PK034
Abstract: FG456
Text: R Fine-Pitch BGA FG456 Package PK034 (v1.0) June 1, 2000 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
|
Original
|
PDF
|
FG456)
PK034
PK034
FG456
|
FF1152
Abstract: FG256 BF957
Text: R Package Specifications This section contains specifications for the following Virtex-II packages: 450 • "CS144 Chip-Scale BGA Package 0.80 mm Pitch " on page 451 • "FG256 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 452 • "FG456 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 453
|
Original
|
PDF
|
CS144
FG256
FG456
FG676
BG575
BG728
FF896
FF1152
FF1517
BF957
|
BF957
Abstract: FF1517 FF1152 FG256 FF896 Virtex-II FG456 Fine-Pitch BGA Package
Text: R Chapter 4: PCB Design Considerations FG256 Fine-Pitch BGA Package 1.00 mm Pitch Figure 4-22: 490 FG256 Fine-Pitch BGA Package www.xilinx.com 1-800-255-7778 UG012 (v1.0) January 31, 2002 Virtex-II Pro Platform FPGA Handbook R Package Specifications FG456 Fine-Pitch BGA Package (1.00 mm Pitch)
|
Original
|
PDF
|
FG256
UG012
FG456
FF672
FF1152
BF957
FF1517
FF896
Virtex-II
Fine-Pitch
BGA Package
|
Untitled
Abstract: No abstract text available
Text: 100% Material Declaration Data Sheet for FG456 Package PK154 v1.4 August 24, 2012 Average Weight: 2.0021 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3 100.00 Use in Product
|
Original
|
PDF
|
FG456
PK154
|
Untitled
Abstract: No abstract text available
Text: PK540 v1.1 January 11, 2012 100% Material Declaration Data Sheet for Spartan -3/-3E/-3A FG456 (Cu Wire) Package Average Weight: 2.3521 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound
|
Original
|
PDF
|
PK540
FG456
|
XC2V1000
Abstract: XC2V1000 Pin-out IO-L93N XC2V80 XC2V40 XC2V250 XC2V500
Text: R Pinout Information Introduction This section describes the pinouts for Virtex-II devices in the following packages: • • • • • CS144: wire-bond chip-scale ball grid array BGA of 0.80 mm pitch FG256, FG456, and FG676: wire-bond fine-pitch BGA of 1.00 mm pitch
|
Original
|
PDF
|
CS144:
FG256,
FG456,
FG676:
FF896,
FF1152,
FF1517:
BG575
BG728:
BF957:
XC2V1000
XC2V1000 Pin-out
IO-L93N
XC2V80
XC2V40
XC2V250
XC2V500
|
34992
Abstract: XCV600E FG680 BG680 XCV100 TQ144 XCV1000E XCV600E HQ240 XCV300 PQ240 XCV50 PQ240 CS144 BG560
Text: Competitive Overview Virtex Series FPGA Competitive Cross Reference XCV100E 32K 30K-95K 2988 2/24 EP20K100E XCV200E 94 158 176 284 PQ240 FG256 BG432 FG456 158 176 316 312 83K 80K-400K 7116 2/24 PQ240 BG432 FG676 158 316 404 130K 130K-560K 10812 2/24 HQ240
|
Original
|
PDF
|
XCV100E
30K-95K
XCV200E
80K-400K
PQ240
BG432
FG676
130K-560K
HQ240
34992
XCV600E FG680
BG680
XCV100 TQ144
XCV1000E
XCV600E HQ240
XCV300 PQ240
XCV50 PQ240
CS144
BG560
|
BF957
Abstract: 21M22
Text: R Pinout Diagrams Pinout Diagrams This section contains pinout diagrams for the following Virtex-II Pro packages: • • • • • • • FG256 Fine-Pitch BGA Composite Pinout Diagram, page 461 - FG256 Bank Information - FG256 Dedicated Pins FG456 Fine-Pitch BGA Composite Pinout Diagram, page 465
|
Original
|
PDF
|
FG256
FG456
FF672
FF896
BF957
21M22
|
FG456
Abstract: package drawings
Text: R Package Drawings Ball Fine Pitch Packages - FG456 11-56 February 2, 1999 Version 1.3
|
Original
|
PDF
|
FG456
FG456
package drawings
|
FGG456
Abstract: FG456 456-BALL PK034
Text: R PK034 v1.2.1 March 23, 2005 Fine-Pitch BGA (FG456/FGG456) Package 456-BALL FINE-PITCH BGA, 1.00MM PITCH (FG456/FGG456) 2004, 2005 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
|
Original
|
PDF
|
PK034
FG456/FGG456)
456-BALL
FGG456
FG456
PK034
|
FG456
Abstract: No abstract text available
