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    A5637 Search Results

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    A5637 Price and Stock

    NXP Semiconductors DSPA56371AF160B

    - Trays (Alt: DSPA56371AF160B)
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    Avnet Americas DSPA56371AF160B Tray 0 Weeks, 2 Days 62
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    Flip Electronics DSPA56371AF160B 3,090
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    NXP Semiconductors KDSPA56371AF180

    - Trays (Alt: KDSPA56371AF180)
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    Avnet Americas KDSPA56371AF180 Tray 0 Weeks, 2 Days 58
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    Flip Electronics KDSPA56371AF180 2,430
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    Philips Semiconductors TDA5637BMC1

    9 V VHF HYPERBAND AND UHF MIXER/OSCILLATOR FOR TV AND VCR 3-BAND Video Tuner, 3-Band, PDSO24
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    ComSIT USA TDA5637BMC1 30,365
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    Freescale Semiconductor DSPA56371AF180

    Digital Signal Processor, 24-Bit Size, CMOS, PQFP80
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    ComSIT USA DSPA56371AF180 2,790
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    Motorola Semiconductor Products DSPA56371AF180

    INSTOCK
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    Chip 1 Exchange DSPA56371AF180 130
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    A5637 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    tungsten slug glass diode

    Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    A5620

    Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    A5625-01

    Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    TOKO 113kn if transformer

    Abstract: ALL BAND TV TUNER IC toko transformer IF 455 khz SSOP24 TDA5636 TDA5636B TDA5636BM TDA5636BT TDA5637 TDA5637B
    Text: Philips Semiconductors Product specification 9 V VHF hyperband and UHF mixer/oscillator for TV and VCR 3-band TDA5636B; A5637B FEATURES GENERAL DESCRIPTION • Balanced mixer with a common emitter input for band A single input The TDA5636B and A5637B are monolithic integrated


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    PDF TDA5636; TDA5637 TOKO 113kn if transformer ALL BAND TV TUNER IC toko transformer IF 455 khz SSOP24 TDA5636 TDA5636B TDA5636BM TDA5636BT TDA5637B

    3-band spectrum analyzer

    Abstract: NF 430 n a3 VHF-UHF Band oscillator ALL BAND TV TUNER IC SSOP24 TDA5636 TDA5636B TDA5637 TDA5637B MLD112
    Text: INTEGRATED CIRCUITS TDA5636B; A5637B Low-power VHF, UHF and hyperband mixer/oscillator for TV and VCR 3-band tuners Objective specification File under Integrated Circuits, IC02 Philips Sem iconductors 7110fl2b DCHlDab Obb This Material Copyrighted By Its Respective Manufacturer


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    PDF TDA5636B; TDA5637B 7110fl2b JDA5636B; 3-band spectrum analyzer NF 430 n a3 VHF-UHF Band oscillator ALL BAND TV TUNER IC SSOP24 TDA5636 TDA5636B TDA5637 TDA5637B MLD112