AA5 AB5 Search Results

E43F2

Abstract: AG41 AU31 ST BB6 AH42 H42 m7 C37-C39 g18 t40 C1594 AY36
Contextual Info: Ironwood Electronics, Inc. PO Box 21151 • St. Paul, MN 55121 • 651 452-8100 • Fax (651) 452-8400 PA-IPGA503-01, or C1594 Map Rev D PGA Base 1 A B 2 3 4 5 6 1 5 7 9 3 7 8 11 13 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 15 17 19 21 23 25 27 29 31

Contextual Info: 1 1111111111111 111111 1 1111111111111 1 1111111111111 1 1111111111111 1 1 A123456789AABCDCEFCAFBAAAAA A AAAAAAAA A AAAAAAAA A AAAAAAAA A A CA3E 123314567891A758BCD814E1F3D167D1F1C5A36 CDAEA2EA7 !F"#$%&'A7 A 3*+A)BA2EEA#$ACCDCB

TLA-6T718

Abstract: renesas v850e2 hardware manual TLA6T718 V850E2 uPD70F35 V850E2/FL4 E22/6/BSR13/74ABT244/SA6.5CA/54-E3-datasheet
Contextual Info: User’s Manual ユーザーズ・マニュアル V850E2/MN4 Target board QB-V850E2MN4DUAL-TB User’s Manual 動作電圧 ③寸法部品配置など 3.0V～3.6V OSC1:9.6MHz 発振子使用時 79 80 79 80 1 2 1 2 LED4 ACTIVITY LED5 SPEED100 30 40 50 10

Contextual Info: 2342156758692 755BCA15DAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA EFAAA 3*& D'' # @ / 8B5:7BF9 2A

9LPR310

Abstract: 9LPR310-CLK SADQ34 U24E SADQ32 ITE8510 VSS011 AMPLIFIER HY 219 SADQ25 U24g
Contextual Info: Chapter 2 Major Components Page 1 of 40 Chapter 2 Major Components 2.1. System Block Diagram …………………………………………………. 3 2.2. Major Component Definition.…….……………………………….…… 31 2.3. Connector Definition…….………………………………………………. 40

VSS011

Abstract: IT8510 ALC882H X72IA6 U24E 9LPR310-CLK ich7 HA20 SAMA5
Contextual Info: Chapter 2 Page 1 of 42 Major Components Chapter 2 Major Components 2.1. System Block Diagram ……………………………………………. 3 2.2. Major Component Definition.…….………………………………. 30 2.3. Connector Definition…….………………………………………….

P53IA0

Abstract: 9LPR310 SAMA5 9LPR310-CLK hd51 IT8510 z2508 Z1515 HA20
Contextual Info: Chapter2 Page 1 of 36 Major Components Chapter2 Major Components 2.1. System Block Diagram …………………………………………………. 3 2.2. Major Component Definition.…….……………………………….…… 4 2.3. Connector Definition…….………………………………………………. 28

XC61CN2702MR

Abstract: XC61CN2702M XC61CN2702 16gb chip 16GB Nand flash AS3SSD16GB5PBG AB-24 AC18-AC19
Contextual Info: SOLID STATE DISK ON CHIP A STORAGE SOLUTIONS PRODUCT AS3SSDxxGBxPBG 1 / 2 / 4 / 8 & 16GB NAND SLC FLASH MEMORY SUBSYSTEM FEATURES SSDoC Solid State Disk on Chip, a Storage Solutions Product AS3SSDxxGByPBG Equates to the integration of: NAND FLASH Controller

AA10

Abstract: AA23 EP20K200E E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
Contextual Info: EP20K200E I/O Pins ver. 1.0 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – Pad Number Orientation Pin/Pad Function 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA

337 BGA

Abstract: U212-25 AA10 AA23 EP20K200C E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
Contextual Info: EP20K200C I/O Pin-Outs ver. 1.0 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA 652-Pin BGA 672-Pin FineLine BGA 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 –

AJ43

Abstract: AG43 BA43 transistor bc29 BC33 AA45 AR33 Be43 BA41 BE45
Contextual Info: EPF10K250A Device Pin-Outs ver. 1.0 Pin Name MSEL0 2 MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4) nCS (4) CS (4) RDYnBSY (4) CLKUSR (4) DATA7 (4) DATA6 (4) DATA5 (4) DATA4 (4) DATA3 (4) DATA2 (4)

AR17 datasheet

Abstract: BA43 AG45 ba43 diode be27 transistor bc29 ba7 transistor A45 so Be43 ba37
Contextual Info: EPF10K130V Device Pin-Outs ver. 1.0 Pin Name MSEL0 2 MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4) nCS (4) CS (4) RDYnBSY (4) CLKUSR (4) DATA7 (4) DATA6 (4) DATA5 (4) DATA4 (4) DATA3 (4) DATA2 (4)

