ANSYS SOIC Search Results

ANSYS SOIC Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
FLAC1000		Amphenol Communications Solutions	FLA Shorting Cap NEMA ANSI C136.41, Shorting Contacts
FLBC70354001		Amphenol Communications Solutions	FLB Dome, NEMA ANSI C136.41, 76mm, 35mm Height, Black
FLBC70602001		Amphenol Communications Solutions	FLB Dome, NEMA ANSI C136.41, 76mm, 60mm Height, Clear
FLBC70756001		Amphenol Communications Solutions	FLB Dome, NEMA ANSI C136.41, 76mm, 75mm Height, Translucent
FLBC70134001		Amphenol Communications Solutions	FLB Dome, NEMA ANSI C136.41, 76mm, 130mm Height, Black

ANSYS SOIC Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
CY27S03A Abstract: 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide Text: Thermal Management and Component Reliability slope of the logarithmic plots is given by the activation energy of the failure mechanisms causing thermally activated wear out of the device see Figure 1 . One of the key variables determining the long-term reliability	Original	CY7C122 CY27S03A 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide	PDF
CY7C9101 Abstract: CY7C510 CY7C190 cy7c189 G30-88 CY7c910 EA 9394 cy3341 CY6116 cy7c901 Text: fax id: 8511 Thermal Management Thermal Management and Component Reliability One of the key variables determining the long-term reliability of an integrated circuit is the junction temperature of the device during operation. Long-term reliability of the semiconductor chip degrades proportionally with increasing temperatures following an exponential function described by the	Original		PDF
AN569 in Motorola Power Applications Abstract: motorola mosfet BASIC THERMAL MANAGEMENT OF POWER SEMICONDUCTORS MTP15N06V equivalent dpak DIODE ANODE COMMON motorola ir 722c motorola Power Applications Manual mtv32 DV240 AN1083 Text: Thermal Compendium Table of Contents Abstracts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Basic Semiconductor Thermal Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7	Original		PDF
BASIC THERMAL MANAGEMENT OF POWER SEMICONDUCTORS Abstract: tesec manual microsemi 1-E 380 igbt thermal characterization and simulation using ansys water cooled Chiller AN569 "silicon image" dvi handheld schottky transistor spice BR1487 Motorola transistor schottky model spice Text: Thermal Modeling and Management of Discrete Surface Mount Packages Yes, you do have the right materials! Thank you for ordering ON Semiconductor product information. This data book, while it has the ON Semiconductor cover, still references Motorola throughout its contents. As we transition away from our old identity as the Motorola	Original		PDF
JESD51-9 Abstract: Plastic Pin Grid Array UBM STD-20C WLCSP stencil design A102 A104 A110 AN-617 MO-211 outline of the heat sink for Theta JC Text: AN-617 APPLICATION NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com MicroCSP Wafer Level Chip Scale Package by John Jackson and Alan O’Donnell • GENERAL DESCRIPTION	Original	AN-617 EIA-481-C, AN03272-0-6/07 JESD51-9 Plastic Pin Grid Array UBM STD-20C WLCSP stencil design A102 A104 A110 AN-617 MO-211 outline of the heat sink for Theta JC	PDF
Untitled Abstract: No abstract text available Text: AN-617 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Wafer Level Chip Scale Package by the Wafer Level Package Development Team GENERAL DESCRIPTION PURPOSE	Original	AN-617 AN03272-0-5/12	PDF
power tmos Abstract: 936G PR 751S K1 MARK 6PIN SOT-363 carrier chiller mc10116 MC10H210 mmsf5n03hd 0j sod-523 CASERM Text: Semiconductor Packaging and Case Outlines Reference Manual CASERM/D Rev. 1, Aug−2003  SCILLC, 2003 Previous Edition  2000 “All Rights Reserved’’ CASERM ChipFET is a trademark of Vishay Siliconix. POWERMITE is a registered trademark of and used under a license from Microsemi Corporation.	Original	Aug-2003 power tmos 936G PR 751S K1 MARK 6PIN SOT-363 carrier chiller mc10116 MC10H210 mmsf5n03hd 0j sod-523 CASERM	PDF
Copper Alloy C151 Abstract: C151 C194 BERG Electronics c151 c194 shear stress TO 92 leadframe abstract on mini ups system abstract on mini ups system circuit design et 455 PACKAGE THERMAL CHARACTERIZATION Text: APPLICATIONS INFORMATION HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES ABSTRACT A new, high-performance version of a Plastic Dual-In-Line package with improved reliability levels has been	Original		PDF
Copper Alloy C151 Abstract: C151 C194 c194 shear stress leadframe materials c151 lead frame C151 C194 "leadframe material" DIP Text: APPLICATIONS INFORMATION HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES ABSTRACT A new, high-performance version of a Plastic Dual-In-Line package with improved reliability levels has been developed for high-power integrated circuit industrial and automotive	Original		PDF
IGBT 60A spice model Abstract: 8 pin ic 3842 motorola an569 thermal IR 948P 0.65mm pitch BGA socket bt 2323 DFN 3.3X3.3 HTC Korea SPICE thyristor model 527 MOSFET TRANSISTOR motorola Text: Semiconductor Packages and Case Outlines Reference Manual CASERM/D Rev. 2, September−2006 SCILLC, 2006 Previous Edition © 2003 “All Rights Reserved’’ CASERM ChipFET is a trademark of Vishay Siliconix. POWERMITE is a registered trademark of and used under a license from Microsemi Corporation.	Original	September-2006 IGBT 60A spice model 8 pin ic 3842 motorola an569 thermal IR 948P 0.65mm pitch BGA socket bt 2323 DFN 3.3X3.3 HTC Korea SPICE thyristor model 527 MOSFET TRANSISTOR motorola	PDF
BFG95 Abstract: No abstract text available Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL	Original	UG112 UG072, UG075, XAPP427, BFG95	PDF