Text: R Fine Pitch BGA FG456 Package PK034 (v1.1) April 6, 2001 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
|
Original
|
PDF
|
FG456)
PK034
FG456
|
socket am3 pinout
Abstract: socket AM2 pinout AM2 pinout Socket F am2 socket pin diagram am3 socket pinout am3 socket pin diagram am2 socket pinout socket AM3 pinout diagram PCIe cable pinout LX5511
Text: Broaddown4 User Manual Issue – 2.00 draft Enterpoint Ltd. - Broaddown4 Manual – Issue 2.00 11/04/2007 Kit Contents You should receive the following items with you Broaddown4 development kit: 1 - Broaddown4 Board 2 - Programming Cable Prog2 Figure 1 - Broaddown4 Board
|
Original
|
PDF
|
|
SPARTAN-3 XC3S400 PQ208
Abstract: SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 tq144 SPARTAN-3 XC3S400 Spartan-3 FPGA Family XC3S4000-FG676 SPARTAN-3 XC3S400 pin SPARTAN-3 XC3S400 architecture XC3S4000FG676 XILINX SPARTAN VQG100
Text: 06 Spartan-3 FPGA Family: Introduction and Ordering Information R DS099-1 v1.4 January 17, 2005 Preliminary Product Specification Introduction - The Spartan -3 family of Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume,
|
Original
|
PDF
|
DS099-1
XC3S50CP132,
XC3S2000FG456,
XC3S4000FG676
DS099-1,
DS099-2,
DS099-3,
DS099-4,
DS313,
DS314-1,
SPARTAN-3 XC3S400 PQ208
SPARTAN-3 XC3S400 pq208 architecture
SPARTAN-3 XC3S400 tq144
SPARTAN-3 XC3S400
Spartan-3 FPGA Family
XC3S4000-FG676
SPARTAN-3 XC3S400 pin
SPARTAN-3 XC3S400 architecture
XILINX SPARTAN VQG100
|
xc2s300e pinouts
Abstract: LP1-D12 L43P xc2s300e l36n xc2s50e L26N L28N XC2S200E L18P
Text: Spartan-IIE 1.8V FPGA Family: Pinout Tables R DS077-4 v1.0 November 15, 2001 Preliminary Product Specification Pin Definitions Dedicated Pin Direction Description GCK0, GCK1, GCK2, GCK3 No Input Clock input pins that connect to Global Clock buffers. These pins
|
Original
|
PDF
|
DS077-4
thT11
DS001-1,
DS001-2,
DS001-3,
DS001-4,
xc2s300e pinouts
LP1-D12
L43P
xc2s300e
l36n
xc2s50e
L26N
L28N
XC2S200E
L18P
|
|
|
qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
|
Original
|
PDF
|
UG112
UG072,
UG075,
XAPP427,
qfn 3x3 tray dimension
XCDAISY
BFG95
XC5VLX330T-1FF1738I
pcb footprint FS48, and FSG48
WS609
jedec so8 Wire bond gap
XC3S400AN-4FG400I
FFG676
XC4VLX25 cmos 668 fcbga
|
XCV200E Device, FG456 Package
Abstract: XCV300BG432 BG432 PCI33 XCV200 XCV300 XCV400 XCV400E p146 AE-29
Text: Application Note - Virtex-E Virtex-E Package Compatibility Guide This package compatibility guide describes the Virtex-E pin-outs and establishes guidelines for package compatibility between Virtex and Virtex-E devices. by Robert Le, Sr. Applications Engineer,
|
Original
|
PDF
|
XCV200E
FG456
XCV200
XCV300E
BG432
XCV200E Device, FG456 Package
XCV300BG432
PCI33
XCV300
XCV400
XCV400E
p146
AE-29
|
XCF00S
Abstract: spartan 3a FGG900 DS099 XCN07010
Text: ds313.fm Page 1 Friday, April 18, 2008 10:26 AM Spartan-3L Low Power FPGA Family R DS313 v1.2 April 18, 2008 Product Specification This product is undergoing discontinuance. Please refer to XCN07010, Product Discontinuation Notice, for more information on last-time purchases and replacement products.
|
Original
|
PDF
|
ds313
DS313
XCN07010,
SSTL18
XCF00S
spartan 3a
FGG900
DS099
XCN07010
|
2S100
Abstract: SPARTAN-II 2S30 what the difference between the spartan and virtex 2S15 2S50 CS144 FG256 PQ208 TQ144
Text: Spartan-II Family FAQ 1. What is the Spartan-II family? The Spartan-II family is the next generation family of the Spartan Series based on the industry-leading Virtex architecture. The Spartan-II family extends the portion of the ASIC market that Xilinx can address, while
|
Original
|
PDF
|
18u/0
XC2S150-6
XC2S150-5.
