TQ32
Abstract: ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6
Text: Atmel Lead Pb -Free Plan Jul-00 Subcontractor Oct-00 Jan-01 Apr-01 Jul-01 Package AIC(Malaysia) 32 lead TSOP AIC(Malaysia) 8 lead SOIC Amkor(Korea) 81 ball CABGA Amkor(Korea) 44 lead TQFP Amkor(Phillip.) 5 X 8 LAP (replaces 8 lead SOIC) Amkor(Korea) 64 lead 10 X 10 LQFP*
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Jul-00
Oct-00
Jan-01
Apr-01
Jul-01
Oct-01
10X10,
TQ32
ablestik
amkor
amkor cabga
Nitto
ASE LQFP 208
CABGA 6x6
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Untitled
Abstract: No abstract text available
Text: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a
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DS550R
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vFBGA* 96 bALL
Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are
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amkor CABGA 56
Abstract: chiparray amkor CABGA 8X8 CTBGA CABGA 17 x 17 thermal resistance CABGA CVBGA MO-195 8x8 64 footprint amkor cabga
Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: Amkor’s ChipArray® packages are laminatebased Ball Grid Array BGA packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count,
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HL832N
Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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BGA 64 PACKAGE thermal resistance
Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect
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63Sn/37Pb)
BGA 64 PACKAGE thermal resistance
FCCSP
CABGA 6x6
amkor flip
fcBGA PACKAGE thermal resistance
bga 9x9 Shipping Trays
CABGA 8X8
BGA 256 PACKAGE power dissipation
BGA 256 PACKAGE thermal resistance
BGA45
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E700G
Abstract: No abstract text available
Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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DS577G
E700G
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cu pillar
Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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DS7409HGB
Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
Text: Data Sheet LAMINATE FlipStack CSP Features FlipStack® CSP The FlipStack CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of
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DS820C
DS7409HGB
DS7409HG
FCCSP
DS-7409HG
HL832 nx-a
HL832
E700G
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HL832N
Abstract: ELC4785 E679 DS7409 MO-298 amkor flip Amkor Technology HL832 MO-192 MO-195
Text: LAMINATE data sheet FlipStack CSP FlipStack® CSP: The FlipStack® CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment
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E679
Abstract: Amkor CSP mold compound chiparray amkor MO-192 Amkor mold compound Amkor Wafer level mold compound amkor polyimide
Text: LAMINATE data sheet Stacked CSP Features: Stacked CSP SCSP : The Stacked CSP (SCSP) family leverages Amkor's industry leading ChipArray Ball Grid Array (CABGA) manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking
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GE100LFCS
Abstract: HL832nxa HL-832NXA HL832NX-A BFG81 Ablestik 2000 aus308 HL832 nx-a AUS-308 JESD22-A110
Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-05 DATE: September 24, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 82V2082BFG & 82V2082BFG8 built in 8 mm x 8mm CABGA-81
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A1008-05
82V2082BFG
82V2082BFG8
CABGA-81
FPBGA-289
JESD22-A110
JESD22-A104
JESD22-A103
JESD22-A113
GE100LFCS
HL832nxa
HL-832NXA
HL832NX-A
BFG81
Ablestik 2000
aus308
HL832 nx-a
AUS-308
JESD22-A110
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ge100lfcsv
Abstract: GE100LFCS SPIL mold compound aus308 GE-100LFCS-V HL832NX Ablestik 89HPES12N3AZGBCGI AUS-308 89HPES10T4G2ZBBCG
Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-03 Product Affected: DATE: September 10, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 19mm x 19mm CABGA-324 (Standard & Green)
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A1008-03
CABGA-324
89HPES12N3A2ZCBCI8
89HPES12N3AZCBC
89HPES12N3AZCBCG
89HPES12N3AZCBCI
89HPES12N3AZGBC
89HPES12N3AZGBCG
89HPES12N3AZGBCGI
89HPES12N3AZGBCI
ge100lfcsv
GE100LFCS
SPIL mold compound
aus308
GE-100LFCS-V
HL832NX
Ablestik
89HPES12N3AZGBCGI
AUS-308
89HPES10T4G2ZBBCG
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MEMS blood pressure sensor
Abstract: "Blood Pressure Sensor" MEMS pressure sensor silicon mems microphone capacitor mems gas sensor mems microphone mems amkor microphone MEMS Filter MEMS optical tunable filters
Text: solution microelectromechanical systems technology MEMS Technology Microelectromechanical systems MEMS are micron-size devices that can sense or manipulate the physical world. MEMS are created using micro machining processes, similar to those used to produce integrated
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ISO-9002,
ISO-9001,
QS-9000
ISO-9001
TS-16949,
MEMS blood pressure sensor
"Blood Pressure Sensor"
MEMS pressure sensor
silicon mems microphone
capacitor mems gas sensor
mems microphone
mems
amkor microphone
MEMS Filter
MEMS optical tunable filters
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Untitled
Abstract: No abstract text available
Text: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost.
