Untitled
Abstract: No abstract text available
Text: 10 EB CKT VOID PIN S IZ E LOCATION .250 6.35 REF 3.05 .100 2.54 .020 eb- •I20 J J 0.5 I 34 t PIN PUSHOUT FORCE <.9072KG /2LBS MIN. PIN S O LD E R A B ILITY PER MOLEX SPEC. E S - 152 PRODUCT SPEC: PS - 70246 AP PLIE S . WAFER TO BE FLA T WITHIN 0.03MM/CM) 0 .0 0 3 IN / IN
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9072KG
03MM/CM)
SD-70247-3464
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MOLEX 5 pin
Abstract: ES-152
Text: 10 PART NUMBER A CKT SIZE DIM A DIM B DIM C DIM 08 7.62 14.73 17.78 15.24 70247-08* NOTES: D 17.27 20.32 17.78 70247-12* 10 12 10.16 1. PIN PUSHOUT FORCE .9072KG /2LBS MIN. 2. PIN SOLDERABILITY PER MOLEX SPEC. ES-152. 12.70 19.81 22.86 20.32 3. PRODUCT SPEC: PS-70246 APPLIES.
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SDA-70247-*
MOLEX 5 pin
ES-152
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Untitled
Abstract: No abstract text available
Text: 10 R0.51 T Y P NOTES: 1. PIN PUSHOUT FORCE .9072KG1/2LBS MIN. 6.10 ±0.38 2. PIN S O LD E R A B ILIT Y PER MOLEX SPEC. ES-152. (9,27 3. PRODUCT SPEC: PS-702Z6-100 AP P LIE S . A. W A F E R TO BE F L A T WITHIN .003 MM/MM. 5. DIMENSIONS FOR P LATIN G LOCATION:
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9072KG1/2LBS
ES-152.
PS-702Z6-100
SDA-70246-*
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Untitled
Abstract: No abstract text available
Text: 10 H 1 4± 0 .0 5 T Y P R0.51 T Y P i 6.10 ±0.38 -O <>- > o -I-0 8 « > -0 -0 2.54 ±0.05CLOSED S L0 T 2.54 ±0.05 T Y P (NON-ACCUM MOLEX IR ELA N D PRODUCTION ONLY RECOMMENDED PCB HOLE LA Y O U T (OPTION) NOTES: 1. PIN PUSHOUT FORCE <.9072KG)/2LBS MIN.
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9072KG
ES-152.
SDA-70246-*
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Untitled
Abstract: No abstract text available
Text: 10 6 1 2 .200 5 | 4 | | 3 1 2 1 VOIDED PIN LOCATION S 1 KINKED PIN LOCATION(S) PART NO. CKT SIZE 7 0 2 4 7 - I065 I0 0 .4 0 0 / IO. I6 0 . 6 8 0 / I7.27 0 .8 0 0 /2 0 .3 2 0 .7 0 0 /1 7 .7 8 CKT * 11, * I4 NONE 7 0 2 4 7 - I465 I4 0 . 6 0 0 / I5.24 0 .8 8 0 /2 2 .3 5
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SD-70247-*
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Untitled
Abstract: No abstract text available
Text: 10 ASSEMBLY PART NO. A CKT SIZ E c VOIDED PIN LOCATION S D KINKED PIN LOCATION(S) 70247-1455 I4 .600/15.24 .880/22.35 1.000/25.40 .900/22.86 CKT #9 NONE 70247-2655 26 1.200/30.48 1.480/37.59 1.600/40.64 1.500/38.10 CKT *9 NONE 70247-3455 34 1.600/40.64 1.880/47.75
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9072KG
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Untitled
Abstract: No abstract text available
Text: 10 CKT SIZE r .050 1.27 r E— — PIN * 2 — -, \ I0 0 2.54 J u / . / i I 11 J I .250 6.35 _ -0 2 0 J 0.5 I A B 1.600/40.64 34 C 1.880/47.75 D 2 .0 0 0 /5 0 .8 0 1.900/48.26 R TYP RECOMMENDED P.C. BOARD HOLE LAYOUT •I00+.002 2.54±0.05 ' T T 1 / .045±.002w TYP
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9072KG1/2LBS
03MM/CM)
SD-70246-*
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cm 6807
Abstract: 343T S200-20 ES-88 ASSY 411 s20040 ES-152
Text: .250 RECOMMENDED P.C. BOARD HOLE LAYOUT 8.55 .020 0.5 .27 R TYP DWG. NO. S T YP .350 -S3 El 8.89 ^ - . IPO _54±0.05 TYP NON CUM 2.54 100 FILE 2.54 SEE CAD .240+.0 15 •162 .180 2.54 6.1010.58 NOTE 5B ;E E NOTE 5A ' 4 .1 s .365 7.1 9.27 D c 08 0 .3 0 0 /7 .6 2
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345utn
40uln
I00uln
cm 6807
343T
S200-20
ES-88
ASSY 411
s20040
ES-152
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lt 9306
Abstract: ST 9306
Text: S D ,70246-*76 DWG-N0- c 70246- 1076 10 0.400/ 10. 16 0.680/ 17.27 0.800/20.32 0.700/ 17.78 2 & 10 70 24 6- 20 76 20 0.900/22.86 1.180/29.97 1.300/33.02 1.200/30.48 2 & 20 70 24 6- 26 76 26 1.200/30.48 1.480/37.59 1.600/40.64 1.500/38.10 2 & 26 70246- 34 76
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S7024676
