AY13 Search Results

Contextual Info: T H IS DRAW ING IS U N P U B L IS H E D . R E L E A S E D FOR P UBLICATION BY TYCO ELECTRON ICS CORPORATION. LOC A L L R IG H T S R E S E R V E D . DIST R E V ISIO N S DW p LTR C4 -' m UJ [i DESCRIPTION DATE DWN JL WK 21M AY13 REVISED E C R - 1 3 - 0 0 3 2 9 0

AA131

Abstract: 133M NKR131M NAY131S
Contextual Info: A V b s b ▼7.5mm Type Ta=25°C mÊÈÊBSÊÊÊaBm ISIÊÎÎtÊÈÊÈKBm Case • A rrow feather type 7.0 X 11.0 A rrow feather type 10.0 X 19.0 ▼DIMENSIONS MIN. 1111111 ^ TYP. m MIN. 1YP. 2.8 5.6 10 — 10 Red 0.7 1.4 1.4 :- 0.5 1 1 2 — N AY131S/133S

Contextual Info: THIS DRAWING IS U NPUBLISHED. | RELEASED FOR PUBLIC ATIO N AUG 2006 LOC D IS T DW / REVISIONS 1 B3 Q .Q 0 + Q .2 5 _ TE LO G O D ATE DATE LTR R E V IS E D DWN 21M AY13 E C R -1 3 - 0 0 2 3 9 9 JL APVD WK _CO NN. O U T L IN E & CODE y lO U S E (P S /2 )

AY-133

Abstract: BA1U15 mt18lsdt3272ag10 168-PIN MT9LSDT1672AG-13E MT48LC16M8A2TG 168-pin sdram mt9lsdt1672g-133b1 MT9LSDT1672G-133B
Contextual Info: 128MB x72, ECC, SR , 256MB (x72, ECC, DR) 168-PIN SDRAM UDIMM SYNCHRONOUS DRAM MODULE MT9LSDT1672A(I) – 128MB MT18LSDT3272A(I) – 256MB For the latest data sheet, please refer to the Micron Web site: www.micron.com/products/modules Features • •

Contextual Info: Freescale Semiconductor, Inc. MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MCM63D736/D MCM63V736 Product Preview Freescale Semiconductor, Inc. 128K x 36 Bit Synchronous Dual Port SRAM The MCM63V736 is a 4M–bit static random access memory, organized as

CE1X

Abstract: fast sram 100mhz CE2Y GALVANTECH
Contextual Info: ADVANCE INFORMATION GALVANTECH, INC. DUAL I/O DUAL ADDRESS SYNCHRONOUS SRAM GVT81256P36/GVT81128P36 256K/128K X 36 PIPELINED SRAM 256K/128K X 36 SRAM +3.3V SUPPLY, FULLY REGISTERED TWO BI-DIRECTIONAL DATA BUSES FEATURES GENERAL DESCRIPTION • • • •

PTX 1400

Abstract: MCM67Q909 MCM69D536 MCM69D618 MCM67Q709A
Contextual Info: MOTOROLA Order this document by MCM69D618/D SEMICONDUCTOR TECHNICAL DATA MCM69D618 64K x 18 Bit Synchronous Dual I/O, Dual Address SRAM The MCM69D618 is a 1M–bit static random access memory, organized as 64K words of 18 bits. It features common data input and data output buffers and

Contextual Info: Mobile 3rd Generation Intel Core Processor Family, Mobile Intel® Pentium® Processor Family, and Mobile Intel® Celeron® Processor Family Datasheet, Volume 1 of 2 June 2013 Document Number: 326768-006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

Contextual Info: Pin Information for the Stratix V 5SGXBB Device Version 1.0 Note 1 Bank Number GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4

intel g41 crb

Abstract: AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42 schematic intel g41 g31 crb socket am3 pinout g41 crb MOSFET BA7 intel G41 MOTHERBOARD crb LGA1366 ISL6334EVAL1Z
Contextual Info: Technical Brief 486 ISL6334EVAL1Z User Guide Board Specifications 1. Intel VR11.1 compliant. 2. 4-Phase, 130W, 400kHz, Load Line = 0.8mΩ. 3. Socket: LGA1366, die sensing, can be configured for motherboard sensing. 4. 6 Layer Board: Top/Bottom - 0.5oz plated, 1.5oz

HB54A169FN-8D

Abstract: HB54A89FM-10D HB54A89FM-8D HB54A169FN-10D Hitachi DSA00196 Nippon capacitors
Contextual Info: HB54A89FM Series HB54A169FN Series HB54A89FM 64 MB Unbuffered DDR SDRAM DIMM 8-Mword x 72-bit, 1-Bank Module 9 pcs of 8 M × 8 Components HB54A169FN 128 MB Unbuffered DDR SDRAM DIMM 16-Mword × 72-bit, 2-Bank Module (18 pcs of 8 M × 8 Components) ADE-203-948 (Z)

