AMD 28 PDIP PACKAGE DIMENSIONS Search Results

PLCC 32 intel package dimensions

Abstract: 845 bios chip intel 845 circuit diagram all chip TSOP 48 thermal resistance TSOP 48 LAYOUT ap623 am 28f040 AP-623 PCB Layout tsop 48 PIN SOCKET
Contextual Info: E AP-623 APPLICATION NOTE Multi-Site Layout Planning with Intel’s Boot Block Flash Memory December 1996 Order Number: 292178-003 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of

footprint jedec MS-026 TQFP

Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
Contextual Info: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES

isl95836

Abstract: ISL95520 ISL95833 ISL95835 VR126 isl6262 IRS 4 Channel Integrated Class D Audio Driver IC with PWM Modulator ISL912 0/VR126 ISL91106
Contextual Info: P WERING CONSUMER ELECTRONICS Tablets, Smartphones, Smart Watch, Notebook Computers P WERING CONSUMER The power management requirements of efficiency and power dense solutions that mobile devices are becoming more complex increase the battery life of devices and systems

diode A14A

Abstract: BIOS 32 Pin PLCC 845 bios chip PLCC 32 intel package dimensions amd 29f040 thermal resistance INTEL FLASH MEMORY DATA SHEET transistor ap 431 tsop 28-LEAD Footprints picture in picture chip psop 1
Contextual Info: E AP-623 APPLICATION NOTE Multi-Site Layout Planning with Intel's Boot Block Flash Memory CHARLES ANYIMI SENIOR TECHNICAL MARKETING ENGINEER December 1995 Order Number: 292178-002 Information in this document is provided solely to enable use of Intel products. Intel assumes no liability whatsoever, including

tsop Shipping Trays

Contextual Info: Section 4 Thin Sm all O utline P a c k a g e T H IN SMALL O U TLIN E PACKAGE TSO P DES C R IP TIO N AMD presents the Thin Small Outline Package. The TSOP is the industry’s leading edge plastic, surface mountable memory package today. System requirements for higher den­

AM27X256

Contextual Info: FINAL Am27X256 256 Kilobit 32 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation

AM27X512

Contextual Info: FINAL Am27X512 512 Kilobit 64 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation

AM27X128

Contextual Info: FINAL Am27X128 128 Kilobit 16 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation

AM27X64

Contextual Info: FINAL Am27X64 64 Kilobit 8 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation

Contextual Info: AMD3 Am27X256 256 Kilobit 32 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • As an OTP EPROM alternative: — Factory optimized programming — Fully tested and guaranteed ■ As a Mask ROM alternative: — Shorter leadtime — Lower volume per code

Contextual Info: AMD3 Am27C512 512 Kilobit 64 K X 8-Bit CMOS EPRO DISTINCTIVE CHARACTERISTICS • Fast access time ■ Latch-up protected to 100 mA from -1 V to Vcc +1 V ■ High noise immunity ■ Versatile features for simple interfacing — Speed options as fast as 55 ns

amd 27C2048

Abstract: am27c2048 27C2048
Contextual Info: F IN A L A M D il Am27C2048 2 Megabit 128 K x 16-Bit CMOS EPROM DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance standard ■ Fast access time ■ 100% Flashrite programming — Speed options as fast as 55 ns — Typical programming time of 16 seconds

16-038-SB-AG

Abstract: AM27X040
Contextual Info: FINAL Am27X040 4 Megabit 512 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation

AM27X020

Contextual Info: FINAL Am27X020 2 Megabit 256 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: ■ High noise immunity ■ Low power dissipation — Factory optimized programming — Fully tested and guaranteed

AM27X020

Contextual Info: FINAL Am27X020 2 Megabit 256 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation

Contextual Info: FINAL Am27X2048 2 Megabit 128 K x 16-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation

amd 28 pdip package dimensions

Contextual Info: A A m 2 7 X 1 M D Z I 1 Megabit 128 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • As an OTP EPROM alternative: ■ ±10% power supply tolerance — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation

Contextual Info: FINAL A M D il Am27C010 1 Megabit 128 K x 8-Bit CMOS EPROM DISTINCTIVE CHARACTERISTICS • 100% Flashrite programming ■ Fast access time — Speed options as fast as 45 ns — Typical programming time of 16 seconds ■ Low power consumption ■ Latch-up protected to 100 mA from -1 V to

Contextual Info: FINAL AMD£I Am27X040 4 Megabit 512 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • As an OTP EPROM alternative: ■ ±10% power supply tolerance — Factory optim ized program m ing ■ High noise immunity — Fully tested and guaranteed

Contextual Info: AM D a Am27X2048 2 Megabit 128 K x 16-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • -10% power supply tolerance ■ High noise immunity ■ Low power dissipation ■ As an OTP EPROM alternative: — Factory optimized programming — F'jliy tested and guaranteed

AM27X010

Abstract: DA79
Contextual Info: FINAL Am27X010 1 Megabit 128 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation

AM27C010

Contextual Info: FINAL Am27C010 1 Megabit 128 K x 8-Bit CMOS EPROM DISTINCTIVE CHARACTERISTICS • Fast access time ■ 100% Flashrite programming — Speed options as fast as 45 ns — Typical programming time of 16 seconds ■ Low power consumption ■ Latch-up protected to 100 mA from –1 V to

IN3064

Abstract: am29f010b-55
Contextual Info: Am29F010B Data Sheet July 2003 The following document specifies Spansion memory products that are now offered by both Advanced Micro Devices and Fujitsu. Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and

Contextual Info: AMD£I F IN A L Am27X010 1 Megabit 128 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • As an OTP EPROM alternative: ■ +10% power supply tolerance — Factory optim ized programming ■ High noise immunity — Fully tested and guaranteed