efuse OTP
Abstract: schematic diagram of bluetooth receiver FUJITSU single mosfet FUJITSU mosfet efuse rf sampler bluetooth transceiver MOSFET 90nm
Text: RFCMOS Case Study: Orca Systems’ 1st-pass Functional Silicon Success with Fujitsu CMOS 90nm Technology “When you’re designing a new type of digital architecture, it’s vital to know that final silicon will match simulation results. The results we got with Fujitsu’s 90nm PDK are
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SMS-CS-21356-12/2009.
efuse OTP
schematic diagram of bluetooth receiver
FUJITSU single mosfet
FUJITSU mosfet
efuse
rf sampler
bluetooth transceiver
MOSFET 90nm
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12v inverter
Abstract: 90nm 90nm ROM Etch Microelectronics 90nm cmos CS101SN CS101 10-Layer CHIP IPS serdes hsif
Text: 90nm CMOS Standard Cell CS101 ASIC Series High-performance transistors • Advanced lithography and etch technology to achieve 40nm gate length • Low temperature process for shallow junction • Process optimization for high carrier mobility 9Cu/1Al interconnect
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CS101
10-layer
CS101HU
WFS-FS-20164-9/2004
12v inverter
90nm
90nm ROM
Etch Microelectronics
90nm cmos
CS101SN
CHIP IPS
serdes hsif
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fujitsu transistor
Abstract: 90nm CMOS RF circuit and its application RF TRANSISTOR fujitsu ic wireless 65nm lte demodulator CMOS lan transistor
Text: Fujitsu RF CMOS David Fung Fujitsu Microelectronics America, Inc. November 2008 RF CMOS Announcement Highlights The Fujitsu 65nm and 90nm RF CMOS process technologies Advanced analog and RF device process design kit RF CMOS technology platform for consumer, wireless and
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Flip-chip 1.8V SRAM
Abstract: 65nm 65nm sram CS200 CS100 CS200A cmos logic 90nm
Text: 65nm CMOS Technology, CS200 / CS200A Description As miniaturization of silicon devices progresses, Fujitsu provides the most competitive, world-class technology to ASIC and COT customers. Fujitsu's 65nm technology has shrunk gates by 25% when compared to the 90nm technology.
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CS200
CS200A
CS100
CS200)
WFS-FS-21139-9/2005
Flip-chip 1.8V SRAM
65nm
65nm sram
CS200A
cmos logic 90nm
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4DPA
Abstract: "network interface cards"
Text: GIGA090 90nm Single Port Embeddable Gigabit Ethernet Transceiver Data Brief Main features • Fully standards compliant: IEEE 802.3, IEEE 802.3u, IEEE 802.3z and IEEE 802.3ab ■ Advanced Cable Diagnostic Features: – hard fault detection – Inter pair short
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GIGA090
1000BASE-T
100BASE-TX
100BASETX
10BASE-T
GIGA090
4DPA
"network interface cards"
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soc toshiba
Abstract: 90 nm CMOS soc 1044 TC280 B707 cmos logic 90nm 90-nm CMOS standard cell library process technology toshiba transistors selection guide TOSHIBA
Text: 2003-2 PRODUCT GUIDE BCE0012A 90nm Ldrawn=70nm CMOS ASIC TC300 Family 2003 http://www.semicon.toshiba.co.jp/eng SoC Solution for a Wide Range of UltraHigh-Performance and Ultra-Low-Power Applications TC300 Family Features and Benefits Ultra-High Density and Ultra-Low Power
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BCE0012A
TC300
90-nm
70-nm-drawn
F-93561,
soc toshiba
90 nm CMOS
soc 1044
TC280
B707
cmos logic 90nm
90-nm CMOS standard cell library process technology
toshiba transistors selection guide
TOSHIBA
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GIGA090
Abstract: "network interface cards"
Text: GIGA090 90nm Single Port Embeddable Gigabit Ethernet Transceiver Data Brief Main features • Fully standards compliant: IEEE 802.3, IEEE 802.3u, IEEE 802.3z and IEEE 802.3ab ■ Advanced Cable Diagnostic Features: – hard fault detection – Inter pair short
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GIGA090
1000BASE-T
100BASE-TX
GIGA090
"network interface cards"
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NT5DS32M16CS-5T
Abstract: NT5DS64M8CS-5T NT5DS32M16CS nt5ds32m16cs-6k NT5DS64M8CG-5T NT5DS64M8CS-5TI NT5DS128M4CS-5T NT5DS128M4CS-6K DDR400 NT5DS64M8CG
Text: NT5DS32M16CS NT5DS64M8CS / NT5DS64M8CG NT5DS128M4CS 512Mb DDR SDRAM Feature z DLL aligns DQ and DQS transitions with CK transitions z DDR 512M bit, Die C, based on 90nm design rules z Double data rate architecture: two data transfers per clock cycle
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NT5DS32M16CS
NT5DS64M8CS
NT5DS64M8CG
NT5DS128M4CS
512Mb
NT5DS32M16CS-5T
NT5DS64M8CS-5T
NT5DS32M16CS
nt5ds32m16cs-6k
NT5DS64M8CG-5T
NT5DS64M8CS-5TI
NT5DS128M4CS-5T
NT5DS128M4CS-6K
DDR400
NT5DS64M8CG
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Untitled
Abstract: No abstract text available
Text: NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary Features • • • • • CAS Latency and Frequency CAS Latency 3 Maximum Operating Frequency MHz DDR400 (5T) 200 • DDR 512M bit, Die C, based on 90nm design rules • Double data rate architecture: two data transfers per
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NT5DS128M4CG
512Mb
DDR400
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Pseudo SRAM
Abstract: No abstract text available
Text: Low Power Pseudo SRAM 4 M Words x 16 bit CS26LV64163 Revision History Rev. No. History Issue Date 1.0 Initial issue Jan.19, 2007 1.1 Upgrade wafer process from 0.13um to 90nm Dec. 18, 2009 1 Rev 1.1 Chiplus reserves the right to change product or specification without notice.
