PS512X Search Results

A2631

Contextual Info: DENSE-PAC M ie R O S ì S 16 Megabit High Speed CM OS SRAM D PS512X32C V3 i li M S D E S C R IP T IO N : The DP5512X32CV3 "VERSA-STACK" module is a revolutionarynew high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCQ

Contextual Info: DENSE-PAC 16 Megabit High Speed CMOS SRAM DPS51 2X 3 2 M KV3 MICROSYSTEMS PRELIMINARY DESCRIPTION: The D PS512X32M KV 3 "V ER SA -S TA C K " module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip

ersa ms 8000

Contextual Info: □PM PS512X32V3 Dense-Pac Microsystems, Inc. ^ CERAMIC 512K X 32 C M O S SRAM VERSA-STACK PRELIMINARY D ESC R IP T IO N : The D PS512X32V 3 "V ERSA -STA CK" module is a re v o lu tio n a ry n ew m e m o ry su b sy ste m u sing Dense-Pac Microsystems' ceramic Stackable Leadless

Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabit High Speed CMOS SRAM D PS512X 16C n 3/D P S512X 16B n 3 DESCRIPTIO N : The D P S 5 12 X 16Cn3/DPS512 X 16Bn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac M icrosystems' ceram ic Stackable Leadless Chip Carriers SLCC .

Contextual Info: □PM PS512X16A3 Dense-Pac Microsystems, Inc. CERAMIC 512KX 16 CMOS SRAM MODULE O PRELIMINARY D ESC R IP TIO N : The D PS512X16A3 "D EN SE-STA CK" module is a re v o lu tio n a ry n e w m e m o ry su b sy ste m using Dense-Pac Microsystems' ceramic Stackable Leadless

32A18

Contextual Info: DENSE-PAC 16 Megabit C M O S SRAM D PS512X32M L/D PS512X32M W M I C R O S Y S T E M S P R ELIM IN A R Y DESCRIPTION: PIN-OUT DIAGRAM The PS512X32ML/PS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

Contextual Info: «ffí 1 £ 1993 □PM D P S 5 1 2 X 1 6 n 3 Dense-Pac Microsystems, Inc. Ceramic, S12Kx16 SRAM Stack Modules O D E S C R IP T IO N : The D PS512X16n3 SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight

DPS512X32BV3

Contextual Info: PEN SE-PAC M IC R O SYS T \.i 16 Megabit High Speed CMOS SRAM MS D PS512X32 BV3 DESCRIPTION: The D P S 512X 32B V 3 "VE R S A -S TA C K ” m odule is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Lead less

Contextual Info: D E N S E -P A C 16 Megabit CMOS SRAM MICROSYSTEMS PS512X32V3 DESCRIPTION: The D PS512X32V3 'V E R S A -S T A C K " module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ mounted on a co-fired ceramic substrate. It offers

Contextual Info: □PM Dense-Pac Microsystems, Inc. PS512X32V3 ^ CERAMIC 512K X 32 C M O S SRAM VERSA-STACK PRELIM INARY DESCRIPTION: The PS512X32V3 "VERSA-STACK" module is a revo lutio nary new mem ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

Contextual Info: DENSE-PAC 8 Megabit High Speed CMOS SRAM MICROSYSTEMS PS512X 16Cn3/PS512X 16Bn3 DESCRIPTION: The PS512X16Cn3/PS512X16Bn3 High Speed SRAM “ STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .

Contextual Info: □PM PS512X16AA3 Dense-Pac Microsystems. Inc. HIGH SPEED CERAMIC 512K X 16 CMOS SRAM MODULE O ADVANCED INFORMATION DESCRIPTION: The PS512X16AA3 "DEN SE-STACK" module is a revolutionary new high speed mem ory subsystem using Dense-Pac M icrosystem s' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired

1431 T

Abstract: 56TAL
Contextual Info: DENSE-PAC 16 Megabit CM O S SRAM M I C R O S Y S T E M S D P S 5 1 2 X 3 2 M L /D P S 5 12 X 3 2 M W PR ELIM IN A R Y D ESCRIPTIO N : P IN -O U T DIAGRAM The PS512X32M L/PS512X 32M W is a 512K x 32 high density, high-speed Static Random Access M em ory SRAM module, intended

48-PIN

Contextual Info: REFERENCE SIZE SRAM 1 M egabit PART NUMBER 3 M egabit SPEED ns PACKAGE 128Kx8 7 0 ", 85, 100, 120, 150 32-Pin D IP 32-Pin F LA T P A C 15 128Kx8, 64Kx16, 32Kx32 25, 35, 45, 55, 70 66-Pin P G A 23 2 0 *, 25, 30, 35, 45 48-Pin SLC C 48-Pin ° r Lead 48-Pin y Lead

Contextual Info: DENSE-PAC 8 M egabits CMOS SRAM PS512X16n3 M I C R O S Y S T E M S D ESCRIPTIO N : The PS512X16n3 SRAM “ ST A C K" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, " J " leaded