9072KG
S4M272
lt 9306
ST 9306
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Untitled
Abstract: No abstract text available
Text: 10 CKT S IZ E ASSEM BLY P A R T NO. A - 7 0 2 4 6 - 0818 -C .050 -D - 1.27 " .0 4 5 +.QQ2, - 0 - .100 I 2.54 .020 0.51 .250 .350 6.35 8.89 2.54 ±0.05 .100 R TYP- 2.54 RECOMMENDED P .C . BOARD HO LE LA Y O U T H j_i 4.11 .082 ±.010 2 .0 8 ± 0.25 .240 ±.015
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SDA-70246-*
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ES-152
Abstract: No abstract text available
Text: 10 CKT SIZE .250 VOID S CKT NO. 20 13 A c B 0 .9 00 /2 2 .8 6 1.180/29.97 D 1.300/33.02 1.200/30.48 .020 R TYP 0.5 I RECO M M EN DED P.C. BO A RD HOLE LAYO U T •I00±.0Q2 2.54±0.05 ,045±.002 _ _ TYP. 1.14±0.05 i_ 2.54 C)- 200 SEE NOTE 5B & 6 5.08
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9072KG
ES-152
PS-70246
03MM/CM)
75uin
SD-70247-*
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16 pin ic 3810
Abstract: No abstract text available
Text: 10 ,2 5 0 ± .0 I0 | - Y - I SEE NOTE , I— •240±.0 15 6.I0 ±0 .3 8 5.08 I— PLATING OPTION PART NO. TIN/LEAO 70246-1015 .40 0/10 .16 .6 8 0 /1 7 .2 7 .8 0 0 /2 0 .3 2 .7 0 0 /1 7 .7 8 02,10 TIN/LEAO 70246-1615 .7 0 0 /1 7 .7 8 .9 8 0 /2 4 .8 9 1.100/27.94
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SD-70246-*
16 pin ic 3810
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Untitled
Abstract: No abstract text available
Text: 10 .250 6.35 •A- .050 1.27 PIN _ -020 J ■c- f2 — 0.51 R TYP PART NO. CKT SIZE A B D VOID PIN 70246-4074 40 2.300/58.42 1.900/48.26 2.200/55.1 2.180/55.37 20 70246-2074 20 1.300/33.02 .900/22.86 1.200/30.48 1.180/29.97 20 70246-4003 40 2.300/58.42 1.900/48.26
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9072KG
ES-152
PS-70246
SD-70246-*
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Untitled
Abstract: No abstract text available
Text: 10 STATUS .250±.0 IQ ,_ , •6 .3 5 *0 .2 5 'EE] - ' REF .02 0 0.5 I CKT SIZE T 7 0 2 4 6 -3 4 6 5 34 T 7 0 2 4 6 -3 5 6 5 34 T 7Q 246-4065 40 T 70246-3417 34 T 70246-3517 34 T 70246-4017 40 R TYP. 0.6 4±0 .03 -0 - I 0 . 0 1 0 / 0 . ASSEMBLY PART NO.
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Untitled
Abstract: No abstract text available
Text: 10 CKT SIZE 26 1.200/30.48 1.480/37.59 1.600/40.64 1.500/38. IO 70247-4062 40 1.900/48.26 2.180/55.37 2.300/58.42 2.200/55.88 m .250 6.35 •050 1.27 ' c ASSEMBLY PART NO. 70247-2661 A D VOIDED PIN LOCATION S CKT * I8 CKT *2! ■I20±.0I0 3.05±0.25 ■350
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9072KG
03MM/CM)
SD-70247-*
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Untitled
Abstract: No abstract text available
Text: 10 CKT SIZE DIM A DIM B DIM C DIM 7 0 2 4 7 -0 8 * * 08 7.62 14.73 17.78 15.24 7 0 2 4 7 -1 0 * 10 10.16 17.27 20.32 17.78 7 0 2 4 7 -1 2 * 12 12.70 19.81 22.86 20.32 7 0 2 4 7 -1 4 * 14 15.24 22.35 25.40 22.86 4. WAFER TO BE FLAT WITHIN .003 MM/MM. 7 0 2 4 7 -1 6 *
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SDA-70247-*
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Untitled
Abstract: No abstract text available
Text: 10 .250 ' 6.35 •I20±.0I0 3.05±.25 L r .100 2.54 .050 I.27 RECOMMENDED P .C . BOARD HO LE LA Y O U T J r ■045±.002, QTYP 1.14±0.05 / 1 .350 8.89 « J ■I00±.0Q2 2 .5 4 ± 0 .0 5 ■I00±.0Q2 2.5 4±0 .05 TYP NON CUM 100 2.54 .200 ,24 0 ± .0 I5
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SDAX-70247-*
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Untitled
Abstract: No abstract text available
Text: 10 R TYP. • 025±-0 0 ' 0.64±0.03 -0 -I0 . CKT SIZE 7 02 4 6- 2 0 13 20 0.9 00 /2 2 .8 6 1.180/29.97 1.300/33.02 1.200/30.48 CKT *14 2 & 20 70246-26 I 3 26 1.2 00 /3 0.4 8 1.480/37.59 1.600/40.64 1.500/38.10 CKT *9 2 & 26 70246-34 I 3 34 1.600/40.64 1.880/47.75
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SD-70246-*
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