BGA 23X23 0.8 Search Results

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

BGA 23X23

Abstract: bga 529 LS-BGA529D-61 BGA 23X23 1
Contextual Info: 19mm [0.748"] Top View 0.7mm [0.028"] 0.7mm [0.028"] 19mm [0.748"] 0.8mm typ. 17.6mm square [0.693"] Side View 1 3.52mm [0.139"] 2 0.2mm dia. [0.008"] 1.67mm [0.066"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non

Contextual Info: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and

HLQFP 176 Package

Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20
Contextual Info: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)

BG329

Abstract: BGA 27X27 pitch
Contextual Info: EIA Standard Layout of Solder Pad for BGA Devices Figure 1: Suggested Board Layout of Soldered pads for BGA Packages Tabel 1 contains the recommended board layout soldered pad dimension for Actel CS and GA BGA packages only. Table 1: Recommended PCB Design Guidelines

bt 1696

Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
Contextual Info: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are

STV0289

Abstract: sti5189 analog satellite tuner stv0289 ST40-300 STV0289 date code PBGA 23X23 0.8 pitch jtag st dvb-s transmitter design MPX audio ENCODER TUNER transport stream
Contextual Info: STi5189 Low-cost QPSK demodulator and MPEG2 decoder for set-top box applications Data Brief Features • Extensive connectivity USB 2.0 host/ULPI, Ethernet MAC MII/RMII, MPX, DVB-CI ■ External memory interface supporting NOR, NAND and serial Flash ■

SG-BGA-6110

Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 36.225mm Ball guide prevents over compression of elastomer

404-pin

Abstract: WK-1 404P 4403-P
Contextual Info: EMBOSSED TAPE CONTAINER Tape Dimensions Unit : mm Symbol φ D0 P2 P0 W S F B0 P E T d de sp tail ro of ck et h K1 K0 ole A0 φ D1 Direction of Feed D0 2 Specification A0 23.2 B0 23.2 K0 2.70 K1 1.55 W 44.0±0.3 F 20.2±0.1 E 1.75±0.1 P 32.0±0.1 P2 2.0±0.1

GAL20V8B-15LD

Abstract: pDS4102-DL2 5962-8983903RA 5962-8983904RA lb388 ispPAC-power1208 GAL20V8B-15LD/883 CPLD military SMD TQFP microcontroller HW7265-dl2
Contextual Info: Bringing the Best Together Product Selector Guide Bringing the Best Together Lattice Solutions Introduction Lattice Semiconductor, the company that pioneered In-System Programmability ISP , offers the industry’s broadest and most diverse portfolio of programmable system solutions.

SG-BGA-6045

Contextual Info: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 36.225mm Ball guide prevents over compression of elastomer

SG-BGA-6055

Abstract: BGA 23X23 0.8
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. Top View High speed, reliable Elastomer connection 30.50mm Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer

NP276-11904-3

Abstract: 7400 IC series information OF ic 7400 specifications of IC 7400 U 2250 B1 NP276-11904 0735X 29X29 for ic 7400 NP276-37206-AC03327
Contextual Info: NP276 Series Open Top Ball Grid Array (BGA) Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: 1,000MΩ min. at 100V DC 100V AC for 1 minute 30m Ω max. at 10mA/20mV max.

PCT-GF30

Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
Contextual Info: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount

Preci-Dip Durtal SA

Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
Contextual Info: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin

BGA 256 PACKAGE power dissipation

Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
Contextual Info: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced

EA-190-H125-T710

Abstract: EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710
Contextual Info: Aavid Clip Attach E for Series Aavid Clip Attach E-Series BGAs AAVID CLIP ATTACH E-SERIES Introducing Aavid’s line of clip attach heat sinks for BGA applications. The series utilizes an easy to mount plastic frame along with flexible wire springs. The wire springs are resistant to breakage and allow

514-PP-NNNMXX-XXX148

Abstract: IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1
Contextual Info: pga/bga/plcc ソケット pga/bga/plccソケット クイックセレクタ図表 PGA/BGA/PLCCソケット WWW.PRECIDIP.COM TEL +41 32 421 04 00 ピッチ SALES@PRECIDIP.COM 2.54mm PGA 千鳥型 ソケット 半田テール 1. 27mm BGA 1. 27mm PLCC 173 1mm

17x17 bga thermal resistance

Abstract: BG728 12x12 bga thermal resistance
Contextual Info: R Thermal Data Thermal Considerations Due to the variety of applications in which Virtex-II FPGA devices are likely to be used, it is traditionally a challenge to predict the power requirements, and thus the thermal management needs, of a particular application. Virtex-II devices in general are

xxxxx

Abstract: 540-88-084-17-400 540-88-068-24-000-1 23X23 131105 510pp PPS-GF30-FR
Contextual Info: PGA／BGA／PLCC 插座 PGA／BGA／PLCC插座 快速选择表 PGA／BGA／PLCC插座 网址：WWW.PRECIDIP.COM 电话：＋41 32 421 04 00 电子信箱：SALES@PRECIDIP.COM 间隔 PGA 2.54 mm 填隙式 插座 焊尾 BGA 1.27 mm 1.27 mm PLCC 1 mm 参见页码

qt2025

Abstract: QT2225 QT2225-1 S4886 QT2025-1 S19262 AMCC S4882 S4882 S19258 S19233
Contextual Info: ɈɩɳȹɝĘɈअౠ Product Selector Guide ȹȤɃɁ ɕȡɖɪɃȯ ɕɬĘɞɞɃɑ ɇĘȿȳɠǗȕȀ Ɇɬȳɠಞซॾ PHY ɇɐȤȹ Product Selector Guide ࠖซþ૟ঝþࡼ೧ȹɈɬĘȸǻ ۛ‫ژ‬ǻȽɪɥĘȷɧɳȟળԽ ɍɃɈɯĘȯ ȳɳɐĘȸȧɳȹ ɈɪɗɫɗɬȤ

STV0289

Abstract: sti5189 STV0289 date code st40 jtag analog satellite tuner stv0289 st40 Application CPU ST40-300 DVB-S FEC demodulator jtag st TELETEXT TRANSMITTER
Contextual Info: STi5189 Low-cost QPSK demodulator and MPEG2 decoder for set-top box applications Data brief Features • Advanced security features, compatible with the latest CA requirements ■ Satellite STBs can be produced with very small BOM and two-layer PCBs ■ DVB-S compliant

G770LE

Abstract: PXA270 instruction set blackberry LCD 63 ball Vfbga thermal resistance Intel pxa270 Intel XScale PXA270 pxa25 PXA270 programmer guide pxa270 PXA270 usb
Contextual Info: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache

pxa270

Abstract: G770* sumitomo motorola MCX 90 radio PXA270 jtag flash programming PXA270 instruction set blackberry mobile phone circuit diagram blackberry mobile phone G770 motorola g18 gsm datasheet Intel pxa270
Contextual Info: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache