SP2000 Search Results

Contextual Info: S I P E X CORP 35E D B 0203711 0aQ2=iG3 H H S P X SP2000 Series Analog Array Macrocell Selection Guide : " T 4 2 ' Z i Amplifiers Description OPA1 OPA2 OPA3 OPA5 OPA6 OPA21 mV 3 3 3 3 3 3 General Purpose OpAmp General Purpose OpAmp Precision OpAmp Clam ped Output OpAmp

schematic diagram atx Power supply 500w

Abstract: pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 Digital Signal Processors, iCoupler , iMEMS® and iSensor . . . . . 805, 2707, 2768-2769 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-568 RF Connectors . . . . . . . . . . . . . . . . . . . . . . Pages 454-455

K 192 A transistor

Abstract: k 192 transistor SP2104 high speed small signal transistor Ft 1000Mhz buried zener
Contextual Info: SIPEX CORP bOE D • 6563711 00031=13 T7 T I SPX C i r \ û v SIGNAL PROCESSING EXCELLENCE SP2104 Analog Array FEATURES ■ Dielectric Isolation Dl for Minimum Parasitics and Optimum Latch-up Free Performance ■ 35 Volt or 20 Volt Process ■ 12 Tile Array Structure

HT50

Abstract: XPD-31
Contextual Info: H A N D H E L D P O R T A B L E S Portable Antenna Selection Guide ARMOR-FLEX Antennas YHF 141-174 MHz 1, XP-series CONNECTOR M o l d e d q u a rte r-w a v e V H F an ten na , helical design. A p p ro x im a te length: 6 inches ( 15 cm ). P o w e r rating: 50 w atts

Contextual Info: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE

HP5082-7760

Abstract: hp 4514 opto led 7 segment anode TIL 702 HP 2231 opto coupler uaa170 UAA180 equivalent seven segment to BCD converter LM 7447 IC hp 5082 4204 pin photodiode cd40288 7448 bcd to seven segment decoder
Contextual Info: ABOUT THE AUTHORS STAN GAGE has more than 10 years' experi­ ence in the design and application of optoelec­ tronic devices and the design and processing of linear integrated circuits. DAVE EVANS has developed various contrast enhancement technologies currently being

74 hc 59581

Abstract: b768 transistor transistor smd 661 752 8 pin ic base socket round pin type lead 652B0082215-002 MM5231 702 transistor smd code LA9100 LGA 1155 Socket PIN diagram smd transistor w16
Contextual Info: 717 Technical portal and online community for Design Engineers - www.element-14.com Semiconductor Hardware & Thermal Management Page Page 727 725 725 732 739 732 749 736 725 724 723 723 724 721 720 722 726 752 728 751 Crystal Oscillator Sockets . . . . . . . . . . . . . . . . . .

ss200

Contextual Info: SIPEX CORP bOE ]> • 0 2 0 3 71 1 0 0 0 3 10 7 SPX _ C ir 'S A v ” b7S CtxpCfMion ▼ ' SIGNAL PROCESSING EXCELLENCE SP2101 Analog Array FEATURES DESCRIPTION ■ The SP2101 is a high-density, high perfor­ m ance analog array containing 180 linear bipolar transistors. Twelve high current

Thin Film Resistors SiCr analog

Contextual Info: SIPEX CORP bOE ]> • Ô2Ô3711 □ □ □ 3 m 3T7 ■ SPX C ir N A v SIGNAL PROCESSING EXCELLENCE SP2107 Analog Array FEATURES ■ Dielectric Isolation Dl for Minimum Parasitics and Optimum Latch-up Free Performance ■ 35 Volt or 20 Volt Process ■ 20 Tile Array Structure

high speed small signal transistor

Abstract: pnp 8 transistor array
Contextual Info: SIPEX CORP bQE D • 0 2 0 3 71 1 G G D 3 ^ D IbT SPX C ir tA v W lk A # A * Corporation▼ SIGNAL PROCESSING EXCELLENCE SP2103 Analog Array FEATURES ■ Dielectric Isolation Dl for Minimum Parasitics and Optimum Latch-up Free Performance ■ 35 Volt or 20 Volt Process

Contextual Info: B U R R -B R O W N « [ SP2000 ] CCD SIGNAL PROCESSOR FOR DIGITAL CAMERAS FEATURES DESCRIPTION • CCD SIGNAL PROCESSING Correlated Double Sampling Black Level Clamping 0 to +34dB Gain Ranging High SNR: 53dB T h e V S P 2000 is a co m plete digital cam era IC , p rovid­

T8110 H.100

Abstract: T810X ECTF 2417G4A SP2000 T8100A T8102 T8105 T8110 TMXF84622
Contextual Info: Product Brief August 2001 Ambassador T8110 PCI-Based H.100/H.110 Switch and Packet Payload Engine Introduction Applications The T8110 is the newest addition to the Ambassador series of TDM switching and backplane interconnect standard products. The T8110 can switch 4096

SIL-PAD

Abstract: thermal conductive pressure sensitive adhesive
Contextual Info: Sil-Pad 2000 Higher Performance, High Reliability Insulator Features and Benefits TYPICAL PROPERTIES OF SIL-PAD 2000 PROPERTY Color • Thermal impedance: 0.38°C-in2/W @50 psi • Optimal heat transfer • High thermal conductivity: 3.5 W/m-K IMPERIAL VALUE

CMP-01

Contextual Info: SP - 2107 liHiiiiimui Bond Pad Buried Zener Nichrome Clear Field Area 1- HPNP HNPN 0 N+/P+Diode Esa Pinch Resistor i— i DBNPN | DBPNP (I ) MNPN @ MPNP [] SPNP ¡SNPN Capacitor Block m 1^lpF SP2107 COMPONENT COUNT SUMMARY DESCRIPTION COUNT Tiles:

SP1750

Abstract: SP1000 SP1950 SP400 SP2000 SP175
Contextual Info: Choosing the right Sil-Pad Starts with the Mechanical and Electrical Properties MOUNTING TECHNIQUES MOUNTING PRESSURE AND Typical mounting techniques include: • A Spring clip, which exerts a centralized clamping force on the body of the transistor. The greater the mounting

high speed small signal transistor

Contextual Info: SIPEX CORP t,□ E D m Ö263711 Q D D 3 n b böfl SPX -'" P 4 Z .Z I SIGNAL PROCESSING EXCELLENCE SP2105 Analog Array FEATURES DESCRIPTION • The SP2105 is a high-density, high perfor­ m a n c e a n a lo g array c o n ta in in g 696 linear b ip ola r transistors. Twenty-four high-current

K177-353BQ2840

Abstract: K177-NA-353 K1778 TSC209-ZP k177 TSC506-NY K200-AC-403 TSC405-ZP K177-AC-353 K200-AC-353
Contextual Info: HEATSINKS & MOUNTINGS MOUNTING HARDWARE THERMAL INTERFACE MATERIALS KOOL-PADS KA150-2AC. Provides an efficient method of mounting heatsinks on to devices such as CPUs, DIL/SMT packages and other similar devices requiring effective transfer of generated heat. Highly conductive aluminium foil with adhesive applied to both sides negates the

Contextual Info: C ir \Q v U IIJW V ^ SP2107 Analog Array Corpofation ▼ SIGNAL PROCESSING EXCELLENCE • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Dielectric Isolation Dl for Minimum Parasitics and Optimum Latch-up Free Performance 35 Volt or 20 Volt Process 20 Tile Array Structure

Ericsson antennas

Abstract: GP300 TK-300 TK340 XPD58 UHF Antenna XPB30 motorola ht200 XPC31 TK240
Contextual Info: H A N D - H E L D Portable Guide ARMOR-FLEX Antennas CO NNECTO R RADIO Low Band 30-50 MHz A h r . dr l i o t y p e ^ n r e n o i 11 * i e r i XP-sieries ! yr i ; s' i Oi ' i h a v o d i f f i c u l t y i n ; d e r 1 if y i n q I n c r o i •{•.-■

sp2000

Abstract: ASTM D2240 ASTM D5470 SIL-PAD D149 D150 D2240 D257 D374 D5470
Contextual Info: Sil-Pad 2000 Higher Performance, High Reliability Insulator Features and Benefits TYPICAL PROPERTIES OF SIL-PAD 2000 PROPERTY Color • Thermal impedance: 0.33°C-in2/W @50 psi • Optimal heat transfer • High thermal conductivity: 3.5 W/m-K IMPERIAL VALUE

monolithic circuit layout

Abstract: schottky transistor spice
Contextual Info: C ir\A v « /• H W V ^ Corporation ▼ SIGN AL PROCESSING EXCELLENCE ASIC Custom Monolithic Capabilities CUSTOM MONOLITHICS General Information Sipex designs and manufactures full custom analog circuits. Both dielectric isolation and foundry technologies are utilized to meet the

CQFP-48

Abstract: 3296W-1-502LF potentiometer SMC 10V CAPACITOR 100UF 20V THROUGH HOLE preset resistor 10k E1R11 MBRS320T3G MBRS320T3G-T Sil-Pad ISL70001SRH
Contextual Info: Application Note 1518 ISL70001SRHEVAL1Z Evaluation Board The ISL70001SRHEVAL1Z evaluation board is designed to demonstrate the features of the ISL70001SRH, a TID and SEE hardened 6A synchronous buck regulator IC with integrated MOSFETs intended for Space applications. For more detailed information about the

Contextual Info: Sil-Pad 2000 Higher Performance, High Reliability Insulator Features and Benefits TYPICAL PROPERTIES OF SIL-PAD 2000 PROPERTY Color • Thermal impedance: 0.38°C-in2/W @50 psi • Optimal heat transfer • High thermal conductivity: 3.5 W/m-K IMPERIAL VALUE

SP-1104

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