Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    AMKOR G600 Search Results

    AMKOR G600 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Ablestik 8290

    Abstract: C194 G600 MS-013 Amkor Wafer level mold compound PPF leadframe
    Text: LEADFRAME data sheet SOIC Features: Small Outline IC Packages: Amkor has a broad portfolio of Small Outline ICs SOIC packages, including .150", .208" and .300" body sizes. Statistically controlled and refined assembly processes coupled with very high quality materials assure the best


    Original     		MS-013 MS-019 Ablestik 8290 C194 G600 MS-013 Amkor Wafer level mold compound PPF leadframe PDF

    PCN0801

    Abstract: hitachi epoxy en4900 Ablestik 8290 en4900 EN-4900 hitachi en4900 epcs1n Nitto* mp8000ch4 epoxy 8290 mp8000ch4
    Text: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0801 ALTERNATIVE MANUFACTURING SITE FOR EPCS FAMILY Change Description This is an update to PCN0801; please see the revision history table for information specific to this update. Altera introduced Amkor Philippines as an alternative assembly manufacturing site for the Altera


    Original     		PCN0801 PCN0801; PCN0801 hitachi epoxy en4900 Ablestik 8290 en4900 EN-4900 hitachi en4900 epcs1n Nitto* mp8000ch4 epoxy 8290 mp8000ch4 PDF

    SOT23 JEDEC standard orientation

    Abstract: SOT23 JEDEC standard MO-223A c 3421 transistor SOT23 JEDEC standard orientation pad size JEDEC 95 sot packages MO-193D 193d Amkor G600 SC sot23
    Text: LEADFRAME data sheet SOT / SC Features: Thermal Resistance: Standard Outline Transistor SOT23 and Single Chip (SC70) Packages: Amkor’s 1.0 mm thick, 3, 5, 6, and 8 lead SOT23 and 5 and 6 lead SC70 packages offer gullwing lead, subminiature, SMT performance


    Original     		MO-193D. SOT23 JEDEC standard orientation SOT23 JEDEC standard MO-223A c 3421 transistor SOT23 JEDEC standard orientation pad size JEDEC 95 sot packages MO-193D 193d Amkor G600 SC sot23 PDF

    MO-150

    Abstract: C194 MP8000AN G600 MO-137 amkor
    Text: LEADFRAME data sheet SSOP Features: Shrink Small Outline SSOP Packages: How do you reduce an SOP size and its board footprint demand? Amkor did it by taking a family of SOPs and shrinking them. The body size was compressed and the lead pitch tightened to obtain a smaller


    Original     		MO-150 MO-118 MO-150 C194 MP8000AN G600 MO-137 amkor PDF

    STMicroelectronics marking code date

    Abstract: Date Code Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING sumitomo crm epoxy Part Marking STMicroelectronics Ablebond 8360 marking code stmicroelectronics ablestik 8360 device Marking STMicroelectronics 1076E
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MPG-EEP/04/451 FWH AND LPC FAMILY PLCC32 PACKAGE ENVIRONMENTAL FRIENDLY AND ASSEMBLY LOCATION CHANGE 2004/02/12 PCN MPG-EEP/04/451 Product Family /Commercial Product M50FW M50LPW M50FLW Type Of Change Multiple types of changes


    Original     		MPG-EEP/04/451 PLCC32 M50FW M50LPW M50FLW 30-Apr-2004 30-May-2004 STMicroelectronics marking code date Date Code Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING sumitomo crm epoxy Part Marking STMicroelectronics Ablebond 8360 marking code stmicroelectronics ablestik 8360 device Marking STMicroelectronics 1076E PDF

    G770

    Abstract: G600 sy10s897 SY10S897JZ amkor PLCC28 PLCC-28 0815 Unisem PLCC-44
    Text: PLCC Lead Free Package Rel Data High Temperature Storage Life +150 deg C, 1000 hours Device Lot No Pkg Assembly MSL Soak Peak Temp Plating Date Code SS # Reject Dev. Hrs. Location SY100E111LEJY 5A39598M60 SY100E111AEJI 5A39598M20 PLCC-28 PLCC-28 HTSL.L2 HTSL.L2


    Original     		SY100E111LEJY 5A39598M60 SY100E111AEJI 5A39598M20 PLCC-28 6A49576M20 G770 G600 sy10s897 SY10S897JZ amkor PLCC28 PLCC-28 0815 Unisem PLCC-44 PDF

    Sumitomo G700K

    Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1077, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		DS1077, JESD78, Sumitomo G700K sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL PDF

    PCN0702

    Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
    Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line


    Original     		PCN0702 PCN0702, 6300HJ G700M PCN0702 MP8000CH4 48hrs) X10-5 UL-94 SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound sumitomo G700 Tg PDF

    ABLEBOND

    Abstract: No abstract text available
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		DS1086L, JESD78, ABLEBOND PDF

    G700K

    Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1077L, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		DS1077L, JESD78, G700K Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026 PDF

    Nitto MP8000

    Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1086, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		DS1086, JESD78, Nitto MP8000 Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026 PDF

    Sumitomo G700K

    Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1094L, Rev A3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		DS1094L, JESD78, Sumitomo G700K SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K PDF

    Ablestik 84-1

    Abstract: Ablestik Ablestik LMISR4 SUMITOMO g600 Ablestik 84-1 lmis-r4 LMISR4 G600 mold compound G600 mold compound unisem 6300h sumitomo 6300h mold compound
    Text: October 26, 2009 CN-102609 Customer Notification M02045-2Y04-T and M02045G-2Y04-T Second Assembly Site Dear Valued Customer: This notification is for the purpose of informing you of a second assembly site for the M02045-2Y04-T and M02045G-2Y04-T, 16 pin SOIC package.


    Original     		CN-102609 M02045-2Y04-T M02045G-2Y04-T M02045G-2Y04-T, Ablestik 84-1 Ablestik Ablestik LMISR4 SUMITOMO g600 Ablestik 84-1 lmis-r4 LMISR4 G600 mold compound G600 mold compound unisem 6300h sumitomo 6300h mold compound PDF

    PCN0512

    Abstract: G600 mold compound SUMITOMO g600 Nitto MP8000 EP1800I SUMITOMO-G600 altera EPM7032S mold compound altera EPM7032B ep600i
    Text: PROCESS CHANGE NOTIFICATION PCN0512 IMPLEMENTING STANDARD SUMITOMO-G600 SERIES MOLD COMPOUND FOR PLCC PACKAGES Change Description: Altera will implement a standard Sumitomo-G600 series mold compound on its Plastic J-Lead Chip Carrier PLCC packages. All devices in PLCC packages assembled at ASE Malaysia


    Original     		PCN0512 SUMITOMO-G600 MP8000 EPC1064 EPC1064V EPC1213 EPC1441 PCN0512 G600 mold compound SUMITOMO g600 Nitto MP8000 EP1800I altera EPM7032S mold compound altera EPM7032B ep600i PDF

    Untitled

    Abstract: No abstract text available
    Text: 12/07/2004 RELIABILITY REPORT FOR DS1337C, Rev A2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		DS1337C, PDF