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CS26LV64163
CS26LV64163
150uA
200us
Pseudo SRAM
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P1U4GR30CT-G45CA
Abstract: No abstract text available
Text: PowerFlash P1U4GR30CT 4G bit AG-AND Flash Memory Rev.1.01 Aug.21.2006 Description The P1U4GR30CT achieves a write speed of 5.6 Mbytes/sec, using 90nm process technology and AG-AND Assist Gate-AND type Flash memory cell using multi level cell technology provides both the most cost effective
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P1U4GR30CT
P1U4GR30CT
P1U4GR30CT-G45CA
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CS26LV64173
Abstract: No abstract text available
Text: Low Power Pseudo SRAM 4 M Words x 16 bit CS26LV64173 Revision History Rev. No. 1.0 History Issue Date 1. New Release. Mar.27, 2013 2. Product Process change from 90nm to 65nm 3. The device build in Power Saving mode as below : 3-1. Deep Power Down DPD 3-2. Partial Array Refresh (PAR)
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CS26LV64173
CS26LV64173
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Untitled
Abstract: No abstract text available
Text: Intel Pentium® M Processor on 90nm Process with 2-MB L2 Cache Datasheet May 2004 Order Number: 302189-001 IINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
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CS26LV64163
Abstract: cs26lv64163 data
Text: Low Power Pseudo SRAM 4 M Words x 16 bit CS26LV64163 Revision History Rev. No. History Issue Date 1.0 Initial issue Jan.19, 2007 1.1 Upgrade wafer process from 0.13um to 90nm Dec.18, 2009 1.2 Add the package dimensions: D2 and E2 Aug.26, 2010 1 Rev 1.2 Chiplus reserves the right to change product or specification without notice.
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CS26LV64163
CS26LV64163
cs26lv64163 data
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BCM54980
Abstract: 1000BASE-T 90 nm CMOS 100BASE-FX 90nm cmos
Text: BCM54980 OCTAL-PORT 10/100/1000BASE-T GIGABIT ETHERNET TRANSCEIVER SUMMARY OF BENEFITS FEATURES • Eight 10BASE-T/100BASE-TX/1000BASE-T Gigabit Ethernet GbE transceivers in a single fully integrated 90-nm CMOS chip • Energy efficient, low-cost, and low-power octal-port
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BCM54980
10/100/1000BASE-T
10BASE-T/100BASE-TX/1000BASE-T
90-nm
BCM54980
54980-PB201-R
1000BASE-T
90 nm CMOS
100BASE-FX
90nm cmos
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CS200
Abstract: 65nm DDR PHY ASIC HDMI to lvttl cmos logic 90nm DAC 90nm CS200A 65-NM UHS SD Card Hdmi to micro usb wiring
Text: 65nm CMOS Standard Cell Leakage Current Large CS200 ASIC Series Server/ Network Low Power Power Low Lineup Lineup CS200LL CS200A HV-Tr DHV-Tr HS-Tr Mo C Mobile STD-Tr STD-Tr LL-Tr Computing High End Server HighHigh Performance Performance Lineup LineupCS200HP
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CS200
CS200LL
CS200A
CS200HP
CS200
12-layer
10-bit
33MS/s
1110MS/s
65nm
DDR PHY ASIC
HDMI to lvttl
cmos logic 90nm
DAC 90nm
CS200A
65-NM
UHS SD Card
Hdmi to micro usb wiring
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SGMII
Abstract: BCM54981 100BASE-FX 90-nm BCM5498
Text: BCM54981 Brief OCTAL-PORT 10/100/1000BASE-T GIGABIT ETHERNET TRANSCEIVER SUMMARY OF BENEFITS FEATURES • Eight 10BASE-T/100BASE-TX/1000BASE-T Gigabit Ethernet transceiver in a fully integrated 90 nm CMOS single chip • Energy efficient, low-cost, and low-power octal-port
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BCM54981
10/100/1000BASE-T
10BASE-T/100BASE-TX/1000BASE-T
54981-PB00-R
SGMII
BCM54981
100BASE-FX
90-nm
BCM5498
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Untitled
Abstract: No abstract text available
Text: BCM54980 OCTAL-PORT 10/100/1000BASE-T GIGABIT ETHERNET TRANSCEIVER SUMMARY OF BENEFITS FEATURES • Eight 10BASE-T/100BASE-TX/1000BASE-T Gigabit Ethernet Transceiver in a fully integrated 90 nm CMOS single chip • Energy efficient, low-cost, and low-power octal-port integration