AY13E

Abstract: PC133 registered reference design 168-pin sdram dimm
Contextual Info: 256MB, 512MB x72, ECC 168-PIN SDRAM DIMM SYNCHRONOUS DRAM MODULE MT9LSDT3272(L)A(I) – 256MB MT18LSDT6472(L)A(I) – 512MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 168-Pin DIMM (MO–161)

AY13E

Abstract: MT48LC32M8A2P
Contextual Info: 256MB x72, ECC, SR , 512MB (x72, ECC, DR) 168-PIN SDRAM UDIMM SYNCHRONOUS DRAM MODULE MT9LSDT3272(L)A(I) – 256MB MT18LSDT6472(L)A(I) – 512MB For the latest data sheet, please refer to the Micron Web site: www.micron.com/products/modules Features •

Contextual Info: Pin Information for the Stratix V 5SGXB6 Device Version 1.1 Note 1 Bank Number GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L5 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4 GXB_L4

LGA 1155 Socket PIN diagram

Abstract: LGA 1155 PIN diagram LGA 1155 pin out lga1155 pin diagram E3-1275 intel LGA 1155 PIN diagram 1155 PINmap lga1155 land E3-1260L CATERR Catastrophic Error
Contextual Info: Intel Xeon® Processor E3-1200 Family Datasheet, Volume 1 This is Volume 1 of 2 June 2011 Document Number: 324970-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

CQ12B

Abstract: EP4SE530 DIODE BA40 f1517 H1152 DQS30B AL-36 ag33 diode diode ak38 AL34
Contextual Info: Pin Information for the Stratix IV E EP4SE530 Device Version 1.1 Bank Number 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1B 1B 1B 1B

diode ak38

Abstract: F1517 AK39 s av36 aw7 diode
Contextual Info: Pin Information for the Stratix IV GT EP4S100G5ES1 Device Version 1.2 Notes 1 , (2), (3), (4) WARNING: For ES1 silicon only Bank Number VREF 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A

LGA 1155 Socket PIN diagram

Abstract: socket lga 1156 pinout LGA 1156 PIN OUT diagram Socket 1156 VID pinout INTEL Core i5 760 LGA 1156 Socket diagram INTEL Core i7 860 i7-870 Processor LGA 1156 PIN diagram i7 800
Contextual Info: Intel Core i7-800 and i5-700 Desktop Processor Series Datasheet – Volume 1 This is volume 1 of 2 July 2010 Document Number: 322164-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

LGA 1366 Socket PIN diagram

Abstract: jstd 002 W3550 W3580 LGA 1366 Socket diagram LGA 1155 PIN diagram LGA1366 W3520 1155 lga socket DELTA fan
Contextual Info: Intel Xeon® Processor 3500 Series Datasheet, Volume 1 July 2009 Document Number: 321332-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

pt45

Contextual Info: LatticeSC Family Data Sheet DS1004 Version 01.2, June 2006 LatticeSC Family Data Sheet Introduction June 2006 Preliminary Data Sheet DS1004 Features • High Performance FPGA Fabric • 15K to 115K four input Look-up Tables LUT4s • 132 to 942 I/Os • 700MHz global clock; 1GHz edge clocks

Contextual Info: MOTOROLA Order this document by MCM63D736/D SEMICONDUCTOR TECHNICAL DATA MCM63D736 128K x 36 Bit Synchronous Dual I/O, Dual Address SRAM The MCM63D736 is a 4M–bit static random access memory, organized as 128K words of 36 bits. It features common data input and data output buffers and

SRAM

Contextual Info: MOTOROLA Order this document by MCM69D536/D SEMICONDUCTOR TECHNICAL DATA MCM69D536 32K x 36 Bit Synchronous Dual I/O, Dual Address SRAM The MCM69D536 is a 1M–bit static random access memory, organized as 32K words of 36 bits. It features common data input and data output buffers and

Contextual Info: ` Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.4.1 March 24, 2003 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded

DFDH2012T900S

Abstract: LPC 815 LG F11YT1 HAT2180RP G402R P06KE GP03S ara cd 100 39p LPC TPM 0603FT
Contextual Info: 1-fid e n tic i Iw in iie a u Model : F11YT1 R:0 Intel Yonah ULV+Calistoga 945GM+ICH7-M Revision History ORIGINAL RELEASE A B 2006/01/12 Rev:B release. c 2006/03/17 R e v :C release. 2006/03/31 R e v :0 release. PCB STA C K U P LAY1 LAY2 LAY3 LAY4 LAY5