BGA168
Abstract: SF-BGA168A-B-11 ST BGA
Text: D Package Code: BGA168A C 20.32mm [0.800"] See BGA pattern code to the right for actual pattern layout Y 1.27mm [0.050"] 0.64mm [0.025"] X Top View reference only 20.32mm [0.800"] 1.27mm [0.050"] 2 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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BGA168A
FR4/G10
SF-BGA168A-B-11
BGA168
ST BGA
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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B1680
Abstract: No abstract text available
Text: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 168 PIN PLASTIC BGA-168P-M01 168-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 14 Package width x package length 12.00 × 12.00 mm Sealing method Plastic mold Mounting height 1.45 mm MAX
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BGA-168P-M01
168-pin
BGA-168P-M01)
B168001S-2C-2
B1680
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ADS7924
Abstract: TRF3761-E CDCLVC1102 INA3221
Text: Analog Signal Chain Guide Amplifiers Data Converters Interface Clocks and Timing Sensing Wireless Connectivity www.ti.com 2013 Analog Signal Chain Guide Table of Contents Overview. 3 Interface Amplifiers and Comparators
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LGA 1156 PIN OUT diagram
Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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LGA 1155 Socket PIN diagram
Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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Yamaichi ic354
Abstract: IC354 IC51-2084-1052-36 IC234-1004-023P YAMAICHI ic234 IC51-0484-806 648-0482211 QP1-120050-272 IC51-1004-809 IC234-1444-053P
Text: FUJITSU SEMICONDUCTOR DATA SHEET Socket 1. Socket .2 2 List of Test Sockets .3
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LGA-80P-M02
IC280-080-252
LGA-80P-M04
LGA-144P-M02
IC280-144-249
LGA-176P-M01
IC280-176-254
F0606
Yamaichi ic354
IC354
IC51-2084-1052-36
IC234-1004-023P
YAMAICHI ic234
IC51-0484-806
648-0482211
QP1-120050-272
IC51-1004-809
IC234-1444-053P
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FP-X4KPG223-01
Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators
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XC2018,
XC2018
XC3020,
XC3064,
XC3042,
XC3090,
XC3090
FP-X4KPG223-01
reflow profile FOR LGA COMPONENTS
bga96
BGA165
BGA292
SO8A
CA-SO18A-Z-J-T-01
SF-QFE352SA-L-01
BGA480B
CA-PLCC44-D-P-T-01
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