mm BGA PDF

    0.4mm pitch BGA

    Abstract: pitch 0.4mm BGA SF-BGA324G-B-11 1mm pitch BGA
    Text: C Package Code: BGA324G D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 17.00mm [0.669"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]


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    BGA324G FR4/G10 18X18 SF-BGA324G-B-11 0.4mm pitch BGA pitch 0.4mm BGA 1mm pitch BGA PDF

    SF-BGA324D-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA324D C 25.5mm [1.004"] 1.5mm [0.059"] See BGA pattern code to the right for actual pattern layout Y 1.5mm typ. [0.059"] X 25.5mm [1.004"] Top View reference only 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 Ø 0.64mm pad [Ø 0.025"]


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    BGA324D 18X18 SF-BGA324D-B-11 PDF

    SF-BGA324H-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA324H C 21.59mm [0.850"] 0.69mm [0.027"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] X 21.59mm [0.850"] Top View reference only 1.27mm typ. [0.050"] 2 0.36mm [0.014"] dia. 0.63mm [0.025"] 5.33mm 3.74mm [0.147"]


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    BGA324H FR4/G10 18X18 SF-BGA324H-B-11 PDF

    BGA324B

    Abstract: SF-BGA324B-B-11
    Text: D C Package Code: BGA324B 24.13mm [0.950"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.76mm [0.030"] X 24.13mm [0.950"] Top View reference only 1.27mm [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


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    BGA324B FR4/G10 SF-BGA324B-B-11 BGA324B PDF

    SF-BGA324F-B-11

    Abstract: land pattern BGA 0,50
    Text: D Package Code: BGA324F C 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.76mm [0.030"] 0.025" dia . pad X 24.13mm [0.950"] Top View reference only 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] 3 Side View (reference only)


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    BGA324F FR4/G10 20X20 SF-BGA324F-B-11 land pattern BGA 0,50 PDF

    BGA324

    Abstract: BGA-324 MS-034 sot787
    Text: PDF: 2002 Oct 18 Philips Semiconductors Package outline BGA324: plastic ball grid array package; 324 balls; body 23 x 23 x 1.75 mm SOT787-1 B D A D1 ball A1 index area A A2 A 1 E1 E detail X C e1 e 1/2 ∅v M b e ∅w M AB AA Y W V U T R P N M L K J H G F


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    BGA324: OT787-1 MS-034 BGA324 BGA-324 MS-034 sot787 PDF

    SF-BGA324E-B-11

    Abstract: No abstract text available
    Text: D C Package Code: BGA324E 24.13mm [0.950"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.76mm [0.030"] X 24.13mm [0.950"] Top View reference only 1.27mm [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


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    BGA324E FR4/G10 SF-BGA324E324 SF-BGA324E-B-11 PDF

    pitch 0.4mm BGA

    Abstract: 22X22 SF-BGA324J-B-11
    Text: C Package Code: BGA324J D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 21.00mm [0.827"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 2 0.508 mm


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    BGA324J FR4/G10 22X22 SF-BGA324J-B-11 pitch 0.4mm BGA 22X22 PDF

    Untitled

    Abstract: No abstract text available
    Text: ARM-based Embedded MPU SAMA5D3 Series SUMMARY DATASHEET Description The Atmel SAMA5D3 series is a high-performance, power-efficient embedded MPU based on the ARM Cortex ® -A5 processor, achieving 536 MHz with power consumption levels below 0.5 mW in low-power mode. The device features a floating


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    PDF

    ADM5120 reference board

    Abstract: ADM5120 RS232 infineon Infineon EASY 5120 NETWORK ROUTER SOC soc 5120
    Text: To o l B r i e f EASY 5120-RT Wired Router Reference Package V1.1 The EASY 5120-RT reference package demonstrates Infineon’s wired router capabilities. This reference platform allows system engineers to develop time-to-market router products. Hardware Features


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    5120-RT 5120-RT RS-232 B000-H0000-X-X-7600 ADM5120 reference board ADM5120 RS232 infineon Infineon EASY 5120 NETWORK ROUTER SOC soc 5120 PDF

    gps tracker circuit diagram

    Abstract: dc-dc PID 13 smr 40000c circuit marking m3 transistor 6249C VID 200-12 S4 DSI LCD TFT FM Stereo Decoder Integrated Circuit BA 758 N7E50-7516VY-20 ptz decoder
    Text: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • • • – DSP Instruction Extensions, Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer


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    ARM926EJ-STM 32-bit-layer 6249C 01-Jun-07 gps tracker circuit diagram dc-dc PID 13 smr 40000c circuit marking m3 transistor VID 200-12 S4 DSI LCD TFT FM Stereo Decoder Integrated Circuit BA 758 N7E50-7516VY-20 ptz decoder PDF

    HD62

    Abstract: DMA11 c589 ha md55 hd61 HA20 HD-61
    Text: 1 2 3 HBE#[0.7] 5 6 7 8 2,4 HD[0.63] HD[0.63] 2,4 +3VS HD0 HD1 HD2 HD3 HD4 HD5 HD6 HD7 HD8 HD9 HD10 HD11 HD12 HD13 HD14 HD15 HD16 HD17 HD18 HD19 HD20 HD21 HD22 HD23 HD24 HD25 HD26 HD27 HD28 HD29 HD30 HD31 HD32 HD33 HD34 HD35 HD36 HD37 HD38 HD39 HD40 HD41


