BGA REFLOW Search Results

reflow soldering profile BGA

Abstract: reflow temperature bga BGA PROFILING bga rework
Contextual Info: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: Removal and replacement of BGA packages on printed circuit boards is fairly straightforward. However, reattachment or touch-up of BGA packages that have already

reflow soldering profile BGA

Abstract: BGA PROFILING solder joint bga warpage bga rework
Contextual Info: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: • Use caution when profiling to insure minimal temperature difference <15°C and preferably <10°C between components Removal and replacement of BGA packages on printed

reflow temperature rohs bga

Abstract: 0.65mm pitch BGA
Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

BGA 731

Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

0.65mm pitch BGA

Abstract: ASTM-B-488 157 BGA socket
Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

Contextual Info: MAXIMUM solutions MILL-MAX BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 0.8mm, 1.0mm and .050” grid footprints. For socketing BGA devices, a Socket is reflow

Contextual Info: MAXIMUM solutions MILL-MAX BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 0.8mm, 1.0mm and .050” grid footprints. For socketing BGA devices, a Socket is reflow

SY68730ZC

Abstract: MIC29302BT SY68730 sy10s897 0343a KS8721BL Unisem tsmc cmos tsmc cmos 0.35 KSZ8695PX
Contextual Info: Autoclave Pressure Pot Test + 121C / 15 PSIG (With Pre-con 3X Reflow ) MSL Pkg Lds Device D/C Process Qty Hours Rej Assembler L3 L3 L3 L3 BGA BGA BGA BGA 289 289 289 289 KS8695PX KS8695PX KS8695PX KSZ8695PX 0407 0421A 0417A 0452A TSMC .18 TSMC .18 TSMC .18

Surface Insulation Resistance FR 4 PCB

Contextual Info: MAXIMUM solutions MILL-MAX 1mm & .050” GRID BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm and .050” grid footprints. For socketing BGA devices, a Socket is reflow

bga rework

Abstract: BGA-3501-SN 3500-SN reflow temperature bga metcal RBHB Process-Control rework
Contextual Info: Precision Systems for the Electronics Bench New! Metcal Single Head BGA Rework System The Economical Solution to BGA Rework BGA 3500-SN Series Single Head BGA Rework System When your BGA rework needs are simpler and don't require a specialized vision system, the economical BGA 3500-SN series is the system for your work bench. With the dependability of Metcal

sn63pb37 solder wire

Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
Contextual Info: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen

BGA Solder Ball compressive force

Abstract: bga solder ball shear
Contextual Info: BACKPANEL CONNECTORS AirMax VS BGA Connector Development Using BGA connector technology to extend the performance of backplane connectors DESCRIPTION The development of AirMax VS vertical signal headers for reflow solder termination combines FCI's proven Ball Grid Array BGA

Surface Insulation Resistance FR 4 PCB

Abstract: alloy 25 BeCu
Contextual Info: MAXIMUM solutions MILL-MAX 0.8mm GRID BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s 0.8mm BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are also available to fit 1mm and .050” grid footprints.

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

BGA-3000

Abstract: BGA-3500 Metcal CSP 3502 Metcal BGA-3591 CSP-3500 metcal bga-3000 METCAL MX-500 circuit BGA-3591 BGA-3592 reflow temperature bga laptop
Contextual Info: BGA & CSP Rework System BGA-3590 Series CSP-3500 Series USER GUIDE Precision Systems for the Electronics Bench www.metcal.com P/N 7000-1251, Ver. A , 9/01 ii BGA-3500 Series Manual 5/01 TABLE OF CONTENTS PREFACE Specifications 2 System Part Numbers 3 Environmental Conditions

QFP Package 128 lead .5mm

Abstract: QFP 128 lead .5mm BGA reflow guide SI-SX72-ACQ256SFG484 A54SX72A-CQ256 BGA 256 PACKAGE thermal resistance A54SX72A-FG484
Contextual Info: 3.16mm [0.124"] 3.54mm [0.139"] 1 39.3mm [1.547"] 41.9mm [1.650"] 32.23mm [1.269"] 41.9mm [1.650"] 27mm 15.67mm [0.617"] DETAIL A Lead coplanarity 0.005" max. Side View 0.5mm Description: BGA to QFP package converter 484 position BGA surface mount GHz BGA socket 1.00mm centers, 26X26 array, 27X27mm body to 256 QFP, 0.5mm

BGA reflow guide

Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
Contextual Info: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to

ADV0115

Abstract: improves EP20K200E EP20K300E
Contextual Info: CUSTOMER ADVISORY ADV0115 EP20K200E and EP20K300E 652-Ball BGA Package Improvement Change Description: The EP20K200E and EP20K300E 652-Ball BGA packages will be re-enforced with a stiffener added to the top of the package. Reason For Change: This change improves EP20K200E and EP20K300E 652-Ball BGA package coplanarity

Contextual Info: BGA 4-Pin, Optical Transceiver Sensitivity, Absorptive Low Pass Filter Series FL7B5BC*S Series This specification applies to distributed passive element filter networks in a surface mountable BGA 6-pin package. The Filter performs an absorptive, low pass function that attenuates high frequencies with low phase dispersion . The high bandwidth BGA

Transceiver 20 GHz

Contextual Info: BGA 6-Pin, Optical Transceiver Sensitivity, Absorptive Low Pass Filter Series FL7B5BH*S Series This specification applies to distributed passive element filter networks in a surface mountable BGA 6-pin package. The Filter performs an absorptive, low pass function that attenuates high frequencies with low phase dispersion . The high bandwidth BGA

entek Cu-56

Abstract: thick bga die size Cu-56 stencil tension BGA "direct replacement" bga rework "ball collapse" height
Contextual Info: APPNote #37 BGA Board Level Assembly and Rework Recommendations 4/19/00 Abstract This application note provides the recommendations for board level assembly for the ballgrid array BGA package family. These recommendations were derived from work done by the Universal BGA/DCA (Ball Grid Array/Direct Chip Attach) Consortium. The

FF1152

Abstract: FG256 BF957
Contextual Info: R Package Specifications This section contains specifications for the following Virtex-II packages: 450 • "CS144 Chip-Scale BGA Package 0.80 mm Pitch " on page 451 • "FG256 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 452 • "FG456 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 453

35 x 35 PBGA, 580 100 balls

Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Contextual Info: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8