RT3PE3000L

Abstract: RT3PE600L CCGA diode t25 4 L9 AG18 AA10 AA13 aa19 896-CCGA IO115NPB3V0
Contextual Info: Radiation-Tolerant ProASIC3 Packaging 3 – Package Pin Assignments 484-Pin CCGA A B C D E F G H J K L M N P R T U V W Y AA AB 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Note: This is the bottom view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at

AA43

Abstract: AJ43 BE43 AR-23 BF44 bg47 AR33 t35 4 c8 EPF10K200E AY42
Contextual Info: EPF10K200E Device Pin-Outs ver. 1.0 Pin Name 1 MSEL0 (2) MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4) nCS (4) CS (4) RDYnBUSY (4) CLKUSR (4) DATA7 (4) DATA6 (4) DATA5 (4) DATA4 (4) DATA3 (4) DATA2 (4)

Calistoga

Abstract: ALC861 VSS011 DMI0TXP OZ128TN ALC880 SAMA5
Contextual Info: Chapter2 Page 1 of 45 Major Components Chapter2 Major Components 2.1. System Block Diagram ……………………………………………… 3 2.2. Major Component Definition .…….………………………………. 35 2.3. Connector Definition…….………………………………………….

k2843

Abstract: NC154 74LV128 NC168 NC108 NC143 C495 transistor NC164 NC132 NC130
Contextual Info: ZLAN-57 ZL50211 2048 Channel VEC System Application Note Contents August 2003 The design contained within this document is intended as reference material only, and not as a fully qualified system. It is intended to be used as a starting point for a customer design.

AD149

Abstract: tms 374 con1 AD347 C8816 AD255 PCI9030 con20A la3106 ad1037
Contextual Info: A B C D E VCC3v3 VCC1v8 VCC3V3 C2 MRST- C18 RST tRst- L20 tRst- CS0CS1CS2CS3- B19 A19 B18 A18 CS0CS1CS2CS3- ALE RDWRLW-R C17 B17 A17 E16 ALE RD WR W/R- tCStWRtRDtDBEn tALE tBLast L18 L17 K22 K21 K19 K18 tCStWRtRDtDBEn tALE tBlast tRdy tInt- K17 J22 tRdy tInt-

AG31

Abstract: QSE66 QSE60 QSE64 QSE25 AD32 XpressGXII AF29
Contextual Info: BB_HSI Daughter Board Reference Manual Version 1.0 January 2007 Copyright PLDApplications 1996-2006 BB_HSI Reference Manual BB_HSI Reference Manual Change History Date January 2007 Version Number 1.0 Change ● First Release Table of Contents Chapter 1

i960Cx

Abstract: AA10 V96BMC V96BMC-33LP V96BMC-40LP
Contextual Info: V96BMC Rev. D HIGH PERFORMANCE BURST DRAM CONTROLLER FOR i960Cx/Hx/Jx PROCESSORS • Pin/Software compatible with earlier V96BMC. • Software-configured operational parameters. • Direct interfaces to i960Cx/Hx/Jx processors. • Integrated Page Cache Management.

H1AA2

Abstract: equivalent for S AV36 AK17 XC4000D AY42 AF38 BG560 AJ32
Contextual Info: £ XILINX XC4000XV Family Field Programmable Gate Arrays November 21,1997 Version 0.9 Advance Product Specification XC4000XV Family FPGAs XC4000XV Electrical Features Note: This data sheet describes the XC4000XV Family devices. This information does not necessarily apply to the

diode t25 4 k8

Abstract: diode t25 4 B9 diode t25 4 H9 diode t25 4 k5 diode t25 4 L9 diode AA17 diode t25 4 k6 diode t25 4 g8 diode t25 4 G9 T4 w4 DIODE
Contextual Info: Pin Information For The Stratix EP1S10 Device, ver 3.1 Bank Number B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B1 B1 VREF Bank Pin Name/Function Optional Function s

A3PE600L

Abstract: 896-Pin FBGA 896 A3PE3000L A3P1000 IO283PDB7V1 ACTEL FBGA 144 ProASIC3 EL B17 AF29
Contextual Info: Military ProASIC3/EL Packaging 3 – Package Pin Assignments 208-Pin PQFP 1 208 208-Pin PQFP Note: This is the top view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at .

896-pin

Abstract: FBGA 896 AA13 E20 L27 AF29 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1
Contextual Info: IGLOOe Packaging 3 – Package Pin Assignments 256-Pin FBGA A1 Ball Pad Corner 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T Note: This is the bottom view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at

FBGA 896

Abstract: AA13 896-Pin AJ26 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1 IO283PDB7V1
Contextual Info: IGLOO e Packaging 3 – Package Pin Assignments 256-Pin FBGA A1 Ball Pad Corner 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T Note: This is the bottom view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at