BA1360
Abstract: control ic for induction heating cooker epoxy adhesive paste cte table BA1360F
Contextual Info: Monolithic ICs S m a ll S ma l l Outline Package Outline Package High-density packaging is strongly requested lor e le c 2 Are package power smaller than M odel DIP? — tronic parts as the electronic equipment and devices are There is a difference with a single production unit. How
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FIT4 diode
Abstract: BA1360 BA1360F
Contextual Info: i y U *> 7 ^ IC/'M onolithic ICs m m ±<D zm Precautions for Use • e * • m m m o it M • Storing and Transporting ICs 1 i C f ò i g t i m & T n M t t c z<r>W5±<r>t:ih, (1) To p revent lead oxidation w hen ICs are stored, s to r % * > '< < m a ge should be done as clo se to room te m p e ra tu re as
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BA5412
Abstract: BA1335 BA1355 BA1440 BA5413 ba532 BA4422AN ba5406 BA1441 BA1404
Contextual Info: -» «aW B ‘•.UJBPBJ 1 V-P.tl a . II.U 3323 7 ^ 7 7 -0 / • RF Signal Processors continued Type BA4405 BA4408F Function FM front end Package Configuralion No. ofpins SIP Features Reference Catalog 7 Higher gain than the BA4403. No.3121 Equipped with RF amplifier, mixier, OSC, IFamplifier
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-77-Ol
BA4405
BA4403.
BA4408F
BA4411
BA4412
BA4413
BA4422AN
BA4424N
MFS16
BA5412
BA1335
BA1355
BA1440
BA5413
ba532
BA4422AN
ba5406
BA1441
BA1404
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BA1360
Abstract: BA1360F 5204F
Contextual Info: t J l v "J 0 IC/Monolithic ICs Precautions for Use • S torin g a n d T ra n sp ortin g ICs 1) I C £ f c im J S i 0 i M t 4 i: < D R f ill: < D f c 0 > , 4 '- 5 ^ < $ (1) To p re ve n t lead oxidation w hen ICs are stored, stor age should be done as close to room te m p e ra tu re as
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64pin)
BA1360
BA1360F
5204F
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BA1360F
Abstract: BA1360 BA4558 dx tfk 811 s
Contextual Info: IC /M onolithic ICs • IC Thermal Design < Bufis u, s * ! ^ * i£ S S S iZ k it, m + t f M k L t z u i£ c e e d e d , the d e vice p e rfo rm a n ce w ill d e te rio ra te and Z tft '& V tt o may be destroyed. It is n e ce ssary to co n sid e r te m p e ra
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