PAL22YP10C Search Results

Contextual Info: PAL22V10C PAL22YP10C CYPRESS Features • • 10 u ser-p rogram m a b le o u tpu t m acrocells U ltra h igh speed su p p orts tod ay’s and tom orrow ’s fa stest m icrop rocessors — O u tp u t p olarity con trol — tpD — 6 ns — R egistered or co m b in a to ria l

P10CF-10PC

Contextual Info: PAL22V10CF _ PAL22VP10CF ^ SEMICONDUCTOR Features • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpo = 7.5 ns — t§u = 3 ns — fM AX — 2 new feedback paths PAL22VP10CF • Synchronous PRESET, asynchronous

L22V10C-10PC

Contextual Info: PAL22V10C PAL22VP10C y CYPRESS Universal PAL Device B iC M O S process and Ti-W fuses, the PAL22V10C and PAL22VP10C use the fam iliarsum -of-products A N D -O R logic structure and a new concept, the program ­ m able m acrocell. • 10 user-programmable output

PAL22V10C-7JC

Abstract: 22V10C 22V10C-10 CERAMIC LEADLESS CHIP CARRIER PAL22V10C-10JC K73 Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC PAL22V10C10DC PAL22V10C7JC PAL22VP10C-10JC
Contextual Info: PAL22V10C PAL22VP10C CYPRESS • 10 user-programmable output macrocells — Output polarity control — Registered or combinatorial operation — 2 new feedback paths PAL22VP10C • Synchronous PRESET, asynchronous RESET, and PRELOAD capability for flexible design and testability

22V10C

Abstract: PAL22V10C-7DC
Contextual Info: — . _ PAL22V10C _ PAL22VP10C SEMICONDUCTOR Features • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 6 ns — tsu = 3 ns — fMAX = 117 MHz • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­

Contextual Info: PAL22V10CF PAL22VP10CF CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 7.5 ns — tsu = 3 ns — f\lA X = 100 MHz — Drives 50-pF load C l — 2 new feedback paths (PAL22VP10CF) • Synchronous PRESET, asynchronous