Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    BGA AND CSP Search Results

    BGA AND CSP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TB67H481FTG Toshiba Electronic Devices & Storage Corporation Stepping and Brushed Motor Driver /Bipolar Type / Vout(V)=50 / Iout(A)=3.0 / IN input type / VQFN32 Visit Toshiba Electronic Devices & Storage Corporation
    TCKE800NA Toshiba Electronic Devices & Storage Corporation eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Auto-retry, WSON10B Visit Toshiba Electronic Devices & Storage Corporation
    TCKE800NL Toshiba Electronic Devices & Storage Corporation eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Latch, WSON10B Visit Toshiba Electronic Devices & Storage Corporation
    TCKE812NA Toshiba Electronic Devices & Storage Corporation eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Auto-retry, Fixed Over Voltage Clamp, WSON10B Visit Toshiba Electronic Devices & Storage Corporation
    TCKE812NL Toshiba Electronic Devices & Storage Corporation eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Latch, Fixed Over Voltage Clamp, WSON10B Visit Toshiba Electronic Devices & Storage Corporation

    BGA AND CSP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Table of Contents Table of Contents BGA Socketing Systems Designed for use with Ball Grid Array BGA , Land Grid Array (LGA), and Chip Scale Package (CSP) devices in development, test and production applications. Over 900 footprints available online in our searchable BGA Socket Finder database at www.bgasockets.com.


    Original     		PDF CAT16-PREVIEW06

    SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL

    Abstract: "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"
    Text: Package Information file:///D|/nec_intranet/package/index.htm Package Information Package Type Package List by NEC Code Explanation of Package and Packing Semiconductor Device Mounting Technology Manual Chip Size Package (CSP) BGA Family Flip Chip BGA (FCBGA)


    Original     		PDF

    12x12 bga thermal resistance

    Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack
    Text: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE


    Original     		PDF SZZA005 thoseI1450 12x12 bga thermal resistance SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack

    U37Y

    Abstract: No abstract text available
    Text: 1 Gigabit Stacked DDR2 SDRAM 128Mb x 8 DD51E Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and • • • • • • • •


    Original     		PDF DD51E 128Mb 2D128M82U3BA DD51E 3887x132 U37Y

    U37Y

    Abstract: No abstract text available
    Text: 1 Gigabit Stacked DDR2 SDRAM DD50E 256Mb x 4 Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and • • • • • • • •


    Original     		PDF DD50E 256Mb 2D256M42U3BA DD50E 3887x132 U37Y

    DD256M

    Abstract: T37Z TSOP 66 Package thermal resistance
    Text: 1 GigaBit Stacked DDR1 SDRAM DD54E, DD54ER 256M x 4 Features • Low Profile 66 Ball Two-High Stacked Die micropede BGA • 77% Space Savings Over Two 66 Pin TSOP Packages • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and


    Original     		PDF DD54E, DD54ER DD54ER) DDR400) DD256M42U3BA DD54E 3887x132 DD54E) DD256M T37Z TSOP 66 Package thermal resistance

    T37Z

    Abstract: DD128 TSOP 66 pin Package thermal resistance DD128M82U3BB6 267-Mbps
    Text: 1 GigaBit Stacked DDR1 SDRAM 128M x 8 DD55E, DD55ER Features • Low Profile 66 Ball Two-High Stacked Die micropede BGA • 77% Space Savings Over Two 66 Pin TSOP Packages • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and


    Original     		PDF DD55E, DD55ER DD54ER) DDR400) DD128M82U3BA DD55E 3887x132 DD55E) T37Z DD128 TSOP 66 pin Package thermal resistance DD128M82U3BB6 267-Mbps

    IPC-6011

    Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222
    Text: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications


    Original     		PDF 1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6011 IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222

    PitchChecker

    Abstract: No abstract text available
    Text: PitchChecker ANTI-STATIC SEE THROUGH TM MODEL PC815 PITCH COMPARATOR BULLETIN PC815B-R1 CHECK PITCH AND BODY SIZE OF INTEGRATED CIRCUITS FEATURES PITCHES FOR MANY POPULAR TYPES INCLUDING SOIC, SOP, SSOP, TSSOP, BGA, QFP, QFN, DFN, DIP, CSP and MORE FLEXIBLE AND COMPACT


