MLF33Q Search Results

MIC28300

Abstract: MIC2026A
Contextual Info: BCD 0.5 micron Process OPERATING LIFE @ TA = +125C at max Operating Voltage Lds 8 8 8 8 Vcc Qty Act Hrs Fails Act Hrs Fails +5.5V +5.5V +5.5V +5.5V 77 77 77 77 168 168 168 168 1000 1000 1000 1000 MLF33Q MLF33Q 16 16 +75V +75V 77 77 168 161 1034 1000 9A16638MNG

Contextual Info: SPECIFICATION NO. REV. 2300-0011 A DOCUMENT TITLE: THERMAL CHARACTERISTICS OF MICREL IC ASSEMBLY OWNER: PACKAGE ENGINEER REQUIRED APPROVALS: PACKAGE ENGINEER DIRECTOR OF PACKAGING AND SUBCONTRACT ENGINEERING RELIABILITY MANAGER QUALITY VP AFFECTED PARTY NOTIFICATION: DO NOT INCLUDE REGULAR DISTRIBUTION

Contextual Info: CMOS CSI 0.5 micron Process OPERATING LIFE @ TA = +125C AT RATED VOLTAGE 7/14/2010 Device MIC2003 1.2YM5 MIC2004 0.8YM5 MIC2005A 1YM6 MIC2005A 2YM6 MIC2005A 1YM6 MIC2005A 2YM6 MIC2005M 0.8YM5 MIC2005M 0.5YM6 MIC2005 0.5BM6 MIC2006 1.2BM6 MIC2007 YM6 MIC2007 YM6

sumitomo g770

Abstract: SY56016 MIC69103 MIC44F18 0722L G770 sumitomo G770 MIC5318 MIC94069 MIC5232
Contextual Info: UNISEM MLF Lead Free Package Rel Data NiPdAu Plating - Green Compound Sumitomo G770 High Temperature Storage Life +150 deg C, 1000 hours Device Lot No Pkg MSL Soak Date Code SS # Reject Hrs. MIC94060 YML 3A23056MNF MLF1216D-4 L1 0610 76 1000 MIC5319 2.9YML

56mm carrier tape

Abstract: EIA 481 TSSOP EIA-481-B MLF22D-06L SOIC-18 SY100EP140LZI MSOP-10 SOIC-14 SOIC-16 SOIC-20
Contextual Info: Packaging for Automatic Handling Tape & Reel, Tape Strip and Ammo Pack General Description Tape & Reel Surface mount and TO-92 devices are available in tape and reel packaging. Surface mount components are retained in an embossed carrier tape by a cover tape. TO-92 device leads are

KSZ8041

Abstract: LM2576 MTBF vcsel spice model MIC4129 mic44r22 ksz8692 MICREL MIC marking DFB laser diode spice model KSZ9021RLI KSZ8041TLI
Contextual Info: Military Catalog May 2009 Dear Valued Customer, Micrel is an enduring DSCC certified company that has, for many years, provided Mil-Std-883B products in hermetic ceramic packages. We have also provided products governed by source controlled drawings SCD where baseline control is important. Our in-house, U.S.-based wafer

LQFP-128L

Abstract: LQFP128L
Contextual Info: SPECIFICATION NO. REV. 2000-0026 M DOCUMENT TITLE: SMD PACKAGE MOISTURE SENSITIVITY TABLE OWNER: RELIABILITY MANAGER REQUIRED APPROVALS: RELIABILITY MANAGER QUALITY MANAGER SR. PRODUCT ENGINEERING MANAGER PLANNING AND LOGISTICS DIRECTOR WW TEST OPERATIONS MANAGER

LD33 VOLTAGE REGULATOR

Abstract: LD33 VOLTAGE REGULATOR 3.3v NIKKO NR 9600 LD33 regulator TRANSISTOR si 6822 LD50 VOLTAGE REGULATOR st LD33 smd code marking ld33 LD33 VOLTAGE REGULATOR ST ld33 st
Contextual Info: Shortform Catalog January 2004 Micrel Semiconductor • 1849 Fortune Drive • San Jose, CA 95131 • USA • tel +1 408 944-0800 • fax +1 408 944-1000 Micrel Shortform Catalog January 2004 2004 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any

LD33 VOLTAGE REGULATOR

Abstract: LD33 regulator LD33 VOLTAGE REGULATOR 3.3v LD33 SOT 223 LD33 LD33 SOT223 Analog Marking Information LD50 VOLTAGE REGULATOR LD33 marking SOT223 marking ld33
Contextual Info: Packaging for Automatic Handling — Tape & Reel General Description Tape & Reel Surface mount and TO-92 devices are available in tape and reel packaging. Surface mount components are retained in an embossed carrier tape by a cover tape. TO‑92 device leads are secured

Contextual Info: Reportable Substances in Components Package Type : QFN33 Component Weight : Document No : QFN33-16LD-GRN-RS-3 Process Type : Standard D/A & NiPdAu Lead Finish 0.0224 grams 3.0mmx3.0mm Lead #: No 1 2 3 4 5 6 7 16LD Material Molding Compound Copper Alloy Frame