VN10K
Abstract: No abstract text available
Text: VN10K Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VN10K 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si
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VN10K
VN10K
A022009
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2N7000
Abstract: No abstract text available
Text: 2N7000 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N7000 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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2N7000
2N7000
A022009
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TN2124
Abstract: No abstract text available
Text: TN2124 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) TN2124 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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TN2124
TN2124
A022009
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2N6660
Abstract: 2N6660-1
Text: 2N6660 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N6660 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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2N6660
2N6660
A022009
2N6660-1
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VN0808
Abstract: No abstract text available
Text: VN0808 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VN0808 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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VN0808
VN0808
A022009
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TN2130
Abstract: No abstract text available
Text: TN2130 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) TN2130 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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TN2130
TN2130
A022009
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VP2106
Abstract: No abstract text available
Text: VP2106 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VP2106 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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VP2106
VP2106
A022009
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2n6661 bonding pad lay-out
Abstract: 2N6661
Text: 2N6661 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N6661 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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2N6661
2N6661
A022009
2n6661 bonding pad lay-out
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2N7002 Die Specification
Abstract: 2N7002
Text: 2N7002 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N7002 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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2N7002
2N7002
A022009
2N7002 Die Specification
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VP2110
Abstract: No abstract text available
Text: VP2110 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VP2110 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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VP2110
VP2110
A022009
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DN3145
Abstract: No abstract text available
Text: DN3145 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) DN3145 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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DN3145
DN3145
A022009
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2N7008
Abstract: No abstract text available
Text: 2N7008 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N7008 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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2N7008
2N7008
A022009
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VN2106
Abstract: No abstract text available
Text: VN2106 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VN2106 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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VN2106
VN2106
A022009
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VN2110
Abstract: No abstract text available
Text: VN2110 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VN2110 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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VN2110
VN2110
A022009
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TN2106
Abstract: No abstract text available
Text: TN2106 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) TN2106 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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TN2106
TN2106
A022009
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TP2104
Abstract: No abstract text available
Text: TP2104 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) TP2104 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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TP2104
TP2104
A022009
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