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    SG-BGA-6055 Search Results

    SG-BGA-6055 Result Highlights (3)

    Part ECAD Model Manufacturer Description Download Buy
    TMS320C28345ZEPQ
    		Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
    TMS320C28346ZEPQ
    		Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
    TMS320C28343ZEPQ
    		Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments

    SG-BGA-6055 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SG-BGA-6055
    		Ironwood Electronics GHz BGA Sockets-0.8mm; IC Size X (mm): 19; IC Size Y (mm): 19; IC Array X: 23; IC Array Y: 23; Max Pincount: 528; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.1; IC Ball Diameter Max (mm): 0.45; IC Ball Height Max (mm): 0.35; IC Ball Height Min (mm): 0.25; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 1.45; Max Package Code: Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF) Original PDF