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    JT512 0603B 5033HPM SD411665500201 HD62 DMA11 c589 ha md55 hd61 HA20 HD-61 PDF

    GPO23

    Abstract: mitac 6120 M9-M10 IQR15 fw82371 FW82371EB
    Text: 5 6 R133 D15 2 GND SD[0.15] +3VS_USB SMBDATA0/1 1 PWROK SPKR TEST# CONFIG1 CONFIG2 APICACK# APICCS# APICREQ# REQA# REQB# REQC# GNTA# GNTB# GNTC# gpo9 1 gpo10 gpo11 18,20 10,20 10,20 SCI# 19,20 DOCK_IN 10,20 12,20 LCD_ID2 CARD_ACT JT511 12,13 1 JT510 JT523


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    RLS4148 MLL34B 0603B JT523 JT511 gpo27 gpo28 gpo29 0603B GPO23 mitac 6120 M9-M10 IQR15 fw82371 FW82371EB PDF

    MITAC schematic

    Abstract: mitac 5033 Trident Cyber9385 CCS C TOUCHPAD CIRCUIT CLPD6701 MITAC SO-DIMM 144-pin trident schematic keyboard and touchpad schematic ha7 msd
    Text: 5033 Circuit Diagram Index Table Sheet# 01 02 03 04 05 06 07 08 09 10 11 12 13 Description Jumper Settings CPU MTXC Cache Memory Clock Synthesizer and Driver PIIX4 Primary IDE and G.Pad Connector Trident 9385 Video Memory Bank 0 LCD Connector PCMCIA Controller


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    ESS1869 SW501-1 VMD43 VMD44 VMD45 VMD46 VMD47 VMD48 VMD49 ------------------------------------VMD50 MITAC schematic mitac 5033 Trident Cyber9385 CCS C TOUCHPAD CIRCUIT CLPD6701 MITAC SO-DIMM 144-pin trident schematic keyboard and touchpad schematic ha7 msd PDF

    r548

    Abstract: JT509 GPI16 GPO11 GPO27
    Text: 8 19 JT6 JT15 JT7 VGA_SUS FDD_MODE MODEM_OFF# 1 1 1 gpo27 gpo28 gpo29 1 TC XOE# XDIR# BIOSCS# KBCCS# MCCS# PCS0# PCS1# USBP1+ USBP1USBP0+ USBP0OC0# OC1# SIORDY SDIOW# SDIOR# SDDREQ SDDACK# 8 8 8 8 8 8 SDD[0.15] SDCS3# SDCS1# SDA0 SDA1 SDA2 PIORDY PDIOW# PDIOR#


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    RLS4148 MLL34 MLL34B 0603B 0603B gpo27 gpo28 gpo29 r548 JT509 GPI16 GPO11 PDF

    VD58

    Abstract: CQ58 Z247 qe r603 Z258 MC140138 DB25 90 connector 78l05 so8 z232 74hct373a
    Text: Mainboard 1 of 32 R51 R52 1 2 3 4 5 GNT #[0.3] 16,19,24,30• 10 9 8 7 6 10 9 8 7 6 10K 10K T SMC8R-10K 1 2 3 4 5 RP9 VCC3 G NT #4 G NT #0 G NT #1 G NT #2 G NT #3 REQ#4 REQ#0 REQ#1 REQ#2 REQ#3 CLKRUN# PCIRST # GNT #[0.3] REQ #[0.4] 24• 7• 7• FRAME#


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    71-85P00-D04A VD58 CQ58 Z247 qe r603 Z258 MC140138 DB25 90 connector 78l05 so8 z232 74hct373a PDF

    SPC563M64

    Abstract: SPC564A80 SPC564A chip amp ta 8268 e200z448n3 e200z4 PowerPC core Reference manual PCR131 K20 LQFP144 SPC564A80L7 flexcan spc56
    Text: SPC564A80B4, SPC564A80L7 32-bit MCU family built on the embedded Power Architecture Preliminary data Features • ■ 150 MHz e200z4 Power Architecture core – Variable length instruction encoding VLE – Superscalar architecture with 2 execution units


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    SPC564A80B4, SPC564A80L7 32-bit e200z4 24-entry SPC563M64 SPC564A80 SPC564A chip amp ta 8268 e200z448n3 e200z4 PowerPC core Reference manual PCR131 K20 LQFP144 SPC564A80L7 flexcan spc56 PDF

    Manchester CODING DECODING FPGA

    Abstract: iso7816 sim 8x 8 led dot matrix AC97 ARM926EJ-S ISO7816
    Text: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer – 220 MIPS at 200 MHz


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    ARM926EJ-STM 6270AS 10-Jan-08 Manchester CODING DECODING FPGA iso7816 sim 8x 8 led dot matrix AC97 ARM926EJ-S ISO7816 PDF

    BD16925EFV-M

    Abstract: rain sensor ML512010 ML511003 "rain sensor" BD81A ML9636GDZB5A BD16805FV-M bd3021 ML86V76653
    Text: A G 2011 1st Automotive Body General Purpose ICs Video and Imaging ICs Audio ICs IT Equipment ICs Consumer Product ICs Automotive ICs Discrete Semiconductors Optoelectronics Modules APPLICATION GUIDE Site Search www.rohm.com AG03 Enter the code above for additional details


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    53A6386E BD16925EFV-M rain sensor ML512010 ML511003 "rain sensor" BD81A ML9636GDZB5A BD16805FV-M bd3021 ML86V76653 PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


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    BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X PDF