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BCM54980
10/100/1000BASE-T
10BASE-T/100BASE-TX/1000BASE-T
100BASE-FX
BCM54980
54980-PB200-R
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180-nm CMOS standard cell library inverter
Abstract: 130 nm CMOS standard cell library 45-nm CMOS standard cell library process technology 45 nm library CS200A 130nm 130-nm CMOS standard cell library inverter S/130 nm CMOS standard cell library SEM 2006 CS201
Text: Fujitsu @ 65nm: Providing Solutions through Integrated Design Services The Fujitsu Advantage…Not Just a Foundry Contents Benefits of leading-edge technology at 65nm Challenges Solutions Fujitsu Microelectronics America, Inc. 2 FSA Semiconductor Forum, June 14, 2006
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130nm
180-nm CMOS standard cell library inverter
130 nm CMOS standard cell library
45-nm CMOS standard cell library process technology
45 nm library
CS200A
130-nm CMOS standard cell library inverter
S/130 nm CMOS standard cell library
SEM 2006
CS201
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varactor flip chip
Abstract: CMOS Stacked RF INtermétal
Text: ▼ The Fujitsu Analog and RF CMOS Technology Description Building on Fujitsu’s expertise in leading-edge CMOS processes and analog design capabilities, the company’s RF CMOS technologies are optimized for wireless networks, cellular communication, WiMAX, digital multi-media
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100GHz.
WFS-FS-21329-11/2008
varactor flip chip
CMOS Stacked RF
INtermétal
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Transmeta
Abstract: 10G CX4 MBF200 "lattice semiconductor" 44 codec MB86V01 mission cyrus 007B FUJITSU FRAM OFDM-256 0.18um structured ASIC
Text: Fujitsu Microelectronics America, Inc. Executive Briefing Growing Through Innovation and IDM Leadership September 22, 2004 Fujitsu Microelectronics America, Inc. 9/22/04 1 Program • • • • Introduction Emi Igarashi Corporate Overview Ken Iida Products Update
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MBF200
IDB1394
Transmeta
10G CX4
"lattice semiconductor" 44 codec
MB86V01
mission cyrus
007B
FUJITSU FRAM
OFDM-256
0.18um structured ASIC
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130NM cmos process parameters
Abstract: 90 nm CMOS C6416 TMS320C6000 TMS320C6416 90nm cmos cmos logic 90nm nmos 130nm
Text: Chasing Moore’s Law with 90-nm: More Than Just a Process Shrink By Ray Simar, Manager of Advanced DSP Architecture In the electronics industry, the term “process shrink” is often used to refer to when a semiconductor company migrates an existing design to a smaller process technology.
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90-nm:
720-MHz
TMS320C6416
C6416
130-nm
90-nm
130NM cmos process parameters
90 nm CMOS
TMS320C6000
90nm cmos
cmos logic 90nm
nmos 130nm
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hdd spindle motor
Abstract: hdd motor SoC hdd L7207 eTQFP-64 ST smooth hdd motor controller Hard Disk spindle motor 1. Mobile Computing architecture Hard Disk Drive voice coil ST
Text: Smart solutions for hard disk drive applications A full portfolio of IP for hard disk drive manufacturers STMicroelectronics, a world leader in hard disk drive HDD and system-on-chip (SOC) solutions, offers a complete intellectual property (IP) portfolio to supply HDD
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L7207
eTQFP-64
L7208
FLHDD1206
hdd spindle motor
hdd motor
SoC hdd
L7207
eTQFP-64
ST smooth
hdd motor controller
Hard Disk spindle motor
1. Mobile Computing architecture
Hard Disk Drive voice coil ST
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Untitled
Abstract: No abstract text available
Text: Mobile Intel Pentium® 4 Processor Supporting Hyper-Threading Technology on 90-nm Process Technology Datasheet September 2004 Document Number: 302424-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
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90-nm
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