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40mil
55/60nm
45/40nm
28/22nm
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A2E5
Abstract: No abstract text available
Text: LH7A404 32-Bit System-on-Chip Data Sheet FEATURES • Three Programmable Timers • 32-bit ARM9TDMI RISC Core – 16KB Cache: 8KB Instruction and 8KB Data Cache – MMU Windows CE™ Enabled – Up to 266 MHz; See Table 1 for speed/temp options • Three UARTs, one with Classic IrDA (115 kbit/s)
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LH7A404
32-bit
10-bit
SMA02004
A2E5
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amkor CABGA 56
Abstract: lpp 68 g1
Text: LH7A404 32-Bit System-on-Chip Data Sheet FEATURES • Three Programmable Timers • 32-bit ARM9TDMI RISC Core – 16KB Cache: 8KB Instruction and 8KB Data Cache – MMU Windows CE™ Enabled – Up to 266 MHz; See Table 1 for speed/temp options • Three UARTs, one with Classic IrDA (115 kbit/s)
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LH7A404
32-bit
10-bit
SMA02004
amkor CABGA 56
lpp 68 g1
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TSMC 0.18 um MOSfet
Abstract: M38510 10102BCA IDT7204L 5962-8768401MQA 0.18um LDMOS TSMC sl1053 TSMC 0.25Um LDMOS UT63M125BB SMD RTAX250S-CQ208 5962-04221
Text: DSCC Supplemental Information Sheet for Electronic QML-38535 Specification Details: Date: 9/2/2008 Specification: MIL-PRF-38535 Title: Advanced Microcircuits Federal Supply Class FSC : 5962 Conventional: No Specification contains quality assurance program: Yes
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QML-38535
MIL-PRF-38535
MIL-STD-790
MIL-STD-690
-581DSCC
QML-38535
TSMC 0.18 um MOSfet
M38510 10102BCA
IDT7204L
5962-8768401MQA
0.18um LDMOS TSMC
sl1053
TSMC 0.25Um LDMOS
UT63M125BB SMD
RTAX250S-CQ208
5962-04221
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amkor
Abstract: No abstract text available
Text: 1 REV. THE DRAWINGS AND INFORMATION CONTAINED HEREIN ARE THE EXCLUSIVE PROPERTY OF AMKOR/ANAM. THE INFORMATION, DRAWINGS AND DESIGN CONCEPTS CONTAINED HEREIN ARE CONFIDENTIAL/PR6PRIETARY, SHALL BE MAINTAINED IN STRICT CONFIDENCE. AND SHALL NOT BE RELEASED TO ANY THIRD PARTY WITHOUT THE EXPRESS
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5M-1994.
amkor
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CABGA-208
Abstract: No abstract text available
Text: 1 REV. THE DRAWINGS AND INFORMATION CONTAINED HEREIN ARE THE EXCLUSIVE PROPERTY OF AMKOR/ANAM. THE INFORMATION, DRAWINGS AND DESIGN CONCEPTS CONTAINED HEREIN ARE CONFIDENTIAL/PR6PRIETARY, SHALL BE MAINTAINED IN STRICT CONFIDENCE. AND SHALL NOT BE RELEASED TO ANY THIRD PARTY WITHOUT THE EXPRESS
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C05652
5M-1994.
02/2G/99
CABGA-208
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DAEWON tray drawing
Abstract: TRAY DAEWON MPSU DAEWON tray 48 daewon CABGA MPSU 140 DAEWON tray 10 x 9
Text: 6 3 1 REVISION HISTORY NDTE i 1. TRAYS MUST MEET A L L REQUIREMENTS OF AMKDR/ANAM # 01-0431-228 3 PROCUREMENT SPEC FDR SHIPPING TRAY. 2. B A K EA B LE TRAYS ARE INTENDED TD BE CONTINUOUSLY BAKED FDR 48 HDURS AT THE BAK E TEMPERATURE AS SPECIFIED . 3. TDTAL U SA BLE C E L L CDUNT IS 220.
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5M-1994.
DAEWON tray drawing
TRAY DAEWON MPSU
DAEWON tray 48
daewon CABGA
MPSU 140
DAEWON tray 10 x 9
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