    Original     		PDF PC815 PC815B-R1 PitchChecker

    Untitled

    Abstract: No abstract text available
    Text: PitchChecker ANTI-STATIC SEE THROUGH TM MODEL PC815 PITCH COMPARATOR BULLETIN PC815B-R1 CHECK PITCH AND BODY SIZE OF INTEGRATED CIRCUITS FEATURES PITCHES FOR MANY POPULAR TYPES INCLUDING SOIC, SOP, SSOP, TSSOP, BGA, QFP, QFN, DFN, DIP, CSP and MORE FLEXIBLE AND COMPACT


    Original     		PDF PC815 PC815B-R1

    PA-PGA181-02W

    Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
    Text: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for


    Original     		PDF 12X12mm. FR4/G10 PA-PGA181-02W PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01

    Untitled

    Abstract: No abstract text available
    Text: MACHINED HIGH FREQUENCY CENTER PROBE TEST SOCKET FOR BGA, CSP, & MLF PACKAGES FEATURES: • Solderless spring probes pressure mount to the test board and device solderball or pad. • Only .077” 1.95mm signal path. • Very low inductance and capacitance.


    Original     		PDF

    BGA 256 PACKAGE power dissipation

    Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
    Text: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced


    Original     		PDF 00-mm 27-mm XC9500 BGA 256 PACKAGE power dissipation BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432

    SPARTAN XC2S50

    Abstract: XCS10 vq100 FG456 XC2S50 xilinx CS144 CSP144 CS144 xc2s30 pq208 XCS30 PQ208 XC2S15
    Text: High volume package solutions guide partanTM families provide the low-cost, high-volume ASIC packages for applications that need low power, small form factors and high reliability. The Chip Scale Package CSP and the Fine Pitch BGA package (FG) provide higher


    Original     		PDF

    K6F1016U4A

    Abstract: No abstract text available
    Text: K6F1016U4A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA November 4, 1998


    Original     		PDF K6F1016U4A 85/Typ. 25/Typ.

    Untitled

    Abstract: No abstract text available
    Text: K6F1016S4A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA November 4, 1998


    Original     		PDF K6F1016S4A 85/Typ. 25/Typ.

    KM616FU1010

    Abstract: KM616FU1010A
    Text: KM616FU1010A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA November 4, 1998


    Original     		PDF KM616FU1010A 80/Typ. 25/Typ. KM616FU1010

    Untitled

    Abstract: No abstract text available
    Text: Preliminary KM616FS1010A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA Draft Date Remark November 4, 1998


    Original     		PDF KM616FS1010A 80/Typ. 25/Typ.

    Untitled

    Abstract: No abstract text available
    Text: Preliminary KM616FR1010A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA Draft Date Remark October 29, 1998


    Original     		PDF KM616FR1010A 25/Typ. 80/Typ.

    SF-PLCC84-J-01

    Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
    Text: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.


    Original     		PDF SK-UGA12/48A-01 SK-MGA12/48A-01 SK-MGA10/48A-01 SK-MGA13/50B-01 SK-MGA12/56A-01 SK-MGA14/56A-01 SK-MGA12/56B-01 SF-PLCC84-J-01 PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket

    2450FB15M0001

    Abstract: bc03
    Text: "High Frequency Ceramic Solutions" 2.45 GHz Filter Balun, conjugate match to BC03 & BC04 BGA/CSP and MTK 6611/6612 chipsets P/N 2450FB15M0001 Page 1 of 3 Detail Specification: 05/05/2012 General Specifications Part Number 2450FB15M0001 40 min.@ 880~960MHz


    Original     		PDF 2450FB15M0001 2450FB15M0001 960MHz 1990MHz 5000MHz 7500MHz bc03

    xc9536tm

    Abstract: FG456 CS144 CS280 CS48 FG256 FG676 XC9500 XC9536 XCV100
    Text: ADVANCED Chip Scale & BGA Packaging New packaging technology for FPGAs and CPLDs reduces board space and increases I/Os. by Jay Aggarwal, Spartan Product Marketing Manager, Xilinx, jay.aggarwal@xilinx.com X ilinx recently announced new 144-ball and 280-ball, 0.8-millimeter pitch chip


    Original     		PDF 144-ball 280-ball, XC9500 144ball FG256, FG456, FG676, FG680. FG456 FG676 xc9536tm CS144 CS280 CS48 FG256 XC9536 XCV100

    IPC-6012

    Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
    Text: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel


    Original     		PDF 1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6012 IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525

    Untitled

    Abstract: No abstract text available
    Text: Preliminary KM616FU1010A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision H istory R evisio n No. H isto ry 0.0 D raft D ate Initial Draft - Specify CSP type to distinguish between uBG A and FP BGA November 4, 1998


    OCR Scan     		PDF KM616FU1010A