2S100
SPARTAN-II
2S30
what the difference between the spartan and virtex
2S15
2S50
CS144
FG256
PQ208
TQ144
|
SPARTAN XC2S50
Abstract: SPARTAN-II SPARTAN-II xc2s100 pq208 CS144 FG256 PQ208 TQ144 VQ100 XC2S100 XC2S15
Text: Robust Feature Set • Flexible on-chip memory Distributed and Block Memory • 4 Digital Delay Lock Loops per device Efficient chip level/ board level clock management • Select I/O Technology Interface to all major bus standards HSTL, GTL, SSTL, etc…
|
Original
|
PDF
|
PQ208
FG256
FG456
SPARTAN XC2S50
SPARTAN-II
SPARTAN-II xc2s100 pq208
CS144
FG256
PQ208
TQ144
VQ100
XC2S100
XC2S15
|
SCHEMATIC DIAGRAM OF POWER SAVER DEVICE
Abstract: diode zener nt 9838 Keller AG am3 socket pinout AT-610 XILINX vhdl code REED SOLOMON NORTEL OC-12 A26 zener w9 0780 specifications for multiplexer of nortel
Text: Editorial contact: Ann Duft Xilinx, Inc. 408 879-4726 publicrelations@xilinx.com Kathy Keller Oak Ridge Public Relations (408) 253-5042 kathy.keller@oakridge.com Product Marketing contact: Bruce Jorgens Xilinx, Inc. (408) 879-5236 bruce.jorgens@xilinx.com
|
Original
|
PDF
|
1998--Dramatically
SCHEMATIC DIAGRAM OF POWER SAVER DEVICE
diode zener nt 9838
Keller AG
am3 socket pinout
AT-610
XILINX vhdl code REED SOLOMON
NORTEL OC-12
A26 zener
w9 0780
specifications for multiplexer of nortel
|
Untitled
Abstract: No abstract text available
Text: HXILINX Virtex 2,5 ¥ Field Programmable Gate Arrays N ovem ber 9, 1998 Version 1.1 - AD VAN C E P roduct S pecification Features • • • • • • Fast, high-density Field-P rogram m able Gate Arrays - D ensities from 50 k to 1M system gates - System perform ance up to 200 MHz
|
OCR Scan
|
PDF
|
BG432
BG352
HQ240
FG600
FG680
XCV300-6PQ240C
|
Untitled
Abstract: No abstract text available
Text: f lX IL IN X Virtex 2.5 V Field Programmable Gate Arrays November 9 ,1 9 9 8 Version 1.1 - ADVAN CE Product Specification Features • • • • • • Fast, high-density Field-Programmable Gate Arrays - Densities from 50k to 1M system gates - System performance up to 200 MHz
|
OCR Scan
|
PDF
|
66-MHz
16-bit
32-bit
ReV600
XCV800
XCV1000
XCV300-6PQ240C
|
Untitled
Abstract: No abstract text available
Text: £ XILINX Virtex 2.5 V Field Programmable Gate Arrays February 16, 1999 Version 1.3 Advance Product Specification Features • • • • • • Fast, high-density Field-Programmable Gate Arrays - Densities from 50k to 1M system gates - System performance up to 200 MHz
|
OCR Scan
|
PDF
|
66-MHz
16-bit
32-bit
XCV400
XCV600
XCV800
XCV1000
XCV300
|
Untitled
Abstract: No abstract text available
Text: V ir te x 2 .5 V £ XILINX Field Programmable Gate Arrays May 13, 1999 Version 1.5 Advance Product Specification Features • • • • • • Fast, high-density Field-Programmable Gate Arrays - Densities from 50k to 1M system gates - System performance up to 200 MHz
|
OCR Scan
|
PDF
|
66-MHz
16-bit
32-bit
Regis00
XCV1000
XCV300
FG680
|
